MCNEX Launches Industry's First Automotive-Grade QHD Front-and-Rear Cameras over Unshielded Cables & Connectors, Based on Valens Semiconductor's VA7000 A-PHY Chipsets
Rhea-AI Summary
Valens Semiconductor (NYSE: VLN) and MCNEX jointly launched automotive-grade QHD front-and-rear cameras that stream 2560×1440 video over unshielded twisted pair (UTP) or low-cost coax using Valens' VA7000 A‑PHY chipsets.
Chipsets are in mass production and the first OEM start-of-production is expected in early 2027; MCNEX also introduced a 4K@60fps rear camera using VA7000 over shielded cabling.
Positive
- QHD video (2560×1440) over UTP/coax enabling higher-resolution imaging
- VA7000 chipsets are in mass production
- First OEM SoP expected early 2027
- 4K@60fps rear camera introduced for shielded-cable applications
Negative
- QHD over unshielded cabling primarily positioned for interior ADAS, limiting external camera use
- 4K rear requires shielded cabling, implying higher harness cost for that model
News Market Reaction – VLN
In the Feb 18 session, VLN gained 2.05%, reflecting a moderate positive market reaction.
Data tracked by StockTitan Argus on the day of publication.
Key Figures
Historical Context
| Date | Event | Sentiment | 24h Move | Catalyst |
|---|---|---|---|---|
| Jan 29 | Earnings date notice | Neutral | -0.6% | Announcement of date for Q4 and full-year 2025 financial results. |
| Jan 28 | Efficiency plan | Positive | -3.8% | Operational efficiency plan with workforce reduction and $5M annual savings. |
| Jan 12 | Investor conferences | Neutral | -6.8% | Participation in Needham and Oppenheimer virtual investor conferences. |
| Jan 06 | Auto design win | Positive | +1.3% | Fourth VA7000 MIPI A-PHY design win with premium Chinese-market OEM. |
24h Move is the share-price change in the day after each event; other market factors may also have contributed.
Recent news, including an efficiency plan and conference participation, has often been followed by modest to negative price reactions, while product/design-win news saw a small gain.
Over the last few months, Valens Semiconductor has focused on both cost structure and automotive growth. An operational efficiency plan with an expected $5 million annual expense reduction was announced on Jan 28, 2026, followed by scheduling of Q4 and full-year 2025 results for Feb 25, 2026. Earlier, the company secured its 4th VA7000 MIPI A-PHY design win with a premium automaker targeting SoP in 2027. The current MCNEX collaboration builds on that ADAS camera momentum in the automotive segment.
Key Terms
adas technical
mipi a-phy technical
utp technical
coax technical
hdbaset technical
AI-generated analysis. How Rhea-AI works. Not financial advice.
The cameras allow OEMs to reduce harness cost by operating over the simplest channels, including UTP and low-cost Coax, while retaining high-resolution imaging; MCNEX also introduces to market a 4K rear camera based on A-PHY
Unshielded cables and connectors present an attractive wire harness option for automotive OEMs, especially for interior ADAS applications such as front and rear cameras mounted inside the vehicle cabin; the Valens' VA7000 delivers multi-gig link speeds over these simple channels. By leveraging the high bandwidth and EMC robustness of the VA7000, based on the MIPI A-PHY standard technology, the MCNEX modules deliver reliable multigigabit performance over simple cables, making them ideal for next-generation front and rearview camera designs in cost-sensitive, high-volume vehicle platforms.
MCNEX is also releasing to market a new 4K, 60fps rear view camera that operates over shielded cabling, based on the Valens VA7000. These chipsets are already in mass production, with the first OEM vehicle production (SoP) expected in early 2027.
"MCNEX has a long history of delivering advanced imaging solutions to leading global automakers, and these new cameras are a natural next step in that journey," said Young Hyun Jeong, VP, Automotive BU at MCNEX. "By combining our camera expertise with Valens Semiconductor's VA7000 chipsets, we are giving OEMs strong options for front- and rear-facing cameras, and we're looking forward to sharing these solutions with our OEM customers and partners."
"Automakers are under pressure to increase sensor resolution and data bandwidth while controlling cost, weight, and most importantly, ensuring flawless performance and passenger safety," said Adar Segal, Head of Automotive Business at Valens Semiconductor. "The collaboration with MCNEX showcases how our VA7000 chipsets, based on MIPI A–PHY technology, enables multi–gigabit, long–reach links over the simplest cabling, including UTP and low-cost Coax. This offering will help OEMs scale to next–generation ADAS systems with higher image quality and more flexible cabling topologies."
About MCNEX
MCNEX is a leading global supplier of automotive camera modules and imaging solutions. The company develops and manufactures advanced camera systems for ADAS and autonomous driving applications, serving major automotive OEMs and Tier 1 suppliers worldwide. MCNEX is known for its expertise in optical design, image processing, and automotive-grade manufacturing. For more information, visit https://www.mcnex.com/.
About Valens Semiconductor
Valens Semiconductor (NYSE:VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit https://www.valens.com/.
Forward-Looking Statements
This press release includes "forward-looking statements" within the meaning of the "safe harbor" provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as "estimate," "plan," "project," "forecast," "intend," "will," "expect," "anticipate," "believe," "seek," "target" or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements include, but are not limited to, statements regarding our anticipated future results, including financial results, our five-year plan, currency exchange rates, and contract wins, and future economic and market conditions. These statements are based on various assumptions, whether or not identified in this press release, and on the current expectations of Valens Semiconductor's ("Valens") management and are not predictions of actual performance. These forward-looking statements are provided for illustrative purposes only and are not intended to serve as and must not be relied on by any investor as a guarantee, an assurance, a prediction or a definitive statement of fact or probability. Actual events and circumstances are difficult or impossible to predict and will differ from assumptions. Many actual events and circumstances are beyond the control of Valens Semiconductor. These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effect of inflation and a rising interest rate environment on our customers and industry; the ability of our customers to absorb inventory; competition in the semiconductor industry, and the failure to introduce new technologies and products in a timely manner to compete successfully against competitors; if Valens fails to adjust its supply chain volume due to changing market conditions or fails to estimate its customers' demand; disruptions in relationships with any one of Valens' key customers; any difficulty selling Valens' products if customers do not design its products into their product offerings; Valens' dependence on winning selection processes; even if Valens succeeds in winning selection processes for its products, Valens may not generate timely or sufficient net sales or margins from those wins; sustained yield problems or other delays or quality events in the manufacturing process of products; our ability to effectively manage, invest in, grow, and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to timely adjust product prices to customers following price increase by the supply chain; our ability to adjust our inventory level due to reduction in demand due to inventory buffers accrued by customers; our expectations regarding the outcome of any future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; our ability to successfully integrate or otherwise achieve anticipated benefits from acquired businesses; the market price and trading volume of the Valens ordinary shares may be volatile and could decline significantly; global political and economic uncertainty, including with respect to
Press Contacts
Yoni Dayan
Head of Communications
Valens Semiconductor Ltd.
Yoni.dayan@valens.com
Mark Prindle
Senior Account Executive
Fusion PR
Mark.prindle@fusionpr.com
Investor Contacts
Michal Ben Ari
Investor Relations Manager
Valens Semiconductor Ltd.
michal.benari@valens.com
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