ChipMOS to present at UBS Taiwan Summit 2026

ChipMOS TECHNOLOGIES INC.

Rhea-AI Filing Summary

ChipMOS TECHNOLOGIES INC. (IMOS), a foreign private issuer, reports that its management will present to institutional investors at the UBS Taiwan Summit 2026 at the W Taipei Hotel on September 15 and 16, 2026. Senior Vice President of Strategy and Investor Relations Jesse Huang will discuss recent financial results, business trends and growth opportunities.

ChipMOS describes itself as an industry leading provider of outsourced semiconductor assembly and test services, serving fabless semiconductor companies, integrated device manufacturers and independent foundries worldwide from its facilities in multiple Taiwan science and industrial parks. An investor presentation is available on the company’s investor relations website.

Key Figures

UBS Taiwan Summit 2026 dates: September 15–16, 2026 Form type: Form 6-K Listing venues: Taiwan Stock Exchange: 8150; Nasdaq: IMOS

3 metrics

UBS Taiwan Summit 2026 dates September 15–16, 2026 Dates ChipMOS management will present to institutional investors

Form type Form 6-K Report of foreign private issuer filed for September 2026

Listing venues Taiwan Stock Exchange: 8150; Nasdaq: IMOS Trading symbols disclosed for ChipMOS shares

Key Terms

foreign private issuer, outsourced semiconductor assembly and test services, forward-looking statements, fabless semiconductor companies

4 terms

foreign private issuer regulatory

"FORM 6-K REPORT OF FOREIGN PRIVATE ISSUER"

A foreign private issuer is a company organized outside the United States that meets tests showing it is primarily foreign-controlled and therefore qualifies for a different set of U.S. reporting rules. For investors, that means the company files less frequent or differently formatted disclosures with U.S. regulators and may follow home-country accounting and governance practices, so buying its stock is like dining at a well-reviewed restaurant that follows its home kitchen’s rules instead of the local menu — you get access but should check what standards apply.

outsourced semiconductor assembly and test services technical

"provider of outsourced semiconductor assembly and test services"

Companies that provide outsourced semiconductor assembly and test services take manufactured silicon chips and handle the physical packaging, final electrical testing and quality checks before the chips are shipped to customers. Think of them as a specialized fulfillment and inspection center for delicate electronics; their work affects device reliability, delivery times and cost structures, so investors watch them for supply‑chain risk, capacity constraints, technological competitiveness and margin trends.

forward-looking statements regulatory

"This press release may contain certain forward-looking statements."

Forward-looking statements are predictions or plans that companies share about what they expect to happen in the future, like estimating sales or profits. They matter because they help investors understand a company's outlook, but since they are based on guesses and assumptions, they can sometimes be wrong.

fabless semiconductor companies technical

"provides end-to-end assembly and test services to leading fabless semiconductor companies"

Companies that design and develop semiconductor chips but do not own or operate the factories that manufacture them; instead they outsource production to specialized contract foundries. This model is like a fashion designer who creates patterns and hires a factory to make the clothes, and it matters to investors because it changes a company's capital needs, cost structure, production flexibility, and exposure to supply-chain or foundry capacity risks that can affect margins and growth.

FAQ

What event is ChipMOS (IMOS) participating in according to this Form 6-K?

ChipMOS will present to institutional investors at the UBS Taiwan Summit 2026 at the W Taipei Hotel on September 15 and 16, 2026, where management will discuss recent financial results, business trends and growth opportunities.

Who will represent ChipMOS (IMOS) at the UBS Taiwan Summit 2026?

The company states that Jesse Huang, Senior Vice President of Strategy and Investor Relations, will participate in the UBS Taiwan Summit 2026 and will discuss ChipMOS’s recent financial results, business trends and growth opportunities with institutional investors.

Where can investors find ChipMOS (IMOS) investor presentation mentioned in the filing?

ChipMOS notes that its investor presentation is available on the investor relations section of its website at www.chipmos.com, providing additional details on its financial performance, business trends and strategy.

How does ChipMOS (IMOS) describe its core business in this 6-K?

ChipMOS describes itself as an industry leading provider of outsourced semiconductor assembly and test services, offering end-to-end assembly and test for leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries across virtually all end markets worldwide.

Where are ChipMOS (IMOS) facilities located?

ChipMOS states that it has advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, supporting its outsourced semiconductor assembly and test operations.

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Available on EDGAR 09/10/2026 - 06:03 AM Accepted by SEC EDGAR 09/10/2026 - 06:00 AM Learn about SEC filing dates

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, DC 20549

FORM 6-K

REPORT OF FOREIGN PRIVATE ISSUER

PURSUANT TO RULE 13a-16 OR 15d-16

UNDER THE SECURITIES EXCHANGE ACT OF 1934

For the month of September 2026

Commission File Number 001-37928

ChipMOS TECHNOLOGIES INC.

(Translation of Registrant’s Name into English)

No. 1, R&D Rd. 1, Hsinchu Science Park

Hsinchu, Taiwan

Republic of China

(Address of Principal Executive Offices)

(Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.)

Form 20-F ☒ Form 40-F ☐

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

						ChipMOS TECHNOLOGIES INC.
						(Registrant)
Date: September 10, 2026				By		/S/ S. J. Cheng
				Name:		S. J. Cheng
				Title:		Chairman & President

Contacts:

In Taiwan Jesse Huang ChipMOS TECHNOLOGIES INC. +886-6-5052388 ext. 7715 IR@chipmos.com In the U.S. David Pasquale Global IR Partners +1-914-337-8801 dpasquale@globalirpartners.com

ChipMOS to Participate in UBS Taiwan Summit 2026

Hsinchu, Taiwan - September 10, 2026 - ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today announced that it will present to institutional investors at UBS Taiwan Summit 2026, at the W Taipei Hotel on September 15 and 16, 2026.

Management from the Company, including Jesse Huang, Senior Vice President of Strategy and Investor Relations, will discuss the Company’s recent financial results, business trends and growth opportunities. The Company’s investor presentation is available on the investor relations’ section of its website at www.chipmos.com.

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS) (www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS is known for its track record of excellence and history of innovation. The Company provides end-to-end assembly and test services to leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries serving virtually all end markets worldwide.

Forward-Looking Statements:

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategies, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding current macroeconomic conditions, including the impacts of high inflation, foreign exchange rates and risk of recession, on demand for our products, consumer confidence and financial markets generally; changes in trade regulations, policies, and agreements and the imposition of tariffs that affect our products or operations, including potential new tariffs that may be imposed and our ability to mitigate with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, based on a number of important factors and risks, which are more specifically identified in the Company’s most recent U.S. Securities and Exchange Commission (the “SEC”) filings. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the SEC and in its other filings with the SEC.