Fabric.AI Appoints Haynes Boone as Counsel to Support Joint Intellectual Property with Kopin

Fabric.AI brings in Haynes Boone to strengthen patent strategy as Neural I/o optical interconnect technology with Kopin moves toward commercialization.

Rhea-AI Summary

Fabric.AI (FABC) has appointed Haynes and Boone as intellectual property counsel to support development and protection of Neural I/o™ technology jointly owned with Kopin (KOPN).

Haynes Boone will advise on patent strategy, technology licensing and other IP matters for the Neural I/o™ roadmap. The appointment follows Fabric.AI entering non-disclosure agreements with multiple major AI companies for technical discussions about Neural I/o™, which is a MicroLED-based optical interconnect architecture aimed at bandwidth and energy-efficiency needs in next-generation AI data centers.

Market Context

A 5.56% 24-hour gain followed the Aug. 18 Neural I/o steering-committee announcement; earlier progra...

Analysis

A 5.56% 24-hour gain followed the Aug. 18 Neural I/o steering-committee announcement; earlier program disclosures also recorded mixed reactions, providing market context for this counsel appointment but not a direct price comparison.

Key Figures

IP lawyers: more than 120 IP lawyers Patent applications: more than 23,000 patent applications Patent prosecution ranking: No. 2 nationally

IP lawyers

more than 120 IP lawyers

Haynes Boone Intellectual Property Practice Group

Patent applications

more than 23,000 patent applications

Filed by Haynes Boone in the last five years

Patent prosecution ranking

No. 2 nationally

Overall patent prosecution performance and high-tech patent work

Previous AI Reports

4 past events · Latest: Aug 18

Same Type 4 events

1. Aug 18

   Joint steering committee

   24h Move

   +5.6%

   Fabric.AI and Kopin launched governance for Neural I/o commercialization planning

2. Aug 12

   Neural I/o agreements

   24h Move

   -2.2%

   Several new NDAs expanded industry engagement around the Neural I/o platform

3. Aug 11

   CES demonstration plans

   24h Move

   +4.6%

   Neural I/o remained scheduled for its first live public demonstration

4. Aug 03

   Joint technology white paper

   24h Move

   +9.2%

   Fabric.AI and Kopin detailed their MicroLED optical interconnect architecture

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

patent prosecution, microled, optical interconnect, fabless semiconductor

4 terms

patent prosecution regulatory

"ranked number two law firm in overall patent prosecution performance"

Patent prosecution is the multi-step process of securing legal ownership of an invention from a patent office, including drafting and filing applications, answering questions or objections from the patent examiner, and possibly appealing decisions. For investors it matters because the outcome determines how well a company can legally block competitors, monetize technology, and avoid costly legal fights; think of it as negotiating and locking a deed that protects a product’s value.

microled technical

"jointly developing MicroLED-based optical interconnect technology"

MicroLED is a type of display technology that uses tiny, individual light-emitting tiles to create images with bright colors, sharp contrast, and wide viewing angles. Because of their efficiency and high quality, microLED screens can provide clearer and more vibrant visuals, which can enhance the appeal and performance of electronic devices. For investors, advancements in microLED technology may signal potential growth opportunities in the electronics and display markets.

optical interconnect technical

"MicroLED-based optical interconnect technology designed to address bandwidth"

Optical interconnect is a way of linking electronic components using pulses of light instead of traditional electrical wires, like swapping copper cables for fiber-optic highways inside and between devices. It matters to investors because light-based connections can carry much more data, use less power and generate less heat than electrical links, which can lower operating costs and enable faster, more scalable products for data centers, telecom and high-performance computing markets.

fabless semiconductor technical

"an AI infrastructure company developing a suite of fabless semiconductor technologies"

A fabless semiconductor company designs and develops computer chips but does not own the factories that make them, instead hiring independent foundries to manufacture the physical chips. This model matters to investors because it lowers the company’s upfront capital costs and lets it focus on design and sales, while creating dependencies on outside manufacturers that can affect supply, margins and growth prospects — like a fashion designer who outsources sewing to third-party factories.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Nationally ranked number two law firm in overall patent prosecution performance and high-tech patent work to support the Company’s intellectual property protection as Fabric.AI and Kopin advance Neural I/o™ technology toward commercialization

NEW YORK, NY, Sept. 17, 2026 (GLOBE NEWSWIRE) -- Fabric.AI (Nasdaq: FABC) (“Fabric.AI” or the “Company”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it has retained Haynes and Boone, LLP (“Haynes Boone”) as intellectual property counsel to support development and protection of Neural I/o™ intellectual property jointly owned with its partner Kopin Corporation (Nasdaq:KOPN). Through their partnership, Fabric.AI and Kopin are jointly developing MicroLED-based optical interconnect technology designed to address bandwidth and energy-efficiency constraints in next-generation AI data centers.

