BOS Semiconductors Selects Ceva's AI DSP for Next-Generation ADAS Platforms

Rhea-AI Summary

Ceva (NASDAQ: CEVA) announced that BOS Semiconductors has licensed Ceva's SensPro AI DSP for the Eagle-A standalone ADAS SoC on January 6, 2026. Eagle-A pairs a high-end NPU, CPU and GPU with dedicated camera, LiDAR, and radar interfaces to enable real-time sensor fusion and perception.

SensPro is described as optimized for LiDAR and radar pre-processing to reduce latency and improve power efficiency. BOS plans chiplet-based scalability—Eagle-A can work with the Eagle-N AI accelerator in multi-die configurations via UCIe and PCIe—and the Eagle series targets automotive ADAS plus edge AI uses such as robotics and drones.

Market Reality Check

$23.35 Last Close

Volume Volume 324,829 is 0.53x the 20-day average, suggesting limited pre-news activity. low

Technical Price 23.15 is trading just below the 200-day MA at 23.53.

Peers on Argus

CEVA gained 3.26% while key semiconductor peers were mixed: IMOS +1.48%, POET +1.92%, SKYT +8.68%, LAES -1.14%, AIP +1.95%, pointing to a stock‑specific AI/ADAS catalyst.

Historical Context

Date	Event	Sentiment	Move	Catalyst
Dec 05	Industry award	Positive	+1.2%	XC21 IoT DSP won Best IP/Processor of the Year at EE Awards Asia.
Nov 18	Equity offering priced	Negative	-14.5%	Priced 3,000,000‑share common stock offering at $19.50 with 450,000‑share option.
Nov 17	Equity offering launch	Negative	-4.0%	Announced commencement of 3,000,000‑share underwritten common stock offering.
Nov 17	Product award	Positive	-4.0%	NeuPro–Nano NPU received 2025 IoT Edge Computing Excellence Award.
Nov 13	Licensing deal	Positive	-8.5%	IntelPro licensed Ceva wireless IP for new IPRO7AI AIoT SoC platform.

Pattern Detected

Dilutive offerings have drawn negative reactions, while positive technology and partnership news has produced mixed outcomes, with several instances of the stock selling off despite favorable announcements.

Recent Company History

Over the last few months, CEVA has combined product wins, industry recognition, and capital raising. In mid‑November 2025, it launched a common stock offering at $19.50, which saw shares fall 14.5%. Earlier, technology wins like the IntelPro licensing deal on Nov 13, 2025 and IoT/edge awards did not consistently translate into gains, with some news-linked moves of -8.54% and -4.03%. Against this backdrop, today’s BOS Semiconductors AI/ADAS design win fits CEVA’s ongoing push into edge and automotive AI IP.

Market Pulse Summary

This announcement highlights CEVA’s SensPro AI DSP being chosen for BOS Semiconductors’ Eagle‑A ADAS SoC, targeting LiDAR and radar sensing and sensor fusion. It reinforces CEVA’s push into automotive and edge AI alongside prior NeuPro and Wi‑Fi 7 initiatives. Historically, AI‑tagged releases moved the stock around 2.44% on average. Investors may watch for additional automotive design wins, revenue traction from these IP licenses, and how ongoing losses reported in recent 10‑Q filings evolve over time.

Key Terms

ADAS technical

"As vehicles evolve toward software-defined architectures and complex ADAS, the industry is"

Advanced Driver Assistance Systems (ADAS) are electronic systems in vehicles that assist the driver with safety tasks. Examples include automatic emergency braking, lane keeping assist, and adaptive cruise control. These systems use sensors and cameras to improve vehicle safety.

System-on-Chip (SoC) technical

"has licensed its SensPro™ AI DSP architecture for the Eagle-A standalone ADAS System-on-Chip (SoC)."

A system-on-chip (SoC) is a single microchip that packs the main electronic components of a computer — such as the processor, memory, graphics and input/output controllers — that would otherwise be separate parts. Like a Swiss Army knife replacing multiple tools, an SoC reduces size, power use and manufacturing cost while shaping device performance and features, so investors watch it as a key driver of product competitiveness, margins and market share.

LiDAR technical

"interfaces for camera, LiDAR, and radar fusion. Ceva's SensPro AI DSP is optimized"

Lidar, which stands for Light Detection and Ranging, is a technology that uses laser beams to create detailed, three-dimensional maps of the environment. It works like a sophisticated eye that measures distances by bouncing light off objects, helping machines see and understand their surroundings. For investors, lidar is important because it enables advancements in autonomous vehicles, robotics, and mapping, which can drive innovation and growth in related industries.

GPU technical

"systems, combining a high-end NPU, CPU and GPU with dedicated sensing interfaces"

A GPU (graphics processing unit) is a specialized computer chip designed to handle many calculations at once, originally for rendering images and video but now widely used for tasks like artificial intelligence, data analysis and high-performance computing. Investors watch GPU demand and prices because strong sales often signal growth for chip makers and their customers, affect profit margins and capital spending, and can forecast wider trends in gaming, AI adoption and cloud services.

UCIe technical

"multi-die configurations connected via UCIe and PCIe. This approach enables OEMs"

UCIe (Universal Chiplet Interconnect Express) is an industry standard for connecting small processor or memory building blocks, called chiplets, inside a single package so they work together like parts of a single chip. For investors, it matters because it can lower manufacturing costs, speed product development, and enable more flexible, high-performance semiconductors—similar to using interchangeable Lego pieces instead of carving one large block—potentially affecting makers’ competitiveness and profit margins.

