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Valens Semiconductor's VA7000 Chipsets Enable the Market's First MIPI A-PHY Platform for Embedded Vision by D3 Embedded

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Valens Semiconductor (NYSE:VLN) announced that its VA7000 chipsets are powering D3 Embedded's first-to-market MIPI A-PHY platform for embedded vision systems. The platform features NVIDIA Jetson Orin processors with 8 A-PHY input ports operating at 8Gbps, and six camera options based on Sony ISX031 sensors.

The A-PHY platform delivers exceptional EMI resilience, supports data transmission up to 30 meters, and operates over cost-effective Unshielded Twisted Pair (UTP) cabling. D3 Embedded's solution includes ruggedized IP69K camera enclosure options and built-in diagnostics for continuous system monitoring, targeting applications in robotics, industrial automation, and medical imaging.

Valens Semiconductor (NYSE:VLN) ha annunciato che i suoi chipset VA7000 alimentano la piattaforma MIPI A-PHY di D3 Embedded, la prima sul mercato per sistemi di visione embedded. La piattaforma integra processori NVIDIA Jetson Orin con 8 porte di ingresso A-PHY che operano a 8Gbps, e sei opzioni di telecamere basate su sensori Sony ISX031.

La piattaforma A-PHY offre un'eccellente resistenza alle interferenze elettromagnetiche (EMI), supporta la trasmissione dati fino a 30 metri e funziona su cavi Unshielded Twisted Pair (UTP) a basso costo. La soluzione di D3 Embedded comprende opzioni di custodie per telecamere rugged IP69K e diagnostica integrata per il monitoraggio continuo del sistema, rivolta ad applicazioni in robotica, automazione industriale e imaging medico.

Valens Semiconductor (NYSE:VLN) anunció que sus chipsets VA7000 están impulsando la plataforma MIPI A-PHY de D3 Embedded, la primera en el mercado para sistemas de visión integrados. La plataforma cuenta con procesadores NVIDIA Jetson Orin con 8 puertos de entrada A-PHY que operan a 8Gbps, y seis opciones de cámaras basadas en sensores Sony ISX031.

La plataforma A-PHY ofrece una excepcional resistencia a EMI, soporta transmisión de datos hasta 30 metros y funciona con cables de par trenzado sin blindaje (UTP) rentables. La solución de D3 Embedded incluye opciones de carcasas para cámaras robustas IP69K y diagnósticos integrados para monitoreo continuo del sistema, dirigida a aplicaciones en robótica, automatización industrial y imagen médica.

Valens Semiconductor (NYSE:VLN)는 자사의 VA7000 칩셋이 D3 Embedded의 시장 최초 MIPI A-PHY 임베디드 비전 시스템 플랫폼을 구동한다고 발표했습니다. 이 플랫폼은 NVIDIA Jetson Orin 프로세서와 8개의 A-PHY 입력 포트(각각 8Gbps 속도)를 갖추고 있으며, Sony ISX031 센서 기반의 6가지 카메라 옵션을 제공합니다.

A-PHY 플랫폼은 뛰어난 EMI 저항성을 제공하며, 최대 30미터까지 데이터 전송을 지원하고 비용 효율적인 UTP(언실드 트위스티드 페어) 케이블을 사용합니다. D3 Embedded의 솔루션은 IP69K 등급의 견고한 카메라 하우징 옵션과 내장 진단 기능을 포함하여 로봇공학, 산업 자동화, 의료 영상 분야에 적합합니다.

Valens Semiconductor (NYSE:VLN) a annoncé que ses chipsets VA7000 alimentent la plateforme MIPI A-PHY de D3 Embedded, la première sur le marché pour les systèmes de vision embarqués. La plateforme intègre des processeurs NVIDIA Jetson Orin avec 8 ports d'entrée A-PHY fonctionnant à 8Gbps, ainsi que six options de caméras basées sur des capteurs Sony ISX031.

