Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas' First Combo MCUs for IoT and Connected Home
Ceva (NASDAQ: CEVA) announced that its Ceva-Waves Wi‑Fi 6 and Bluetooth LE IPs are integrated into Renesas' new RA6W1 and RA6W2 combo MCUs, delivering dual-band Wi‑Fi 6 and Wi‑Fi 6 + Bluetooth LE options for smart home, industrial, and IoT devices.
Rhea-AI Summary
Ceva (NASDAQ: CEVA) announced that its Ceva-Waves Wi‑Fi 6 and Bluetooth LE IPs are integrated into Renesas' new RA6W1 and RA6W2 combo MCUs, delivering dual-band Wi‑Fi 6 and Wi‑Fi 6 + Bluetooth LE options for smart home, industrial, and IoT devices.
The integration highlights low-power, flexible hosted or hostless implementations, simplified system design, and faster time-to-market enabled by Ceva Waves' hardware and complete software stacks.
Positive
- Renesas integrated Ceva-Waves Wi‑Fi 6 and Bluetooth LE IPs into RA6W1 and RA6W2 MCUs
- Dual-band Wi‑Fi 6 and Wi‑Fi 6 + Bluetooth LE combo support expands connectivity options for developers
- Hosted or hostless implementation options aim to simplify system integration and lower BOM cost
- Complete software stacks and proven hardware from Ceva shorten time-to-market for SoC designs
Negative
- None.
Details
News Market Reaction – CEVA
On Feb 10, the day this news came out, CEVA closed 0.65% above the previous close.
Data tracked by StockTitan Argus for the Feb 10 session.
Historical Context
-
Set date and time for Q4 and full-year 2025 earnings release and call.
-
NXP integrated Ceva’s SensPro AI DSP into processors for software-defined vehicles.
-
BOS Semiconductors licensed SensPro AI DSP for its Eagle-A ADAS SoC platform.
-
Collaboration with Sensory to add TrulyHandsfree voice activation to NeuPro-Nano NPU.
-
Ceva-XC21 IoT DSP named “Best IP/Processor of the Year” at EE Awards Asia.
24h Move is the share-price change in the day after each event; other market factors may also have contributed.
Key Terms
wi-fi 6 technical
bluetooth le technical
802.15.4 technical
ultra-wideband technical
thread technical
zigbee technical
system-on-chip technical
AI-generated analysis. How Rhea-AI works. Not financial advice.
Ceva-Waves Connectivity IPs Enable Renesas to Deliver Flexible, Power-Efficient Wireless Solutions for Next-Generation IoT Systems
Renesas' RA6W1 dual-band Wi-Fi 6 MCU and RA6W2 combo Wi-Fi 6 + Bluetooth LE MCU offer developers the flexibility to design with standalone Wi-Fi, Wi-Fi/Bluetooth LE combo, or fully integrated modules, depending on application requirements. These solutions save power, simplify system design, and lower BOM cost, while providing hosted or hostless implementation options for seamless integration into next-generation connected systems.
"Connected devices are advancing at an unprecedented pace, opening new opportunities in IoT and industrial applications," said Chandana Pairla, Vice President of Connectivity at Renesas. "By incorporating Ceva's Wi-Fi and Bluetooth LE IPs into our MCUs, we are delivering system-level connectivity that combines high performance with exceptional energy efficiency. This integration helps customers reduce design complexity, extend battery life, and accelerate time to market in smart home and industrial automation applications."
"Our unique connectivity IP portfolio delivers the performance and efficiency needed to bring next-generation wireless features into MCUs," said Tal Shalev, Vice President and General Manager of the Wireless IoT Business Unit at Ceva. "This collaboration with Renesas reinforces our role as a trusted partner, enabling faster IoT innovation and empowering developers to expand what's possible at the smart edge."
Ceva Waves™ is a comprehensive portfolio of wireless connectivity IPs delivering best-in-class performance, energy efficiency, and interoperability for system-on-chip designs. Spanning Wi-Fi 6/7, Bluetooth® LE, Bluetooth Dual Mode, 802.15.4, Ultra-Wideband, and turnkey multiprotocol platforms that also support Thread, Zigbee, and Matter, Ceva Waves enables seamless integration of standards-compliant connectivity into MCUs and SoCs. With proven hardware and complete software stacks, Ceva Waves shortens time-to-market and strengthens Ceva's position as a trusted partner for next-generation IoT and smart home devices.
About Ceva, Inc.
Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.
With more than 20 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today's most advanced smart edge products - from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra–low–power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva's IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.
Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.
View original content to download multimedia:https://www.prnewswire.com/news-releases/ceva-wi-fi-6-and-bluetooth-ips-power-renesas-first-combo-mcus-for-iot-and-connected-home-302683087.html
SOURCE Ceva, Inc.
FAQ
AI-generated questions and answers. How Rhea-AI works. Not financial advice.
