Veeco’s Laser Spike Annealing (LSA) System Selected by Leading Semiconductor Memory Company for Advanced DRAM Evaluation

Rhea-AI Summary

Veeco (NASDAQ: VECO) announced an evaluation shipment of its laser spike annealing (LSA) system to a leading semiconductor memory company for advanced DRAM R&D. The shipment expands Veeco's presence in the DRAM market and is positioned as a step toward high-volume manufacturing (HVM) adoption for next-generation DRAM and high bandwidth memory (HBM).

The evaluation is expected to last about one year, with follow-on orders anticipated in 2027 and beyond. Veeco says the LSA platform delivers high-temperature, millisecond annealing with reduced thermal budgets and claims market-leading performance and cost of ownership. Yole projects HBM market CAGR at ~30% through 2030, reaching about $100B annualized.

Positive

• Evaluation shipment to a leading DRAM company
• Evaluation period of approximately one year
• Follow-on orders expected in 2027 and beyond
• HBM market projected CAGR of ~30% to 2030 (~$100B)

Negative

• None.

News Market Reaction

-0.62%

1 alert

-0.62% News Effect

On the day this news was published, VECO declined 0.62%, reflecting a mild negative market reaction.

Data tracked by StockTitan Argus on the day of publication.

Key Figures

Evaluation period: around one year Follow-on orders timeline: 2027 and beyond HBM market CAGR: nearly 30% +2 more

5 metrics

Evaluation period around one year Duration of DRAM R&D LSA system evaluation

Follow-on orders timeline 2027 and beyond Expected timing for potential high-volume LSA orders

HBM market CAGR nearly 30% Yole forecast CAGR for HBM market through 2030

HBM market size $100B or more Yole estimate for annualized HBM revenues by 2030

Forecast horizon 2030 End year of Yole’s HBM market forecast period

Market Reality Check

Price: $32.97 Vol: Volume 1,130,389 vs 20-da...

high vol

$32.97 Last Close

Volume Volume 1,130,389 vs 20-day average 672,890 (relative volume 1.68x) shows elevated trading interest ahead of this news. high

Technical Shares at $32.28 are trading above the 200-day MA of $23.72 and sit 6.3% below the 52-week high of $34.45.

Peers on Argus

VECO was roughly flat (-0.12%) while key peers like PLAB (+5.93%), ACMR (+3.20%)...

VECO was roughly flat (-0.12%) while key peers like PLAB (+5.93%), ACMR (+3.20%), UCTT (+1.19%) and DQ (+1.17%) traded higher, with COHU down (-1.31%). This points to a more stock-specific setup than a broad sector move.

Historical Context

5 past events · Latest: Dec 01 (Positive)

Pattern 5 events

Date	Event	Sentiment	Move	Catalyst
Dec 01	DRAM LSA shipment	Positive	-0.6%	LSA system evaluation shipment to leading DRAM maker for HBM/DRAM R&D.
Nov 05	Q3 2025 earnings	Negative	-1.0%	Revenue and EPS declined year on year with softer Q4 outlook range.
Nov 05	GaN MOCVD order	Positive	+1.4%	Propel®300 MOCVD order for 300mm GaN-on-Si power device production.
Oct 28	Packaging tool orders	Positive	-0.9%	Multiple wet processing and lithography orders for advanced packaging.
Oct 22	Earnings call notice	Neutral	-2.6%	Announcement of Q3 2025 results release and conference call timing.

Pattern Detected

Operational and order-related positives have often seen mixed or negative next-day reactions, while weaker earnings aligned with share pressure.

Recent Company History

Over the last few months, Veeco reported softer Q3 2025 financials with revenue of $165.9M and lower GAAP and non‑GAAP EPS, and outlined a pending all‑stock merger with Axcelis. At the same time, it announced multiple tool wins across GaN power devices, advanced packaging, and silicon photonics, plus the current LSA evaluation win in DRAM/HBM. Despite these strategic wins, several news days, including this LSA shipment on Dec 1, 2025, saw negative 24‑hour price reactions.

Market Pulse Summary

This announcement highlights Veeco’s push deeper into tier 1 DRAM and HBM with a laser spike anneali...

Analysis

This announcement highlights Veeco’s push deeper into tier 1 DRAM and HBM with a laser spike annealing evaluation at a leading memory maker. The roughly one‑year trial positions its LSA tools for potential high‑volume use in a HBM market Yole forecasts at nearly 30% CAGR to $100B+ by 2030. In context of softer Q3 results and a pending Axcelis merger, investors may watch for conversion of this evaluation into follow‑on orders and clearer visibility on memory‑related revenue.

Key Terms

laser spike annealing, dram, high bandwidth memory, annealing, +2 more

6 terms

laser spike annealing technical

"Veeco’s laser spike annealing (LSA system) for evaluation in its advanced DRAM R&D group."

A manufacturing technique that uses very short, intense laser pulses to heat tiny areas of a silicon wafer so implanted impurities become electrically active and damage from earlier steps is repaired, while leaving the rest of the chip cool. Think of it like ironing a single wrinkle quickly without heating the whole shirt. For investors, it matters because the process helps produce faster, lower‑power, and higher‑yield chips, affecting product performance, factory costs, and competitiveness in the semiconductor market.

dram technical

"selected Veeco’s laser spike annealing (LSA system) for evaluation in its advanced DRAM R&D group."

