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Fabric.AI (FABC) touts MicroLED optical links toward 20 Tb/s

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(Neutral)
Form Type
8-K

Rhea-AI Filing Summary

Fabric.AI, Inc. reports that it has published a jointly authored white paper with Kopin Corporation titled “Optical Interconnects as a Critical Enabler for Next-Generation AI Infrastructure.” The paper argues that data movement, rather than compute, has become the primary constraint on large-scale AI infrastructure.

The companies describe a MicroLED-based optical interconnect architecture, part of the jointly developed Neural I/o™ platform, that uses hundreds to thousands of parallel channels to move data. According to the paper, this approach targets sub-picojoule-per-bit energy efficiency and a roadmap toward 20 Tb/s link bandwidth, potentially reducing data center power and cooling demands.

The company states that the press release describing the white paper, furnished as an exhibit, is provided under Regulation FD and is not deemed filed under the Exchange Act.

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Item 7.01 Regulation FD Disclosure Disclosure
Material non-public information disclosed under Regulation Fair Disclosure, often investor presentations or guidance.
Item 9.01 Financial Statements and Exhibits Exhibits
Financial statements, pro forma financial information, and exhibit attachments filed with this report.
Target link bandwidth 20 Tb/s Roadmap bandwidth level for MicroLED optical interconnect links discussed in the white paper
Energy efficiency sub-picojoule-per-bit Described per-bit energy consumption enabled by MicroLED’s massively parallel architecture
Press release date August 3, 2026 Date of the joint Fabric.AI and Kopin press release and white paper publication
Exhibit number 99.1 Exhibit identifier for the press release describing the white paper
MicroLED optical interconnect technical
"MicroLED optical interconnect technology for Next-Generation AI Data Centers"
sub-picojoule-per-bit technical
"Massively parallel architecture enables sub-picojoule-per-bit efficiency"
An energy-efficiency metric meaning that each bit of data processing or transmission uses less than one picojoule (one trillionth of a joule) of energy. It matters to investors because lower energy per bit signals more efficient chips, interconnects, or communications gear, which can reduce operating costs, enable higher performance in data centers and devices, and affect competitive positioning much like a car that goes farther on a gallon of fuel.
Neural I/o™ technical
"joint developers of the Neural I/o™ MicroLED-based optical interconnect technology"
AI infrastructure technical
"a Critical Enabler for Next-Generation AI Infrastructure"
AI infrastructure consists of the hardware, software, and systems needed to develop, run, and support artificial intelligence applications. Think of it as the foundation and tools that enable AI to process large amounts of data quickly and accurately, similar to how a strong foundation supports a building. For investors, AI infrastructure is important because it underpins advancements in technology that can drive new business opportunities and competitive advantages.
Regulation FD regulatory
"the press release is furnished under Regulation FD and not deemed filed"
Regulation FD is a rule that prevents company insiders, like executives, from sharing important information with some people before others get it. It matters because it helps ensure all investors have equal access to key news, making the stock market fairer and reducing chances of insider trading.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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FAQ

What did Fabric.AI (FABC) announce on August 3, 2026?
Fabric.AI announced a jointly authored white paper with Kopin titled “Optical Interconnects as a Critical Enabler for Next-Generation AI Infrastructure.” The paper examines data movement as AI’s main bottleneck and explains how MicroLED optical interconnects could address bandwidth and energy challenges in large AI data centers.

What technology does Fabric.AI (FABC) highlight in its joint white paper with Kopin?
The white paper highlights the Neural I/o™ MicroLED-based optical interconnect platform. It explains how massively parallel MicroLED channels can move data more efficiently than copper or laser-based optics, aiming for sub-picojoule-per-bit energy use in next-generation AI infrastructure and data centers.

Why does Fabric.AI (FABC) say data movement is critical for AI infrastructure?
Fabric.AI states that as AI clusters link tens of thousands of accelerators, interconnect performance increasingly determines overall system performance. The white paper argues data movement, not compute, has become the primary constraint, making more efficient interconnect architectures central to scaling AI infrastructure.

How could Fabric.AI (FABC) MicroLED interconnects impact data center costs?
The white paper claims MicroLED’s massively parallel architecture can achieve per-bit energy use far below conventional interconnects. Lower energy per bit has direct implications for reducing data center power consumption, cooling requirements, and associated capital costs in large AI and high-performance computing environments.