“Establishing a strong and defensible intellectual property portfolio with Kopin is an important component of our strategy as we continue advancing Neural I/o™ toward commercialization,” said Josh Silverman, Fabric.AI Chief Executive Officer. “The engagement comes as we have entered into non-disclosure agreements with multiple major AI companies in connection with technical discussions regarding Neural I/o™. As those discussions progress, we believe a rigorously protected patent portfolio is essential to preserving the value of the jointly developed technology for both partners and their shareholders.”

Haynes Boone will advise Fabric.AI on patent strategy, technology licensing and other intellectual property matters related to the jointly owned Neural I/o™ technology roadmap.  Haynes Boone’s Intellectual Property Practice Group is one of the largest and most comprehensive IP practices in the United States, with more than 120 IP lawyers located in offices across the country. The patent practice’s capability is reflected in both scale and recognition: the firm has filed more than 23,000 patent applications in the last five years and is ranked No. 2 nationally for both overall patent prosecution performance and high-tech patent work in LexDana's 2026 Patent Prosecution Report.

The appointment also supports Fabric.AI’s continued collaboration with Kopin on Neural I/o™, an optical interconnect architecture designed to address the increasing data-movement, bandwidth and energy-efficiency demands of next-generation AI infrastructure.

About Fabric.AI

Fabric.AI (Nasdaq: FABC) is an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, including its Neural I/o ^TM MicroLED-based optical interconnect platform.

About Kopin Corporation

Kopin Corporation (Nasdaq: KOPN) is a leading developer and provider of innovative display and application-specific optical solutions for defense, AI infrastructure, enterprise, professional and consumer products. Kopin’s portfolio includes microdisplays, display modules, eyepieces and projection assemblies, and vehicle- and head-mounted display systems built on Kopin’s liquid crystal, MicroLED and OLED display technologies, along with a range of optics and low-power custom silicon. Building on its patented bi-directional NeuralDisplay™ architecture, Kopin is also developing Neural I/o optical interconnects that use programmable MicroLED pixels as ultra-high-speed, low-power optical transceivers for AI data centers. For more information, please visit Kopin’s website at www.kopin.com.

Follow Kopin on LinkedIn, X and Facebook.

Forward-Looking Statements

This press release contains forward-looking statements within the meaning of the federal securities laws, including statements regarding the expected timing, demonstration and capabilities of the Neural I/o ^TM platform, the formation and expected functions of the JSC, the Company’s plans to participate in industry conferences, and the expected expansion of industry engagement. These statements are based on current expectations and are subject to risks and uncertainties — including development, integration and manufacturing risks — that could cause actual results to differ materially. Market and industry data are derived from third-party sources believed to be reliable but have not been independently verified by the Company. A discussion of these and other factors with respect to the Company is set forth in the Company’s most recent Annual Report on Form 10-K and subsequent Quarterly Reports on Form 10-Q and Current Reports on Form 8-K filed with the Securities and Exchange Commission. Forward-looking statements speak only as of the date they are made, and the Company disclaims any intention or obligation to revise any forward-looking statements, whether as a result of new information, future events or otherwise.

IR Contact:
CORE IR
212-644-0924
ir@fabric-ai.co

Media Contact:
Fabric.AI
press@fabric-ai.co
www.fabricai.com

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What specific role will Haynes Boone play for Fabric.AI and Kopin?

Haynes Boone will advise Fabric.AI on patent strategy, technology licensing and other intellectual property matters related to the jointly owned Neural I/o™ technology roadmap, supporting development and protection of the partners’ MicroLED-based optical interconnect IP.

What is Neural I/o™ and what problem is it designed to address?

Neural I/o™ is described as a MicroLED-based optical interconnect architecture designed to address data-movement, bandwidth and energy-efficiency constraints in next-generation AI data centers and AI infrastructure.

What recent business activity around Neural I/o™ does Fabric.AI disclose?

Fabric.AI states that it has entered into non-disclosure agreements with multiple major AI companies in connection with technical discussions regarding Neural I/o™, and views a rigorously protected patent portfolio as essential to preserving the value of the jointly developed technology.