La plateforme A-PHY offre une excellente résistance aux interférences électromagnétiques (EMI), supporte la transmission de données jusqu'à 30 mètres et fonctionne avec des câbles à paires torsadées non blindées (UTP) économiques. La solution de D3 Embedded comprend des options de boîtiers caméra robustes IP69K et un diagnostic intégré pour une surveillance continue du système, ciblant des applications en robotique, automatisation industrielle et imagerie médicale.

Valens Semiconductor (NYSE:VLN) gab bekannt, dass seine VA7000-Chipsätze die marktführende MIPI A-PHY-Plattform von D3 Embedded für Embedded-Vision-Systeme antreiben. Die Plattform verfügt über NVIDIA Jetson Orin Prozessoren mit 8 A-PHY-Eingangsports, die mit 8Gbps arbeiten, sowie sechs Kameraoptionen basierend auf Sony ISX031 Sensoren.

Die A-PHY-Plattform bietet eine hervorragende EMI-Resistenz, unterstützt Datenübertragungen bis zu 30 Metern und arbeitet mit kostengünstiger ungeschirmter Twisted-Pair-Kabel (UTP). Die Lösung von D3 Embedded umfasst robuste IP69K-Kamera-Gehäuseoptionen und integrierte Diagnostik für eine kontinuierliche Systemüberwachung, mit Anwendungen in Robotik, industrieller Automatisierung und medizinischer Bildgebung.

Positive
  • First market-ready MIPI A-PHY platform for embedded vision systems
  • High-speed data transmission capability of 8Gbps per port
  • Extended connectivity range up to 30 meters without signal degradation
  • Support for cost-effective Unshielded Twisted Pair (UTP) cabling
  • Strong EMI resilience for reliable performance in harsh environments
Negative
  • None.

Insights

Valens' VA7000 chipsets power first commercial MIPI A-PHY platform, expanding market reach in industrial and embedded vision applications.

Valens Semiconductor has achieved a significant market milestone with its VA7000 chipsets being integrated into D3 Embedded's new camera-to-processor MIPI A-PHY platform - the first product-ready solution for implementing this high-performance connectivity standard in embedded vision systems.

This development represents a strategic expansion of Valens' addressable market beyond its traditional automotive and audiovisual segments into industrial automation, robotics, and medical imaging applications. The MIPI A-PHY standard, which Valens helped develop, offers critical advantages for embedded vision systems: exceptional EMI resilience, long-distance data transmission (up to 30 meters), and compatibility with lower-cost unshielded twisted pair (UTP) cabling.

D3's platform integrates NVIDIA Jetson Orin processors with 8 A-PHY input ports operating at 8Gbps (7.2Gbps net) alongside Sony ISX031 sensors in the camera units. This creates a comprehensive ecosystem that significantly lowers barriers to A-PHY adoption for industrial customers seeking reliable high-speed connectivity in harsh environments.

The industrial-grade implementation, including optional IP69K ruggedized enclosures for cameras, positions this solution for deployment in demanding environments where conventional connectivity solutions struggle. Most importantly, this commercial platform validates Valens' technology in a new market segment and creates a ready-made implementation path for potential customers, potentially accelerating adoption of Valens' chipsets across multiple industries beyond their current core markets.

Product suite, including Nvidia processors and Sony sensors, are available for sale on the D3 Embedded website.

HOD HASHARON, Israel, July 15, 2025 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN) announced that its chipsets are the keystone connectivity solution for a comprehensive camera-to-processor MIPI A-PHY platform offered by D3 Embedded. The platform brings to market the first product-ready solution for implementing the high-performance A-PHY connectivity standard in embedded vision systems. The A-PHY platform offers D3's customers a series of unique benefits, including unparalleled EMI resilience, longer link distances, and the ability to operate over simple, low-cost cabling.

"D3 Embedded's comprehensive camera-to-processor platform is a practical, ready-to-deploy solution that significantly lowers the barrier to entry for companies looking to adopt A-PHY in their embedded vision systems," said Gili Friedman, Head of the Cross-Industry Business Unit at Valens Semiconductor. "Valens sees significant demand for MIPI A-PHY in this market, and we look forward to seeing how this collaboration between our companies will lead to broad adoption of A-PHY, changing the way embedded vision and AI systems are deployed across industries."

