ACRONAME LAUNCHES USB3.2 SWITCH EXTENSION SOLUTION WITH ADVANCED POWER DELIVERY

Rhea-AI Summary

Acroname, a Valens Semiconductor company, has launched the USBExt3c, a 3-port switchable hub featuring USB3 and USB2 extension with advanced PoE and USB-C power delivery. The product combines Valens' HDBaseT and Acroname's BrainStem technologies to solve power delivery and negotiation challenges in USB-extended systems.

The solution enables extended USB connectivity beyond standard cable limitations, particularly beneficial for high-bandwidth devices like high-end cameras and storage devices. The product utilizes Acroname's BrainStem control platform and Valens VS6320 chipset, making USB a more professional-grade technology.

The USBExt3c will debut at Integrated Systems Europe (ISE) 2025 from February 4-7, 2025, at the HDBaseT Alliance booth #2M500. The product is compatible with AVI-SPL's Symphony platform and Sennheiser's TeamConnect Bar products.

Positive

• Launch of new product addressing market needs in USB extension and power delivery
• Integration of Valens' HDBaseT and Acroname's BrainStem technologies showing post-acquisition synergies
• Product compatibility with major industry platforms (AVI-SPL Symphony, Sennheiser TeamConnect Bar)

Negative

• None.

News Market Reaction – VLN

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+1.69% News Effect

On the day this news was published, VLN gained 1.69%, reflecting a mild positive market reaction.

Data tracked by StockTitan Argus on the day of publication.

BOULDER, Colo., Feb. 3, 2025 /PRNewswire/ -- Acroname, a Valens Semiconductor company, today announced that it has launched a new product, the USBExt3c, a 3-port switchable hub with dedicated point-to-point USB3 and USB2 extension, combined with advanced PoE and USB-C power delivery. The product allows AV installers and OEM product manufacturers to control, manage and extend USB devices, streamlining product deployment for industries such as machine vision, corporate, and education.

Leveraging both Valens' HDBaseT and Acroname's BrainStem technologies, the USB3Ext3c addresses the challenge of power delivery and negotiation in USB-extended systems. It allows users to manage an array of USB-based peripheral devices, extending past the short cable limitations of USB2 and USB3, without worrying about power negotiation. This is a significant benefit specifically for high-bandwidth devices, such as high-end cameras, storage devices, and devices requiring high-power charging (e.g., laptops).

The new product is based on Acroname's system automation control platform, BrainStem, which provides highly modular and scalable hardware and software tools, including tools for management of USB and USB-PD, used in OEM applications around the world. The product also leverages the Valens VS6320 chipset, the first ASIC-based high-performance extension solution for USB3.2.

"This product launch represents a significant step forward in making USB a professional-grade technology," said Justin Gregg, CEO of Acroname. "It enables our customers to achieve unprecedented reliability in their USB connections for robust and flexible system design."

"This exciting product is the result of significant synergies between our two companies and is precisely what we envisioned when we acquired Acroname," said Gili Friedman, Head of the Cross-Industry Business Unit at Valens Semiconductor. "By combining the robust HDBaseT standard with Acroname's BrainStem technology, Acroname is delivering cutting-edge solutions that push the boundaries of USB extension and power delivery."

The USBExt3c will be officially unveiled at Integrated Systems Europe (ISE) 2025 from Feb 4, 2025 – Feb 7, 2025, and will be on display at the HDBaseT Alliance booth #2M500. In addition, Acroname will also be demonstrating other robust USB solutions that maximize system visibility, which are compatible with AVI-SPL's Symphony platform and Sennheiser's TeamConnect Bar products.

See the product page for photos and more information.

Contact Lance Davies for more information or interviews: lance@acroname.com

About Valens Semiconductor

Valens Semiconductor (NYSE: VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY.

For more information, visit https://www.valens.com/.

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SOURCE Acroname

FAQ

What is the new USB extension product launched by Valens Semiconductor (VLN)?

Acroname, a Valens Semiconductor company, launched the USBExt3c, a 3-port switchable hub with USB3 and USB2 extension capabilities and advanced power delivery features.

When will Valens Semiconductor (VLN) showcase the USBExt3c at ISE 2025?

The USBExt3c will be showcased at Integrated Systems Europe (ISE) 2025 from February 4-7, 2025, at the HDBaseT Alliance booth #2M500.

What technologies does the new USBExt3c product from Valens (VLN) incorporate?

The USBExt3c incorporates Valens' HDBaseT technology, the VS6320 chipset, and Acroname's BrainStem control platform technology.

What market segments is Valens (VLN) targeting with the USBExt3c product?

The USBExt3c targets machine vision, corporate, and education sectors, specifically addressing needs for high-bandwidth devices like high-end cameras, storage devices, and devices requiring high-power charging.