Is the Fabric.AI (FABC) joint white paper based on existing company products?
The press release notes that performance figures in the white paper reflect published third-party industry demonstrations and roadmaps for MicroLED interconnects. They do not represent measured results of any specific Fabric.AI or Kopin product and remain subject to risks described in each company’s SEC reports.
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UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

 

FORM 8-K

 

CURRENT REPORT

 

PURSUANT TO SECTION 13 OR 15(d) OF THE

SECURITIES EXCHANGE ACT OF 1934

 

Date of Report

(Date of earliest event reported):

August 3, 2026

 

Fabric.AI, Inc.

(Exact name of registrant as specified in its charter)

 

Delaware   001-34643   98-0204758
(State or other jurisdiction of   (Commission   (IRS Employer
incorporation)   File No.)   Identification No.)

 

1185 Avenue of the Americas

New York, NY 10036

(Address of principal executive offices and zip code)

 

512-994-4917

(Registrant’s telephone number, including area code)

 

N/A

(Former name or former address, if changed since last report)

 

Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions:

 

☐ Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425)
   
☐ Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12)
   
☐ Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b))
   
☐ Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c))

 

Securities registered pursuant to Section 12(b) of the Act:

 

Title of each class   Trading Symbol(s)   Name of each exchange on which registered
Common stock, par value $0.0001 per share   FABC   The Nasdaq Stock Market LLC

 

Indicate by check mark whether the registrant is an emerging growth company as defined in Rule 405 of the Securities Act of 1933 (§230.405 of this chapter) or Rule 12b-2 of the Securities Exchange Act of 1934 (§240.12b-2 of this chapter).

 

Emerging growth company ☐

 

If an emerging growth company, indicate by check mark if the registrant has elected not to use the extended transition period for complying with any new or revised financial accounting standards provided pursuant to Section 13(a) of the Exchange Act. ☐

 

 

 

 

 

 

Item 7.01 Regulation FD Disclosure.

 

On August 3, 2026, Fabric.AI, Inc. issued a press release announcing the publication of a jointly authored white paper with Kopin Corporation titled “Optical Interconnects as a Critical Enabler for Next-Generation AI Infrastructure,” examining data movement as a primary constraint on AI infrastructure and how MicroLED optical interconnects address it. A copy of the press release is furnished as Exhibit 99.1 hereto.

 

The information contained in this Item 7.01 of this Current Report on Form 8-K, including Exhibit 99.1 hereto, is being furnished and shall not be deemed “filed” for purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”), or otherwise subject to the liabilities of that section, nor shall it be deemed incorporated by reference in any filing under the Securities Act of 1933, as amended, or the Exchange Act, except as expressly set forth by specific reference in such filing.

 

 

 

 

Item 9.01 Financial Statements and Exhibits.

 

(d) Exhibits.

 

Exhibit
Number		   Description
99.1   Press Release, dated August 3, 2026.
104   Cover Page Interactive Data File (embedded within the Inline XBRL document)

 

 

 

 

SIGNATURES

 

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned hereunto duly authorized.

 

Date: August 3, 2026 FABRIC.AI, INC.
     
  By: /s/ Joshua Silverman
  Name: Joshua Silverman
  Title: Chief Executive Officer

 

 

 

 

 

Exhibit 99.1

 

Fabric.AI and Kopin Publish Joint White Paper on MicroLED Optical Interconnect Technology for Next-Generation AI Data Centers

 

Massively parallel architecture enables sub-picojoule-per-bit efficiency — a fraction of the energy consumed by conventional interconnects, with direct implications for data center power and cooling costs

 

The paper details how MicroLED optical links offer a roadmap to 20 Tb/s — scaling by channel count rather than lane speed as copper and laser-based optics approach physical limits

 

NEW YORK — August 3, 2026 — Fabric.AI, Inc. (Nasdaq: FABC), a fabless semiconductor company, and Kopin Corporation (Nasdaq: KOPN), a leading developer of microdisplay and MicroLED technology — joint developers of the Neural I/o™ MicroLED-based optical interconnect technology — today announced the publication of a jointly authored white paper, “Optical Interconnects as a Critical Enabler for Next-Generation AI Infrastructure,” examining why data movement — not compute — has become the primary constraint on AI infrastructure, and how MicroLED optical interconnects address it.

 

The publication follows the companies’ ongoing collaboration to commercialize Neural I/o™, a MicroLED-based optical interconnect platform designed to address the growing bandwidth and energy demands of next-generation AI infrastructure. The white paper outlines the technical and architectural principles underpinning that platform and explains why MicroLED-based optical interconnects may offer a more scalable and energy-efficient alternative as conventional interconnect technologies approach their physical limits.

