Valens Semiconductor to Showcase High-Performance Connectivity Innovations for AI Applications at Embedded World 2025

Rhea-AI Summary

Valens Semiconductor (NYSE: VLN) has announced its participation at Embedded World 2025, where it will showcase innovative connectivity technology for AI applications. The company will demonstrate two key standards: MIPI A-PHY for native CSI-2 interface extension and HDBaseT USB3 for USB 3.2 extension.

The demonstrations will be conducted in collaboration with industry partners including Leopard Imaging, Intel, and Teledyne e2v. Key highlights include AI platform connectivity infrastructure for NVIDIA, EMC technology demonstrations showing 20x better noise resistance, and solutions for high-speed, long-reach sensor connectivity.

Valens will present two sessions at the event: one focusing on connectivity innovations in the industrial market and another addressing challenges in medical industry's transition to disposable endoscopes. The event will take place from March 11-13 at Hall 2, Booth 454.

Positive

• Demonstration of superior EMC technology with 20x better noise resistance
• Strategic partnerships with major industry players including Intel and Teledyne
• Integration of two standard-compliant chipsets expanding market reach

Negative

• None.

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HOD HASHARON, Israel, March 10, 2025 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN), a leader in high-performance connectivity, today announced that it will display its innovative connectivity technology required for various AI applications at Embedded World 2025. Valens will display demonstrations in collaboration with a variety of companies, all offering the machine vision market cutting-edge solutions based on Valens' standard-compliant chipsets. These companies include Leopard Imaging, Acroname, Airy3D, Cherry Embedded Solutions, D3 Embedded, Fabrimex, Framos, Intel, RGo Robotics, and Teledyne e2v.

Two innovative connectivity standards, MIPI A-PHY and HDBaseT USB3, will take center stage at the Valens booth. MIPI A-PHY provides native extension of the widely-used CSI-2 interface, offering robotics developers the ability to separate processing from the perception sensors, which provides unprecedented design flexibility, cost-efficiency, and performance. HDBaseT USB3 provides the extension of USB 3.2, allowing leading camera vendors to extend their USB 3.2 product lines for applications requiring long link distances.

Demonstrations at Valens' booth will include:

The Ultimate Connectivity Infrastructure for NVIDIA – AI platforms, including AMR, robotic arms, and more.

EMC Technology Shootout – Valens chipsets withstand 20 times more noise in a live side-by-side EMC shootout against a competing legacy solution.

Simplest Wiring Infrastructure – Native CSI-2 extension based on the MIPI A-PHY standard, enabling high-speed, long-reach sensor connectivity over the most challenging connectors and cables.

Solving USB Challenges for Embedded Systems – Extension and test automation for the USB 3 protocol.

Valens will have two speaking opportunities at the show:

• How Can Connectivity Innovations Transform the Industrial Market?
  
  • March 11, 11:00-11:30AM CET
  • Session 1.1 IOT & Connectivity
• Addressing the Challenges in the Medical Industry's Transition to Disposable Endoscopes
  • March 11, 3:00 – 3:30PM CET
  • Session 6.1 Embedded Vision

"Valens' entry into machine vision is already shaking up the market, with two standard-compliant chipsets that offer transformative connectivity," said Moti Strobach, VP Business Development at Valens Semiconductor. "Our chipsets extend two of the most commonly used interfaces in the industry, allowing our customers and partners to reach new and exciting applications. We're proud to showcase our technology at Embedded 2025, and we welcome you to visit us at our booth."

Date: Mar. 11-13

Booth: Hall 2, 454

Schedule a demo tour with our experts and discover Valens' high-performance sensor connectivity.

About Valens Semiconductor

Valens Semiconductor (NYSE: VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit https://www.valens.com/.

Forward-Looking Statements

This press release includes "forward-looking statements" within the meaning of the "safe harbor" provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as "estimate," "plan," "project," "forecast," "intend," "will," "expect," "anticipate," "believe," "seek," "target" or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements include, but are not limited to, statements regarding our anticipated future results, including financial results, our five-year plan, currency exchange rates, and contract wins, and future economic and market conditions. These statements are based on various assumptions, whether or not identified in this press release, and on the current expectations of Valens Semiconductor's ("Valens") management and are not predictions of actual performance. These forward-looking statements are provided for illustrative purposes only and are not intended to serve as and must not be relied on by any investor as a guarantee, an assurance, a prediction or a definitive statement of fact or probability. Actual events and circumstances are difficult or impossible to predict and will differ from assumptions. Many actual events and circumstances are beyond the control of Valens Semiconductor. These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effect of inflation and a rising interest rate environment on our customers and industry; the ability of our customers to absorb inventory; competition in the semiconductor industry, and the failure to introduce new technologies and products in a timely manner to compete successfully against competitors; if Valens fails to adjust its supply chain volume due to changing market conditions or fails to estimate its customers' demand; disruptions in relationships with any one of Valens' key customers; any difficulty selling Valens' products if customers do not design its products into their product offerings; Valens' dependence on winning selection processes; even if Valens succeeds in winning selection processes for its products, Valens may not generate timely or sufficient net sales or margins from those wins; sustained yield problems or other delays or quality events in the manufacturing process of products; our ability to effectively manage, invest in, grow, and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to timely adjust product prices to customers following price increase by the supply chain; our ability to adjust our inventory level due to reduction in demand due to inventory buffers accrued by customers; our expectations regarding the outcome of any future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; our ability to successfully integrate or otherwise achieve anticipated benefits from acquired businesses; the market price and trading volume of the Valens ordinary shares may be volatile and could decline significantly; global political and economic uncertainty, including with respect to China-Taiwan relations; political, economic, governmental and tax consequences associated with our incorporation and location in Israel; and those factors discussed in Valens' Form 20-F filed with the SEC on February 26, 2025 under the heading "Risk Factors," and other documents of Valens filed, or to be filed, with the SEC. If any of these risks materialize or our assumptions prove incorrect, actual results could differ materially from the results implied by these forward-looking statements. There may be additional risks that Valens does not presently know or that Valens currently believes are immaterial that could also cause actual results to differ from those contained in the forward-looking statements. In addition, forward-looking statements reflect Valens' expectations, plans or forecasts of future events and views as of the date of this press release. Valens anticipates that subsequent events and developments may cause Valens' assessments to change. However, while Valens may elect to update these forward-looking statements at some point in the future, Valens specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing Valens' assessment as of any date subsequent to the date of this press release. Accordingly, undue reliance should not be placed upon the forward-looking statements.

Press Contacts
Yoni Dayan
Head of Communications
Valens Semiconductor Ltd.
Yoni.dayan@valens.com

Investor Contacts
Michal Ben Ari
Investor Relations Manager
Valens Semiconductor Ltd.
michal.benari@valens.com

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SOURCE Valens Semiconductor

FAQ

What new technologies will Valens Semiconductor (VLN) showcase at Embedded World 2025?

VLN will showcase MIPI A-PHY for CSI-2 interface extension and HDBaseT USB3 for USB 3.2 extension, focusing on AI applications and machine vision solutions.

How does Valens Semiconductor's (VLN) EMC technology perform against competitors?

VLN's chipsets demonstrate 20 times better noise resistance compared to competing legacy solutions in live EMC shootout demonstrations.

Which major companies are partnering with Valens (VLN) at Embedded World 2025?

VLN is partnering with Leopard Imaging, Acroname, Intel, Teledyne e2v, and several other companies to showcase machine vision solutions.

When and where will Valens Semiconductor (VLN) present at Embedded World 2025?

VLN will present on March 11, 2025, with sessions at 11:00 AM and 3:00 PM CET in Hall 2, Booth 454.