PCIe technical

"multi-die configurations connected via UCIe and PCIe. This approach enables OEMs"

PCIe (PCI Express) is a high-speed connection standard used inside computers and servers to link components like graphics cards, storage drives, and network adapters so they can send data quickly to each other. Investors care because faster, more efficient PCIe support can make a product more competitive—think of it as wider, faster highway lanes for data—which affects device performance, upgrade flexibility, manufacturing cost and customer demand.

edge AI technical

"Eagle series enables flexible deployment across edge AI applications beyond automotive, such as"

Edge AI refers to artificial intelligence systems that process data directly on local devices or nearby servers rather than sending information to distant data centers. This allows for faster decision-making and real-time responses, similar to how a home security camera can instantly detect motion without needing to connect to a remote server. For investors, edge AI represents a growing trend toward more efficient, responsive technology that can create new opportunities across various industries.

AI-generated analysis. Not financial advice.

Eagle-A leverages SensPro™ to accelerate LiDAR and radar sensing workloads for real-time perception and sensor fusion

LAS VEGAS , Jan. 6, 2026 /PRNewswire/ -- As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor processing, safety-critical intelligence, and physical AI to bridge perception and actuation. In line with this trend, Ceva, Inc. (NASDAQ: CEVA) today announced that BOS Semiconductors has licensed its SensPro™ AI DSP architecture for the Eagle-A standalone ADAS System-on-Chip (SoC).

Eagle-A is designed for advanced driver assistance and autonomous driving systems, combining a high-end NPU, CPU and GPU with dedicated sensing interfaces for camera, LiDAR, and radar fusion. Ceva's SensPro AI DSP is optimized for LiDAR and radar pre-processing, enabling efficient handling of raw sensor data and reducing latency in perception pipelines. BOS Semiconductors' chiplet strategy further enhances scalability, with Eagle-A designed to work alongside the Eagle-N AI accelerator in multi-die configurations connected via UCIe and PCIe. This approach enables OEMs to tailor compute performance for diverse ADAS and autonomous driving requirements. In addition, the modular design of BOS's Eagle series enables flexible deployment across edge AI applications beyond automotive, such as robotics and drones.

 "Eagle-A is a next-generation SoC developed with BOS' differentiated technology, delivering domain-level compute performance, safety, and scalability optimized for ADAS applications. Ceva's SensPro AI DSP plays an important role in realizing these design goals and is expected to efficiently support complex sensing workloads," said Jason Chae, Chief Sales & Marketing Officer at BOS Semiconductors. He added, "Eagle-A integrates data from cameras, LiDAR, and radar in real time to enable accurate perception for autonomous driving, further reinforcing BOS' competitiveness in automotive AI."

"BOS Semiconductors is driving a bold vision for next-generation ADAS, and we're proud to support that journey," said Yaron Galitzky, Executive Vice President, AI Division at Ceva. "Their adoption of SensPro underscores the critical role of AI DSPs for advanced sensing in ADAS and strengthens Ceva's position in the rapidly expanding automotive market. This collaboration is highly synergistic with our AI and sensing capabilities, enabling safer, smarter vehicles."

Ceva's SensPro architecture is optimized for sensor processing, AI inference, and control algorithms, delivering exceptional performance per watt while meeting the stringent power and safety requirements of automotive applications. For more information, visit https://www.ceva-ip.com/product/ceva-senspro2/

About BOS Semiconductors
Founded in 2022 by Dr. Jaehong Park, former Executive Vice President at Samsung Foundry, BOS Semiconductors is a Korea-based fabless company pioneering next-generation system-on-chip (SoC) solutions for the automotive industry. With operations in Korea, Vietnam, Germany, and the United States, the company is powered by a team of senior engineers with over 20 years of experience, who have successfully led multiple global SoC projects. BOS has been officially recognized by the Korean government as a National Strategic Technology Enterprise and was recently selected as the lead organization for the national R&D project "AI Accelerator Semiconductor Development for Software-Defined Vehicles (SDV)."

The company is currently developing the Eagle-N AI Accelerator and the Eagle-A one-chip ADAS SoC, driving innovation in automotive AI and intelligent mobility for the era of software-defined vehicles. For more information, visit https://www.bos-semi.com/.

About Ceva, Inc.
Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.

With more than 20 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today's most advanced smart edge products - from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra–low–power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva's IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.

Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.

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SOURCE Ceva, Inc.

FAQ

What did CEVA announce on January 6, 2026 about BOS Semiconductors and Eagle-A?

CEVA said BOS licensed its SensPro AI DSP for the Eagle-A ADAS SoC to support LiDAR and radar preprocessing and sensor fusion.

How does SensPro benefit Eagle-A ADAS performance for CEVA (CEVA)?

SensPro is optimized for sensor preprocessing and inference to reduce latency and improve performance per watt for LiDAR and radar workloads.

What interfaces and chiplet links are included in BOS Eagle-A referenced in the CEVA announcement?

Eagle-A supports camera, LiDAR, and radar interfaces and is designed to work with Eagle-N via UCIe and PCIe in multi-die configurations.

Will the BOS Eagle series be used beyond automotive according to CEVA's release?

Yes; the announcement notes the Eagle series' modular design can be deployed in edge AI applications like robotics and drones.

What role did CEVA's SensPro play in BOS Semiconductors' Eagle-A according to the announcement?

CEVA positioned SensPro as a key component for real-time sensing, handling raw sensor data and supporting safety-critical ADAS workloads.

Does the CEVA press release disclose financial terms or volumes for the BOS SensPro license?

No; the announcement does not provide financial terms, deal value, or shipment volumes.