Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas' First Combo MCUs for IoT and Connected Home

Rhea-AI Summary

Ceva (NASDAQ: CEVA) announced that its Ceva-Waves Wi‑Fi 6 and Bluetooth LE IPs are integrated into Renesas' new RA6W1 and RA6W2 combo MCUs, delivering dual-band Wi‑Fi 6 and Wi‑Fi 6 + Bluetooth LE options for smart home, industrial, and IoT devices.

The integration highlights low-power, flexible hosted or hostless implementations, simplified system design, and faster time-to-market enabled by Ceva Waves' hardware and complete software stacks.

Positive

• Renesas integrated Ceva-Waves Wi‑Fi 6 and Bluetooth LE IPs into RA6W1 and RA6W2 MCUs
• Dual-band Wi‑Fi 6 and Wi‑Fi 6 + Bluetooth LE combo support expands connectivity options for developers
• Hosted or hostless implementation options aim to simplify system integration and lower BOM cost
• Complete software stacks and proven hardware from Ceva shorten time-to-market for SoC designs

Negative

• None.

News Market Reaction

+0.65%

5 alerts

+0.65% News Effect

+$4M Valuation Impact

$620M Market Cap

0.0x Rel. Volume

On the day this news was published, CEVA gained 0.65%, reflecting a mild positive market reaction. Our momentum scanner triggered 5 alerts that day, indicating moderate trading interest and price volatility. This price movement added approximately $4M to the company's valuation, bringing the market cap to $620M at that time.

Data tracked by StockTitan Argus on the day of publication.

Market Reality Check

Price: $23.10 Vol: Volume 204,981 is at 0.65...

low vol

$23.10 Last Close

Volume Volume 204,981 is at 0.65x the 20-day average of 313,790, indicating subdued trading activity pre-announcement. low

Technical Shares at $22.95 are trading slightly below the 200-day MA of $23.26 and about 41.06% under the 52-week high of $38.94.

Peers on Argus

CEVA gained 1.82% while key peers mostly advanced: IMOS +1.34%, POET +8%, SKYT +...

CEVA gained 1.82% while key peers mostly advanced: IMOS +1.34%, POET +8%, SKYT +1.23%, AIP +2.56%; LAES declined 0.75%. With no peers in the momentum scanner, this points to a stock-specific move tied to the Renesas connectivity IP news rather than a broad sector rotation.

Common Catalyst Within peers, IMOS reported a strong January 2026 revenue increase, but no common IoT/connectivity IP theme links directly to CEVA’s Renesas collaboration.

Historical Context

5 past events · Latest: Jan 13 (Neutral)

Pattern 5 events

Date	Event	Sentiment	Move	Catalyst
Jan 13	Earnings call schedule	Neutral	+0.3%	Set date and time for Q4 and full-year 2025 earnings release and call.
Jan 06	AI auto partnership	Positive	+2.4%	NXP integrated Ceva’s SensPro AI DSP into processors for software-defined vehicles.
Jan 06	ADAS design win	Positive	+2.4%	BOS Semiconductors licensed SensPro AI DSP for its Eagle-A ADAS SoC platform.
Jan 05	Voice AI ecosystem	Positive	+3.3%	Collaboration with Sensory to add TrulyHandsfree voice activation to NeuPro-Nano NPU.
Dec 05	Industry award	Positive	+1.2%	Ceva-XC21 IoT DSP named “Best IP/Processor of the Year” at EE Awards Asia.

Pattern Detected

Recent CEVA announcements about design wins, AI partnerships, and product recognition have typically seen modestly positive next-day moves, suggesting the market has rewarded execution updates and ecosystem expansion.

Recent Company History

Over the past months, CEVA has reported several ecosystem and design-win milestones. A conference call scheduling on Jan 13, 2026 saw a mild 0.26% move. AI-focused collaborations on Jan 6, 2026 with NXP and BOS Semiconductors each coincided with a 2.42% gain. Earlier, a NeuPro-Nano voice-activation partnership on Jan 5, 2026 led to a 3.26% rise, and an IP/processor award on Dec 5, 2025 was followed by a 1.19% increase. Today’s Renesas IoT connectivity news fits this pattern of positive reactions to ecosystem expansion.

Market Pulse Summary

This announcement highlights CEVA’s Wi-Fi 6 and Bluetooth LE IPs being integrated into Renesas’ new ...

