Fabric.AI Files Two Patent Applications Covering Fiber-Coupled and Connector-Free MicroLED Optical Interconnect, Developed with Kopin
Fabric.AI expands protection of its Neural I/o microLED optical interconnect, adding fiber-coupled and connector-free designs developed with Kopin.
Rhea-AI Summary
Fabric.AI (FABC) filed two USPTO patent applications for its MicroLED-based Neural I/o optical interconnect architecture, developed in collaboration with Kopin (KOPN).
Both applications use a single optical system that images an entire micro-LED array rather than aligning channels individually, aiming to keep assembly complexity flat as channel counts rise. The first application covers a fiber-coupled design that images the array onto a multicore fiber, while the second covers a connector-free free-space link that sends parallel data across a short air gap to a detector array. Fabric.AI expects to demonstrate working Neural I/o hardware in January 2027.
Positive
- Two USPTO patent applications filed for Neural I/o optical interconnect
- Joint MicroLED interconnect development with Kopin (KOPN) continues
- Neural I/o hardware demonstration expected in January 2027
Negative
- None.
Details
Market Reaction – FABC
On Sep 23, the day this news came out, the latest delayed price for FABC is 0.92% above the previous close. The latest delayed price is $2.20.
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Key Figures
- Patent applications
- 2 applications
- Filed with the USPTO for the micro-LED optical interconnect architecture
- Hardware demonstration
- January 2027
- Expected demonstration of working Neural I/o hardware
- Channel density
- Thousands of channels within a single square millimeter of die
- Company-described potential for dense parallel optical links
Previous AI Reports
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Appointed counsel to advise on patent strategy, licensing, and Neural I/o IP matters.
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Confirmed first public live demonstration of Neural I/o hardware at CES 2027 in January.
24h Move is the share-price change in the day after each event; other market factors may also have contributed.
Key Terms
micro-led technical
multicore optical fiber technical
detector array technical
AI-generated analysis. How Rhea-AI works. Not financial advice.
Both applications derive from a single optical approach designed to hold assembly complexity flat as channel counts rise; Company remains on track to show first demonstration hardware in January 2027
NEW YORK, NY, Sept. 23, 2026 (GLOBE NEWSWIRE) -- Fabric.AI (Nasdaq: FABC) (“Fabric.AI” or the “Company”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it has filed two patent applications with the United States Patent and Trademark Office (USPTO) covering its micro-LED optical interconnect architecture.
Both applications derive from the same design choice: imaging an entire micro-LED array through a novel optical system, rather than aligning light channel by channel. Through their partnership, Fabric.AI and Kopin Corporation (Nasdaq: KOPN) are jointly developing MicroLED-based optical interconnect technology designed to address bandwidth and energy-efficiency constraints in next-generation AI data centers.
Fiber-coupled: one optic, however many channels
The first application covers the Company’s approach to fiber-coupled optical interconnect, using a novel optical system to image an entire micro-LED array onto the cores of a multicore optical fiber. The architecture is designed to hold the number of precision alignment steps constant as channel count rises, rather than requiring alignment channel by channel.
Fabric.AI believes this is the property that allows dense parallel optical links — thousands of channels within a single square millimeter of die — to scale between boards, trays and racks without a corresponding rise in assembly cost.
Free-space: the same optic, without the fiber
The second application takes the same optical approach to its limit. Rather than imaging the array onto a fiber face, it transmits parallel data across a short air gap, eliminating the need for any physical connectors between the optical endpoints.
The technology uses compact optics to image the micro-LED array directly onto a matching detector array, holding the channels separate. Because the coupling is imaged rather than bonded, the fiber becomes optional: for short, fixed gaps inside a package or between adjacent boards, removing the connector removes both a failure point and an assembly step.
“Both applications come from one architectural choice: we image the whole array using special optics instead of aligning light channel by channel. That is what we believe keeps assembly complexity flat as we scale from hundreds of optical channels toward thousands — and what lets us remove the connector entirely where the gap is short enough,” said James Altucher, Fabric.AI Senior Strategic Advisor. “We continue to collaborate with Kopin in refining our technology and look forward to sharing these innovations in more detail with those potential customers currently under NDA discussions, as well as to providing more updates as they develop.”
These applications also underscore Fabric.AI’s continued collaboration with Kopin on Neural I/o™, its optical interconnect architecture designed to address the increasing data-movement, bandwidth and energy-efficiency demands of next-generation AI infrastructure. The Company expects to demonstrate working Neural I/o hardware in January 2027.
About Fabric.AI
Fabric.AI (Nasdaq: FABC) is an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, including its Neural I/o TM MicroLED-based optical interconnect platform.
About Kopin Corporation
Kopin Corporation (Nasdaq: KOPN) is a leading developer and provider of innovative display and application-specific optical solutions for defense, AI infrastructure, enterprise, professional and consumer products. Kopin’s portfolio includes microdisplays, display modules, eyepieces and projection assemblies, and vehicle- and head-mounted display systems built on Kopin’s liquid crystal, MicroLED and OLED display technologies, along with a range of optics and low-power custom silicon. Building on its patented bi-directional NeuralDisplay™ architecture, Kopin is also developing Neural I/o optical interconnects that use programmable MicroLED pixels as ultra-high-speed, low-power optical transceivers for AI data centers. For more information, please visit Kopin’s website at www.kopin.com.
Follow Kopin on LinkedIn, X and Facebook.
Forward-Looking Statements
This press release contains forward-looking statements within the meaning of the federal securities laws, including statements regarding the expected timing, demonstration and capabilities of the Neural I/o TM platform. These statements are based on current expectations and are subject to risks and uncertainties — including development, integration and manufacturing risks — that could cause actual results to differ materially. Market and industry data are derived from third-party sources believed to be reliable but have not been independently verified by the Company. A discussion of these and other factors with respect to the Company is set forth in the Company’s most recent Annual Report on Form 10-K and subsequent Quarterly Reports on Form 10-Q and Current Reports on Form 8-K filed with the Securities and Exchange Commission. Forward-looking statements speak only as of the date they are made, and the Company disclaims any intention or obligation to revise any forward-looking statements, whether as a result of new information, future events or otherwise.
IR Contact:
CORE IR
212-644-0924
ir@fabric-ai.co
Media Contact:
Fabric.AI
press@fabric-ai.co
www.fabricai.com
FAQ
AI-generated questions and answers. How Rhea-AI works. Not financial advice.
What does the fiber-coupled patent application cover?
The first application covers a fiber-coupled optical interconnect that uses a novel optical system to image an entire micro-LED array onto the cores of a multicore optical fiber. The architecture is designed so that the number of precision alignment steps remains constant as channel count increases, instead of requiring channel-by-channel alignment.
What is the connector-free free-space optical approach in the second application?
The second application applies the same imaging concept across a short air gap rather than into a fiber. Compact optics image the micro-LED array directly onto a matching detector array, keeping channels separate while eliminating physical connectors between endpoints. Because the coupling is imaged rather than bonded, fibers become optional for short, fixed gaps, which can remove a failure point and an assembly step.
How are Fabric.AI and Kopin collaborating on Neural I/o?
Fabric.AI and Kopin are jointly developing MicroLED-based Neural I/o optical interconnects intended to address data-movement, bandwidth and energy-efficiency demands in next-generation AI infrastructure and data centers. The collaboration builds on Kopin’s display and optical technologies and on its bi-directional NeuralDisplay architecture using programmable MicroLED pixels as high-speed, low-power optical transceivers.