 

The white paper is available here.

 

AI clusters now link tens of thousands of accelerators, and cluster performance is increasingly set by the interconnect rather than the processor. The white paper presents an architectural comparison of copper, laser-based optical, and MicroLED optical interconnects, and details how the MicroLED approach — moving data over hundreds to thousands of simple, low-power parallel channels instead of a few high-speed serial lanes — enables sub-picojoule-per-bit efficiency while scaling aggregate link bandwidth toward 20 Tb/s and beyond on published industry roadmaps.

 

Key topics covered in the white paper include:

 

●Why electrical interconnects face hard physical limits in bandwidth, power, reach, and heat as AI clusters scale
●How MicroLED’s massively parallel architecture achieves per-bit energy consumption a fraction of the energy required by conventional interconnects — with direct implications for data center power, cooling, and capital costs
●How MicroLED arrays scale bandwidth by adding emitters within the same physical footprint — without redesigning data center cabling, connectors, or topology
●A roadmap analysis showing how channel count and per-channel speed compound toward 20+ Tb/s links

 

 

 

 

“The industry has spent decades making individual lanes faster, and that era is ending,” said Michael Murray, Kopin Chief Executive Officer. “MicroLED technology changes the axis of scaling entirely. Kopin has spent years advancing the performance and manufacturability of MicroLED technology, and this paper lays out clearly why that foundation matters for the largest infrastructure buildout in computing history.”

 

“Every conversation about AI infrastructure eventually arrives at the same bottleneck: moving data between chips,” said Josh Silverman, Fabric.AI Chief Executive Officer. “We wrote this paper with Kopin to give investors, operators, and engineers a clear, honest framework for understanding why interconnects have become AI’s primary bottleneck — and why an architecture built on parallelism rather than lane speed is the path through that bottleneck. It reflects the thesis behind Neural I/o™, the platform we are developing together.”

 

About Fabric.AI, Inc.

 

Fabric.AI (Nasdaq: FBIC) is developing next-generation AI infrastructure technologies designed to overcome the bandwidth, latency, and power limitations of conventional computing architectures. The Company’s proprietary Neural I/o™ platform leverages MicroLED-based optical interconnect technology to enable ultra-high-speed, energy-efficient communication between AI accelerators, processors, memory, and networking systems, supporting the growing demands of large-scale AI training and inference.

 

Through strategic collaborations with industry leaders and a focus on scalable, high-performance connectivity solutions, Fabric.AI is advancing technologies that have the potential to improve the efficiency, performance, and economics of next-generation AI data centers and high-performance computing environments.

 

For more information, visit Fabric.AI.

 

About Kopin Corporation

 

Kopin Corporation (Nasdaq: KOPN) is a leading developer and provider of innovative display, Optical Interconnect devices and application-specific optical solutions sold as critical components and subassemblies for defense, enterprise, professional and consumer products. Kopin’s portfolio includes microdisplays, display modules, eyepiece assemblies, image projection modules and vehicle mounted and head-mounted display systems that incorporate ultra-small high-resolution Active Matrix Liquid Crystal displays (AMLCD), Ferroelectric Liquid Crystal on Silicon (FLCoS) displays, MicroLED displays (µLED) and Organic Light Emitting Diode (OLED) displays, a variety of optics and low-power ASICs and optical interconnect devices for data centers.

 

 

 

 

For more information, please visit Kopin’s website at www.kopin.com.

 

Kopin is a trademark of Kopin Corporation.

 

Forward-Looking Statements

 

This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, including statements regarding technology roadmaps, projected bandwidth and efficiency capabilities, market growth, and product development timelines. Performance figures referenced in the white paper reflect published third-party industry demonstrations and roadmaps for the MicroLED interconnect category and do not represent measured results of any Fabric.AI or Kopin product. Actual results may differ materially due to risks and uncertainties described in each company’s filings with the Securities and Exchange Commission, including Fabric.AI’s / Kopin’s most recent annual and quarterly reports. Neither company undertakes any obligation to update forward-looking statements except as required by law.

 

IR Contact:

 

CORE IR

212-644-0924

ir@fabric-ai.co

 

Media Contact:

 

Fabric.AI

press@fabric-ai.co

www.fabricai.com

 

 

Source: View Original Filing on SEC EDGAR

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