Analysis

This announcement highlights CEVA’s Wi-Fi 6 and Bluetooth LE IPs being integrated into Renesas’ new RA6W1 and RA6W2 MCUs, expanding CEVA’s role in IoT and smart-home connectivity. Recent history shows multiple AI and connectivity design wins with generally positive price reactions. Filings also documented ongoing losses and prior equity offerings, underscoring the importance of tracking upcoming earnings, revenue trends, and additional licensing traction alongside such partnership news.

Key Terms

wi-fi 6, bluetooth le, 802.15.4, ultra-wideband, +3 more

7 terms

wi-fi 6 technical

"Ceva-Waves Wi-Fi 6 and Bluetooth® LE IPs into its newly launched RA6W1"

Wi‑Fi 6 is the latest mainstream wireless networking standard that makes home and business Wi‑Fi faster, more reliable, and better at handling many connected devices at once. For investors it matters because companies that adopt or enable Wi‑Fi 6 can offer improved customer experiences and support higher device density—think of adding highway lanes and smarter traffic lights to reduce congestion—potentially boosting sales, product value, and network-related revenue.

bluetooth le technical

"Wi-Fi 6 and Bluetooth® LE IPs into its newly launched RA6W1 and RA6W2 combo"

Bluetooth Low Energy (Bluetooth LE) is a wireless communication standard designed to let small devices talk to each other using very little power, like a whisper instead of a shout. It matters to investors because it enables long-lasting batteries, cheaper and smaller gadgets, and wide deployment in wearables, sensors and smart-home products—factors that can drive sales, reduce costs, and expand markets for chipmakers, device makers and service providers.

802.15.4 technical

"Bluetooth Dual Mode, 802.15.4, Ultra-Wideband, and turnkey multiprotocol platforms"

802.15.4 is an IEEE technical standard that sets the basic radio rules for short-range, low-power wireless networks used by sensors, smart-home gadgets and many Internet-of-Things devices. It matters to investors because it shapes device compatibility, battery life and deployment costs—think of it as the rules of the road that let small devices from different makers communicate reliably and cheaply, which affects product adoption and market scale.

ultra-wideband technical

"Bluetooth Dual Mode, 802.15.4, Ultra-Wideband, and turnkey multiprotocol platforms"

Ultra-wideband is a wireless communication method that sends very short, low-power pulses across a broad slice of the radio spectrum, allowing precise positioning and fast, low-interference data links. For investors it matters because UWB can enable new features—accurate indoor location, secure device pairing, and efficient IoT connectivity—that may create revenue opportunities, shift market share in hardware and services, and carry regulatory or licensing implications like any scalable radio technology.

thread technical

"multiprotocol platforms that also support Thread, Zigbee, and Matter, Ceva Waves"

A thread is a chain of linked online messages or posts that follow a single topic, like a conversation that unfolds message by message on social media, forums, or news comment sections. Investors watch threads because they can quickly amplify news, rumors or sentiment—similar to a group of people passing along a rumor—which can influence short-term trading, public perception of a company and the spread of information that affects stock prices.

zigbee technical

"multiprotocol platforms that also support Thread, Zigbee, and Matter, Ceva Waves"

Zigbee is a widely used wireless communication standard that lets low-power devices like sensors, smart lights and industrial monitors talk to each other over short distances. Think of it as a neighborhood relay system where each device can pass messages along so signals reach farther without using much battery. For investors, Zigbee matters because its adoption affects product compatibility, energy costs, security risks and the market potential for makers of chips, devices and smart-home or industrial automation solutions.

system-on-chip technical

"interoperability for system-on-chip designs. Spanning Wi-Fi 6/7, Bluetooth"

A system-on-chip (SoC) is a single silicon chip that combines the main computing processor, memory, and key interfaces (like graphics, wireless radios or input/output controllers) that a device needs to run. Think of it as a compact, all-in-one engine that replaces many separate parts, saving space, power and cost. For investors, SoC design and production influence product performance, margins and supply risk, and can be a major competitive advantage in electronics markets.

AI-generated analysis. Not financial advice.

