Company Description
Ceva, Inc. (NASDAQ: CEVA) is a semiconductor intellectual property company focused on signal processing, wireless communications, sensing and Edge AI technologies. The company operates as a licensor of silicon and software IP, providing processor cores, platforms and related technologies that semiconductor companies and original equipment manufacturers (OEMs) integrate into their own system-on-chip (SoC) designs. According to company disclosures, Ceva’s technologies are at the heart of smart edge products that connect, sense and infer data in real time.
Ceva describes itself as powering the Smart Edge by bridging the digital and physical worlds to bring AI-driven products to life. Its Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense and Infer, which the company highlights as essential capabilities for the intelligent edge. This portfolio spans wireless communications IP, sensing and signal-processing IP, and Edge AI accelerators, all intended to be licensed and embedded into customer chips rather than sold as standalone hardware.
Business model and revenue sources
Ceva’s business model centers on licensing its intellectual property to semiconductor companies and OEMs, and then earning licensing and related revenue as well as royalties on shipments of products that incorporate its IP. The company states that revenue is derived primarily from licensing fees and related revenue, and royalties generated from shipments of products utilizing its intellectual properties. In addition, Ceva engages in training and the sale of development systems that support customers in integrating and optimizing its IP within their designs.
Through these licensing relationships, OEMs and semiconductor companies choose to sell products incorporating Ceva technology into a variety of end markets. The company notes that its IP has shipped in more than 20 billion devices and is trusted by more than 400 customers worldwide, underscoring the breadth of its licensing footprint across the electronics industry.
Technology portfolio and focus areas
Ceva emphasizes a broad portfolio of IP that addresses three main functional pillars at the edge: connectivity, sensing and AI inference. In connectivity, the company highlights Bluetooth, Wi‑Fi, Ultra‑Wideband (UWB) and 5G platform IP for what it describes as ubiquitous, robust communications. This includes platforms such as Ceva‑PentaG Lite, which the company presents as a solution for implementing 5G modems optimized for RedCap and cellular IoT applications, and wireless connectivity IPs like Ceva‑Waves Bluetooth Low Energy 5.
On the sensing and signal-processing side, Ceva offers AI DSPs, sensor fusion processors and architectures such as SensPro AI DSP, which are described as optimized for sensor processing, AI inference and control algorithms. These technologies are used in applications such as LiDAR and radar pre‑processing, real‑time perception and sensor fusion in automotive advanced driver assistance systems (ADAS) and other edge AI workloads.
In Edge AI acceleration, Ceva provides Edge AI NPUs and NPU families such as NeuPro‑Nano, described as the company’s smallest and most power‑efficient embedded AI NPU, and the broader NeuPro NPU portfolio. These NPUs are designed to bring AI inference to AIoT and embedded devices, supporting applications like always‑on voice interfaces and keyword spotting when combined with ecosystem partners.
End markets and example applications
Ceva states that its technologies are deployed across a wide range of smart edge products. Examples referenced in company materials include AI‑infused wearables and smartwatches, IoT devices and smart‑home gateways, consumer electronics, autonomous vehicles, automotive telematics and ADAS platforms, and 5G mobile networks and infrastructure. In automotive, Ceva’s SensPro AI DSP has been selected for ADAS SoCs and integrated into real‑time processors for software‑defined vehicles, where it is used for sensor processing, predictive analytics, energy management and intelligent control.
In IoT and AIoT, Ceva’s wireless connectivity IP and AI processing platforms are used in Matter‑ready SoCs and other chipsets that combine Bluetooth Low Energy, multi‑protocol wireless, security and on‑device AI. The company also highlights use cases in smart home devices, industrial automation, robotics, drones and other edge AI applications where low‑power processing and integrated connectivity are important.
Smart edge and Physical AI positioning
Across its communications, Ceva consistently frames its role as enabling the smart edge and what it calls Physical AI—systems that are always connected, contextually aware and capable of intelligent, real‑time decision‑making. By providing IP that allows devices to connect to networks, sense their environment and run AI workloads locally, Ceva positions its portfolio as foundational for products that must operate efficiently at the edge rather than relying solely on cloud resources.
The company stresses attributes such as ultra‑low‑power performance, a small silicon footprint, and seamless integration into existing design flows as key characteristics of its IP. It also notes that its solutions are designed to offer flexibility so customers can combine different connectivity, sensing and AI components based on their design needs.
Corporate profile and stock information
Ceva identifies its headquarters as being in Rockville, Maryland, with a global customer base supported by operations worldwide. The company’s shares trade on the Nasdaq Global Select Market under the ticker symbol CEVA. In regulatory filings, Ceva describes itself as a licensor of signal‑processing intellectual property, with partnerships with semiconductor companies and OEMs globally.
As a public company, Ceva reports its financial results through quarterly and annual filings and related press releases. These disclosures show that the company reports revenue in two main categories—licensing and related revenue, and royalties—and discusses both GAAP and non‑GAAP metrics, including gross margin, operating income and net income, with reconciliations that adjust for equity‑based compensation, amortization of acquired intangibles and certain acquisition‑related costs.
Use of capital and financing activities
Ceva has used public equity offerings as a source of capital. For example, the company entered into an underwriting agreement to sell shares of its common stock pursuant to an effective shelf registration statement on Form S‑3. In related disclosures, Ceva stated that the principal purposes of such offerings include increasing financial flexibility, obtaining additional capital, increasing its public float, and funding potential acquisitions or investments in complementary technologies or businesses, as well as working capital, capital expenditures, share repurchases and other general corporate purposes.
ESG and corporate responsibility
In its communications, Ceva notes a commitment to being a responsible and respected global corporate citizen and a more sustainable company in the countries where it has operations and employees. The company references adherence to a Code of Business Conduct and Ethics, with an emphasis on environmental controls, resource conservation and recycling, and the welfare of employees.
How investors and analysts use information about Ceva
Investors and analysts evaluating Ceva typically look at the mix of licensing and royalty revenue, the number and nature of IP licensing agreements signed in a period, and indicators of adoption of its technologies in end markets such as wireless IoT, automotive, consumer and industrial applications. Company communications highlight milestones such as AI processor licensing contributing a meaningful portion of licensing revenue, record wireless IoT shipments, and strategic portfolio licenses with semiconductor companies as indicators of business progress.