A dram is a small, traditional unit used to measure either mass or liquid volume in manufacturing and pharmaceuticals — roughly 1.77 grams for a weight dram or about 3.7 milliliters for a fluid dram, similar to a small teaspoon or a couple of drops. Investors care because dram-based measurements affect drug dosing, packaging sizes, labeling compliance and raw-material usage, which in turn influence production costs, inventory counts and regulatory risk.

high bandwidth memory technical

"for next-generation DRAM and high bandwidth memory (HBM) technologies."

High bandwidth memory (HBM) is a type of computer memory built by stacking chips vertically and placing them very close to a processor so large amounts of data can move much faster and use less power than with traditional memory. For investors, HBM matters because it can noticeably raise the speed and efficiency of data-center, AI and graphics products, influencing a maker’s competitiveness, product value, production cost and market demand—similar to a faster highway letting more trucks deliver goods per hour.

annealing technical

"LSA is a millisecond annealing technology used in front-end semiconductor manufacturing"

Annealing is a controlled process that changes the internal structure of a material or molecular system to improve performance: in manufacturing it typically means heating and then slowly cooling metals, glass or semiconductor layers to relieve stress and make them stronger or more reliable, while in molecular biology it means bringing complementary strands of DNA or RNA together so they stick in the right places. Investors should care because annealing affects product quality, manufacturing yield, device reliability and the accuracy of biological tests—factors that influence costs, revenue and regulatory outcomes much like reshaping or neatly fastening parts improves a finished product.

dopants technical

"to lower the resistance of key transistor structures by activating dopants."

Dopants are tiny amounts of another element or chemical deliberately added to a material to change its physical or electrical behavior, for example making a semiconductor conduct electricity better or altering a battery’s capacity. Think of them like a pinch of salt that changes how a dish behaves: small in quantity but able to change performance, cost, manufacturing yield and regulatory scrutiny, so they can materially affect a product’s competitiveness and a company’s financial prospects.

thermal budgets technical

"high-temperature annealing while staying within reduced thermal budgets of advanced devices"

Thermal budgets are the total heat exposure a material or device receives during manufacturing or use, combining how hot it gets and for how long. They matter to investors because excessive or poorly controlled heat can change performance, cause defects or shorten lifespan, affecting production yield, warranty costs and regulatory risk—think of it like a cooking recipe where temperature and time determine whether the dish succeeds or fails.

AI-generated analysis. Not financial advice.

Veeco Strengthens Position in Tier 1 Memory Market with Evaluation Shipment

PLAINVIEW, N.Y., Dec. 01, 2025 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) today announced that a leading semiconductor memory company has selected Veeco’s laser spike annealing (LSA system) for evaluation in its advanced DRAM R&D group. This shipment marks an expansion of Veeco’s penetration into the DRAM market and represents a significant step toward high-volume manufacturing (HVM) adoption for next-generation DRAM and high bandwidth memory (HBM) technologies. The evaluation period is expected to take around one year, with follow-on orders expected in 2027 and beyond.

“Our LSA platform is engineered to meet the rigorous demands of advanced DRAM and HBM production by providing higher productivity and superior performance,” said Adrian Devasahayam, Ph.D., Veeco’s Senior Vice President, Product Line Management. “This evaluation shipment underscores our commitment to enabling cutting-edge memory technologies, while providing an opportunity to expand our footprint in the memory market with this major customer.”

LSA is a millisecond annealing technology used in front-end semiconductor manufacturing to lower the resistance of key transistor structures by activating dopants. Veeco’s LSA system is capable of high-temperature annealing while staying within reduced thermal budgets of advanced devices at leading-edge nodes. The system delivers market-leading performance and best-in-class cost of ownership, making it a preferred solution for advanced memory applications. As the demand for HBM and DRAM continues to rise—driven by AI workloads and next-generation computing, Veeco’s LSA technology is positioned to support the evolving needs of tier 1 semiconductor manufacturers.

The HBM market is experiencing rapid growth, with Yole market research estimating that the market will grow at a compound annual growth rate (CAGR) of nearly 30% through 2030, reaching $100B or more in annualized revenues.

About Veeco
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our proven ion beam, laser spike annealing, lithography, MOCVD and single wafer etch & clean technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit https://www.veeco.com        

Veeco Contacts:
Investor Relations: Alex Delacroix | (516) 528-1020 | adelacroix@veeco.com
Media: Brenden Wright | (410) 984-2610 | bwright@veeco.com

FAQ

What did Veeco (VECO) announce on December 1, 2025 regarding DRAM?

Veeco shipped an LSA system for evaluation to a leading semiconductor memory company for advanced DRAM R&D.

How long is the Veeco LSA evaluation for VECO and when are follow-on orders expected?

The evaluation is expected to take about one year, with follow-on orders anticipated in 2027 and beyond.

What is Veeco’s LSA system designed to do for DRAM and HBM production (VECO)?

LSA uses millisecond annealing to activate dopants, enabling high-temperature anneals within reduced thermal budgets for advanced nodes.

Does the Veeco announcement guarantee high-volume manufacturing orders for VECO?

No — the shipment is for an evaluation; the company expects follow-on HVM orders only after the evaluation period.

How could the HBM market outlook cited in the Veeco release affect VECO demand?

The release cites Yole forecasting HBM market CAGR of ~30% through 2030, which the company positions as supportive of LSA demand.

What timeline should investors watch for VECO revenue impact from this DRAM evaluation?

Investors should monitor the one-year evaluation and potential follow-on orders expected starting in 2027.