Ceva-Waves Connectivity IPs Enable Renesas to Deliver Flexible, Power-Efficient Wireless Solutions for Next-Generation IoT Systems

ROCKVILLE, Md., Feb. 10, 2026 /PRNewswire/ -- The explosive growth of IoT and smart home markets is driving demand for highly integrated, power-efficient connectivity solutions that simplify design and accelerate time-to-market. Addressing this need, Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that Renesas Electronics Corporation has integrated Ceva-Waves Wi-Fi 6 and Bluetooth^® LE IPs into its newly launched RA6W1 and RA6W2 combo microcontrollers (MCUs), delivering robust wireless performance across smart home, industrial, and consumer devices.

Renesas' RA6W1 dual-band Wi-Fi 6 MCU and RA6W2 combo Wi-Fi 6 + Bluetooth LE MCU offer developers the flexibility to design with standalone Wi-Fi, Wi-Fi/Bluetooth LE combo, or fully integrated modules, depending on application requirements. These solutions save power, simplify system design, and lower BOM cost, while providing hosted or hostless implementation options for seamless integration into next-generation connected systems.

"Connected devices are advancing at an unprecedented pace, opening new opportunities in IoT and industrial applications," said Chandana Pairla, Vice President of Connectivity at Renesas. "By incorporating Ceva's Wi-Fi and Bluetooth LE IPs into our MCUs, we are delivering system-level connectivity that combines high performance with exceptional energy efficiency. This integration helps customers reduce design complexity, extend battery life, and accelerate time to market in smart home and industrial automation applications."

"Our unique connectivity IP portfolio delivers the performance and efficiency needed to bring next-generation wireless features into MCUs," said Tal Shalev, Vice President and General Manager of the Wireless IoT Business Unit at Ceva. "This collaboration with Renesas reinforces our role as a trusted partner, enabling faster IoT innovation and empowering developers to expand what's possible at the smart edge."

Ceva Waves^™ is a comprehensive portfolio of wireless connectivity IPs delivering best-in-class performance, energy efficiency, and interoperability for system-on-chip designs. Spanning Wi-Fi 6/7, Bluetooth^® LE, Bluetooth Dual Mode, 802.15.4, Ultra-Wideband, and turnkey multiprotocol platforms that also support Thread, Zigbee, and Matter, Ceva Waves enables seamless integration of standards-compliant connectivity into MCUs and SoCs. With proven hardware and complete software stacks, Ceva Waves shortens time-to-market and strengthens Ceva's position as a trusted partner for next-generation IoT and smart home devices.

About Ceva, Inc.
Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.

With more than 20 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today's most advanced smart edge products - from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra–low–power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva's IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.

Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.

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SOURCE Ceva, Inc.

FAQ

What did Renesas announce about the RA6W1 and RA6W2 MCUs on Feb 10, 2026 (CEVA)?

Renesas announced RA6W1 and RA6W2 MCUs integrating Ceva Wi‑Fi 6 and Bluetooth LE IPs for combo connectivity. According to Renesas, the MCUs offer dual-band Wi‑Fi 6 and Wi‑Fi 6 + Bluetooth LE options designed for smart home, industrial, and consumer IoT applications.

How do Ceva Wi‑Fi 6 and Bluetooth LE IPs affect power efficiency in Renesas RA6W1/RA6W2 (CEVA)?

Ceva's IPs are designed to improve energy efficiency and extend battery life in connected devices. According to Ceva, the Ceva Waves portfolio combines optimized hardware and software stacks to reduce power consumption and support low-power hosted or hostless implementations.

What connectivity modes do Renesas RA6W1 and RA6W2 support with Ceva IP (CEVA)?

RA6W1 and RA6W2 support standalone Wi‑Fi, Wi‑Fi/Bluetooth LE combo, or integrated module designs. According to Renesas, developers can choose hosted or hostless configurations to match application requirements and simplify system design.

What benefits does Ceva claim from its Waves portfolio for MCUs like Renesas RA6W2 (CEVA)?

Ceva says the Waves portfolio delivers interoperability, energy efficiency, and turnkey multiprotocol support for SoC designs. According to Ceva, Waves spans Wi‑Fi 6/7, Bluetooth LE, UWB, 802.15.4, and supports Thread, Zigbee, and Matter for faster integration.

Will Renesas RA6W1/RA6W2 integration with Ceva IP reduce development time for IoT devices (CEVA)?

The integration is intended to accelerate development and time-to-market by providing proven IP and software stacks. According to Renesas, combining Ceva's connectivity IP with RA6W MCUs reduces design complexity and streamlines implementation for smart edge applications.