"A-PHY's ability to deliver high-speed data over long distances with exceptional electromagnetic compatibility is a game-changer for the industry," said Scott Reardon, CEO of D3 Embedded. "Investing in this technology was crucial because it addresses the key challenges our customers face - reliable connectivity in harsh environments and simplified system design, including the industry's first ever use of Unshielded Twisted Pair (UTP) channels for multi-gig use cases. By building this platform around MIPI A-PHY and partnering with Valens Semiconductor, we're giving developers a powerful, flexible toolset to accelerate innovation in embedded vision."

On the compute side of the platform, D3 Embedded is offering an NVIDIA® Jetson Orin processor (NX or Nano) and 8 A-PHY input ports. The platform has an option for an industrial, fanless enclosure, while each port operates at 8Gbps (7.2Gbps net). On the camera side, D3 Embedded is offering six A-PHY DesignCore® Discovery Series SKUs, all based on the Sony ISX031 sensor. Each camera is offered with an option for a ruggedized IP69K enclosure for the highest level of protection against dust, liquid, and chemicals. The IP69K camera features a removable, anti-reflective coated, and scratch-resistant lens cover for use in harsh environments. D3 Embedded can also develop custom cameras based on other sensors upon customer request. Explore D3 Embedded's A-PHY camera offerings here: https://www.d3embedded.com/product-category/camera-modules/?fwp_interface=mipi-a-phy

The MIPI A-PHY standard delivers outstanding Electromagnetic Compatibility (EMC) performance, ensuring reliable data transmission even in electrically noisy industrial environments. In addition, chipsets based on A-PHY technology enable high-speed data transmission over long cables - up to 30 meters and beyond - without degrading signal quality. These chips also support multi-gig connectivity over both Unshielded Twisted Pair (UTP) and micro-coaxial cabling, giving system designers the flexibility to balance cost, weight, and mechanical requirements according to their specific application needs. Finally, chipsets based on A-PHY offer built-in advanced diagnostics for link monitoring and preventive maintenance, ensuring 24/7 system operation. These advantages make A-PHY-based chipsets ideal for a wide range of applications, including robotics/AMR, industrial vehicles, industrial automation, and medical imaging, where long-reach, high-performance, and cost-effective connectivity is essential.

About Valens Semiconductor

Valens Semiconductor (NYSE:VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit https://www.valens.com/.

About D3 Embedded 

D3 Embedded is a U.S.-based company that develops end-to-end solutions integrating sensors, connectivity, embedded processing and AI to deliver advanced perception for performance-critical applications. Using its proven DesignCore® product platforms and stage-gate development process, D3 Embedded helps its customers minimize the cost, schedule, and technical risks of product development for performance-critical applications. D3 Embedded is an Elite member of the NVIDIA Partner Network, an Intel Gold Partner, and a premium member of Texas Instruments' third-party network. The company holds expertise in autonomous machines and robotics, electrification, sensing, imaging and optics, edge computing and detection algorithms. To support its products and services, the company offers ODM customization of hardware and software, validation testing and in-house manufacturing services. Learn more at www.D3Embedded.com

