Welcome to our dedicated page for Valens Semiconductor news (Ticker: VLN), a resource for investors and traders seeking the latest updates and insights on Valens Semiconductor stock.
Valens Semiconductor Ltd. (NYSE: VLN) is a high-performance connectivity company whose semiconductor chipsets are used across automotive, audio-video, industrial, machine vision, medical, education, and videoconferencing markets. The VLN news page on Stock Titan aggregates announcements, press releases, and third-party coverage related to the company’s technology, design wins, and corporate developments.
Recent news highlights include design wins for Valens’ VA7000 MIPI A-PHY-compliant chipsets with premium global automotive OEMs, where the devices are integrated into ADAS systems for vehicles serving the Chinese market. Other coverage features collaborations around MIPI A-PHY-enabled e-mirror solutions and machine vision platforms, demonstrating how Valens’ connectivity technology is applied in automotive imaging and industrial imaging ecosystems.
Investors and followers of VLN stock can use this news feed to track updates on Valens’ participation in industry events and conferences, such as investor conferences and the Consumer Electronics Show (CES), where the company showcases its connectivity solutions across automotive and professional audio-video markets. Press releases also discuss the broader MIPI A-PHY and HDBaseT standards ecosystems in which Valens plays a role.
The Valens Semiconductor news page is useful for monitoring topics such as automotive ADAS connectivity, MIPI A-PHY ecosystem progress, professional audio-video and videoconferencing applications, machine vision initiatives, and key corporate announcements filed on Form 6-K. Users researching VLN can review this stream to understand how the company’s connectivity technology is being adopted and where it is being demonstrated or discussed in the market.
Valens Semiconductor (NYSE:VLN) announced that its VA7000 chipsets are powering D3 Embedded's first-to-market MIPI A-PHY platform for embedded vision systems. The platform features NVIDIA Jetson Orin processors with 8 A-PHY input ports operating at 8Gbps, and six camera options based on Sony ISX031 sensors.
The A-PHY platform delivers exceptional EMI resilience, supports data transmission up to 30 meters, and operates over cost-effective Unshielded Twisted Pair (UTP) cabling. D3 Embedded's solution includes ruggedized IP69K camera enclosure options and built-in diagnostics for continuous system monitoring, targeting applications in robotics, industrial automation, and medical imaging.
Valens Semiconductor (NYSE: VLN) reported strong Q1 2025 financial results, with revenue reaching $16.8 million, exceeding both the company's guidance of $16.3-$16.6M and Q1 2024 revenue of $11.6M. The company demonstrated significant year-over-year growth and showed signs of market stabilization and recovery.
Key financial highlights include a robust GAAP gross margin of 62.9% and non-GAAP gross margin of 66.7%. The company maintained a strong financial position with $112.5 million in cash, cash equivalents, and short-term deposits at quarter-end.
Valens Semiconductor (NYSE: VLN) and ESWIN Computing have announced a strategic partnership to deliver MIPI A-PHY solutions to the Chinese automotive market. The collaboration will enable Chinese automakers to access locally manufactured, production-ready MIPI A-PHY chipsets for sensor and display connectivity.
MIPI A-PHY, the first automotive industry standard for high-speed sensor and display connectivity, has gained significant traction in China, with seven silicon vendors completing interoperability testing. Valens, a leader in MIPI A-PHY technology, offers the VA7000 Series chipsets and has secured OEM design wins.
The partnership combines Valens' A-PHY expertise with ESWIN Computing's local market knowledge and technological capabilities. ESWIN Computing will showcase their joint solutions at Auto Shanghai from April 23 - May 2, 2025.
Valens Semiconductor (NYSE: VLN), a leader in high-performance connectivity, has scheduled its first quarter 2025 financial results announcement for May 7, 2025, before market opening. The company will host a conference call at 8:30 a.m. ET on the same day, led by CEO Gideon Ben Zvi and CFO Guy Nathanzon.
The conference call will be accessible via multiple channels, including U.S. dial-in (+1-888-281-1167), UK (0-808-101-2717), and Israel (03-918-0610). A live webcast will be available through the company's investor relations website, with a replay option post-call.
Valens Semiconductor specializes in developing chipsets for audio-video installations, videoconferencing, and ADAS/autonomous driving applications. The company's technology serves as the foundation for industry standards like HDBaseT® and MIPI A-PHY.
Valens Semiconductor (NYSE: VLN) announced that its VA7000 MIPI A-PHY-compliant chipsets will be integrated into Mobileye EyeQ™6 High automated and autonomous driving production programs. Following extensive testing, Mobileye selected Valens' chipsets for their superior performance across various parameters.
The collaboration marks a significant milestone for MIPI A-PHY, the first automotive industry standard for high-speed sensor and display connectivity. The VA7000 chipsets will form the in-car, sensor to compute connectivity infrastructure for projects with global automotive brands.
Valens was the first company to offer A-PHY-compliant products with its VA7000 chipsets. The standard is specifically designed to meet next-generation ADAS requirements, enabling high-bandwidth, low-latency connectivity and enhanced passenger safety throughout the vehicle's lifecycle.
Valens Semiconductor (NYSE: VLN) has announced successful interoperability testing with seven MIPI A-PHY silicon vendors: Analogix, ESWIN Technology, Motorcomm, OmniVision Technologies, Silergy, SimChip, and Velink. This marks a important milestone for the adoption of A-PHY technology, particularly in China's robust ecosystem.
MIPI A-PHY is the first automotive industry standard for in-vehicle asymmetric high-speed connectivity. Valens, as the first company to offer compliant chipsets and achieve OEM design wins, conducted weeks-long testing events that demonstrated strong product maturity across all vendors.
The standardization aims to enhance supply chain security and reduce vendor dependency. China's ecosystem has shown particular interest, with vendors developing various A-PHY products including platforms, SoCs, silicon, camera sensors, and development tools in response to Chinese OEM demand.
Valens Semiconductor (NYSE: VLN) has announced a strategic partnership with RGo Robotics and CHERRY Embedded Solutions to enhance AI robotic systems design and deployment. The collaboration integrates RGo's Perception Engine, Valens' VA7000 MIPI A-PHY connectivity chipsets, and CHERRY's Rockchip-based hardware module.
The partnership addresses a key challenge in robotics: the short-range connectivity constraints of camera interfaces that typically force developers to place processing units next to cameras. Valens' MIPI A-PHY solution offers reliable high-bandwidth extension, allowing for centralized processing units over extended distances. This technology is particularly suited for machine vision applications including autonomous mobile robots (AMRs), edge perception systems, automated guided vehicles (AGVs), and service robots.
The joint solution will be demonstrated at Embedded World 2025 in Nuremberg, Germany, from March 11-13 at Hall 2, Booth #454.
Valens Semiconductor (NYSE: VLN) has announced its participation at Embedded World 2025, where it will showcase innovative connectivity technology for AI applications. The company will demonstrate two key standards: MIPI A-PHY for native CSI-2 interface extension and HDBaseT USB3 for USB 3.2 extension.
The demonstrations will be conducted in collaboration with industry partners including Leopard Imaging, Intel, and Teledyne e2v. Key highlights include AI platform connectivity infrastructure for NVIDIA, EMC technology demonstrations showing 20x better noise resistance, and solutions for high-speed, long-reach sensor connectivity.
Valens will present two sessions at the event: one focusing on connectivity innovations in the industrial market and another addressing challenges in medical industry's transition to disposable endoscopes. The event will take place from March 11-13 at Hall 2, Booth 454.