Veeco’s Laser Spike Annealing (LSA) System Selected by Leading Semiconductor Memory Company for Advanced DRAM Evaluation

Rhea-AI Summary

Veeco (NASDAQ: VECO) announced an evaluation shipment of its laser spike annealing (LSA) system to a leading semiconductor memory company for advanced DRAM R&D. The shipment expands Veeco's presence in the DRAM market and is positioned as a step toward high-volume manufacturing (HVM) adoption for next-generation DRAM and high bandwidth memory (HBM).

The evaluation is expected to last about one year, with follow-on orders anticipated in 2027 and beyond. Veeco says the LSA platform delivers high-temperature, millisecond annealing with reduced thermal budgets and claims market-leading performance and cost of ownership. Yole projects HBM market CAGR at ~30% through 2030, reaching about $100B annualized.

Positive

• Evaluation shipment to a leading DRAM company
• Evaluation period of approximately one year
• Follow-on orders expected in 2027 and beyond
• HBM market projected CAGR of ~30% to 2030 (~$100B)

Negative

• None.

Insights

Memory market strategy analyst

Evaluation shipment to a tier‑1 memory customer increases Veeco's DRAM/HBM market credibility and could lead to production orders in 2027.

Veeco's selection for an evaluation by a "leading semiconductor memory company" validates its LSA platform as relevant to advanced DRAM and HBM process flows. The announcement describes a ~one year evaluation followed by expected follow‑on orders in 2027, which creates a clear milestone path from R&D testing toward potential high‑volume manufacturing adoption.

Key dependencies and risks include the outcome of the evaluation, integration into the customer's process window, and successful demonstration of the claimed throughput and thermal control. The statement ties adoption to technical fit rather than contractual commitment, so the commercial impact hinges on acceptance at the end of the evaluation.

Watch for three monitorable items: completion of the one year evaluation, any formal purchase orders or supply agreements announced in 2027, and reported performance metrics or customer endorsements. Expect meaningful commercial clarity by the end of the evaluation period.

Veeco Strengthens Position in Tier 1 Memory Market with Evaluation Shipment

PLAINVIEW, N.Y., Dec. 01, 2025 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) today announced that a leading semiconductor memory company has selected Veeco’s laser spike annealing (LSA system) for evaluation in its advanced DRAM R&D group. This shipment marks an expansion of Veeco’s penetration into the DRAM market and represents a significant step toward high-volume manufacturing (HVM) adoption for next-generation DRAM and high bandwidth memory (HBM) technologies. The evaluation period is expected to take around one year, with follow-on orders expected in 2027 and beyond.

“Our LSA platform is engineered to meet the rigorous demands of advanced DRAM and HBM production by providing higher productivity and superior performance,” said Adrian Devasahayam, Ph.D., Veeco’s Senior Vice President, Product Line Management. “This evaluation shipment underscores our commitment to enabling cutting-edge memory technologies, while providing an opportunity to expand our footprint in the memory market with this major customer.”

LSA is a millisecond annealing technology used in front-end semiconductor manufacturing to lower the resistance of key transistor structures by activating dopants. Veeco’s LSA system is capable of high-temperature annealing while staying within reduced thermal budgets of advanced devices at leading-edge nodes. The system delivers market-leading performance and best-in-class cost of ownership, making it a preferred solution for advanced memory applications. As the demand for HBM and DRAM continues to rise—driven by AI workloads and next-generation computing, Veeco’s LSA technology is positioned to support the evolving needs of tier 1 semiconductor manufacturers.

The HBM market is experiencing rapid growth, with Yole market research estimating that the market will grow at a compound annual growth rate (CAGR) of nearly 30% through 2030, reaching $100B or more in annualized revenues.

About Veeco
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our proven ion beam, laser spike annealing, lithography, MOCVD and single wafer etch & clean technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit https://www.veeco.com        

Veeco Contacts:
Investor Relations: Alex Delacroix | (516) 528-1020 | adelacroix@veeco.com
Media: Brenden Wright | (410) 984-2610 | bwright@veeco.com

FAQ

What did Veeco (VECO) announce on December 1, 2025 regarding DRAM?

Veeco shipped an LSA system for evaluation to a leading semiconductor memory company for advanced DRAM R&D.

How long is the Veeco LSA evaluation for VECO and when are follow-on orders expected?

The evaluation is expected to take about one year, with follow-on orders anticipated in 2027 and beyond.

What is Veeco’s LSA system designed to do for DRAM and HBM production (VECO)?

LSA uses millisecond annealing to activate dopants, enabling high-temperature anneals within reduced thermal budgets for advanced nodes.

Does the Veeco announcement guarantee high-volume manufacturing orders for VECO?

No — the shipment is for an evaluation; the company expects follow-on HVM orders only after the evaluation period.

How could the HBM market outlook cited in the Veeco release affect VECO demand?

The release cites Yole forecasting HBM market CAGR of ~30% through 2030, which the company positions as supportive of LSA demand.

What timeline should investors watch for VECO revenue impact from this DRAM evaluation?

Investors should monitor the one-year evaluation and potential follow-on orders expected starting in 2027.