Forward-Looking Statements

This press release includes "forward-looking statements" within the meaning of the "safe harbor" provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as "estimate," "plan," "project," "forecast," "intend," "will," "expect," "anticipate," "believe," "seek," "target" or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements include, but are not limited to, statements regarding our anticipated future results, including financial results, our five-year plan, currency exchange rates, and contract wins, and future economic and market conditions. These statements are based on various assumptions, whether or not identified in this press release, and on the current expectations of Valens Semiconductor's ("Valens") management and are not predictions of actual performance. These forward-looking statements are provided for illustrative purposes only and are not intended to serve as and must not be relied on by any investor as a guarantee, an assurance, a prediction or a definitive statement of fact or probability. Actual events and circumstances are difficult or impossible to predict and will differ from assumptions. Many actual events and circumstances are beyond the control of Valens Semiconductor. These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effect of inflation and a rising interest rate environment on our customers and industry; the ability of our customers to absorb inventory; competition in the semiconductor industry, and the failure to introduce new technologies and products in a timely manner to compete successfully against competitors; if Valens fails to adjust its supply chain volume due to changing market conditions or fails to estimate its customers' demand; disruptions in relationships with any one of Valens' key customers; any difficulty selling Valens' products if customers do not design its products into their product offerings; Valens' dependence on winning selection processes; even if Valens succeeds in winning selection processes for its products, Valens may not generate timely or sufficient net sales or margins from those wins; sustained yield problems or other delays or quality events in the manufacturing process of products; our ability to effectively manage, invest in, grow, and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to timely adjust product prices to customers following price increase by the supply chain; our ability to adjust our inventory level due to reduction in demand due to inventory buffers accrued by customers; our expectations regarding the outcome of any future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; our ability to successfully integrate or otherwise achieve anticipated benefits from acquired businesses; the market price and trading volume of the Valens ordinary shares may be volatile and could decline significantly; global political and economic uncertainty, including with respect to China-Taiwan relations; political, economic, governmental and tax consequences associated with our incorporation and location in Israel; and those factors discussed in Valens' Form 20-F filed with the SEC on February 26, 2025 under the heading "Risk Factors," and other documents of Valens filed, or to be filed, with the SEC. If any of these risks materialize or our assumptions prove incorrect, actual results could differ materially from the results implied by these forward-looking statements. There may be additional risks that Valens does not presently know or that Valens currently believes are immaterial that could also cause actual results to differ from those contained in the forward-looking statements. In addition, forward-looking statements reflect Valens' expectations, plans or forecasts of future events and views as of the date of this press release. Valens anticipates that subsequent events and developments may cause Valens' assessments to change. However, while Valens may elect to update these forward-looking statements at some point in the future, Valens specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing Valens' assessment as of any date subsequent to the date of this press release. Accordingly, undue reliance should not be placed upon the forward-looking statements.

Press Contacts

Yoni Dayan
Head of Communications
Valens Semiconductor Ltd.
Yoni.dayan@valens.com

Hadley McKinnon
Senior Account Executive
Fusion PR
hadley.mckinnon@fusionpr.com

Investor Contacts

Michal Ben Ari
Investor Relations Manager
Valens Semiconductor Ltd.
michal.benari@valens.com

Photo: https://mma.prnewswire.com/media/2727803/ValensSemiconductor_Camera.jpg

 

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SOURCE Valens Semiconductor

FAQ

What is the significance of Valens Semiconductor's VA7000 chipsets in D3 Embedded's platform?

The VA7000 chipsets serve as the key connectivity solution in D3 Embedded's platform, enabling the first product-ready MIPI A-PHY implementation for embedded vision systems with 8Gbps data transmission and superior EMI resilience.

What are the key features of D3 Embedded's MIPI A-PHY platform?

The platform features NVIDIA Jetson Orin processors, 8 A-PHY input ports at 8Gbps, Sony ISX031 sensor-based cameras, optional IP69K ruggedized enclosures, and support for both UTP and micro-coaxial cabling.

How does the MIPI A-PHY platform benefit industrial applications?

The platform offers exceptional EMC performance, long-distance data transmission up to 30 meters, support for cost-effective UTP cabling, and built-in diagnostics for 24/7 operation monitoring in harsh industrial environments.

What markets is Valens Semiconductor (VLN) targeting with this A-PHY platform?

The platform targets markets including robotics/AMR, industrial vehicles, industrial automation, and medical imaging where long-reach, high-performance, and cost-effective connectivity is essential.

What camera options are available in D3 Embedded's A-PHY platform?

The platform offers six A-PHY DesignCore Discovery Series SKUs based on Sony ISX031 sensors, with options for ruggedized IP69K enclosures and custom camera development based on other sensors.
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