ChipMOS to Participate in UBS Taiwan Summit 2026
ChipMOS will meet institutional investors at UBS Taiwan Summit 2026 and has posted its investor presentation online.
Rhea-AI Summary
ChipMOS (IMOS) will present to institutional investors at the UBS Taiwan Summit 2026 at the W Taipei Hotel on September 15–16, 2026.
Members of management, including Senior Vice President of Strategy and Investor Relations Jesse Huang, will discuss recent financial results, business trends and growth opportunities. An investor presentation is available in the investor relations section of the company’s website.
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Key Figures
- Summit dates
- September 15 and 16, 2026
- UBS Taiwan Summit presentation
Key Terms
osat technical
AI-generated analysis. How Rhea-AI works. Not financial advice.
HSINCHU, Sept. 10, 2026 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will present to institutional investors at UBS Taiwan Summit 2026, at the W Taipei Hotel on September 15 and 16, 2026.
Management from the Company, including Jesse Huang, Senior Vice President of Strategy and Investor Relations, will discuss the Company's recent financial results, business trends and growth opportunities. The Company's investor presentation is available on the investor relations' section of its website at www.chipmos.com.
About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS) (www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS is known for its track record of excellence and history of innovation. The Company provides end-to-end assembly and test services to leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries serving virtually all end markets worldwide.
Forward-Looking Statements:
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of, among other things, strategies, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding current macroeconomic conditions, including the impacts of high inflation, foreign exchange rates and risk of recession, on demand for our products, consumer confidence and financial markets generally; changes in trade regulations, policies, and agreements and the imposition of tariffs that affect our products or operations, including potential new tariffs that may be imposed and our ability to mitigate with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, based on a number of important factors and risks, which are more specifically identified in the Company's most recent U.S. Securities and Exchange Commission (the "SEC") filings. Further information regarding these risks, uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the SEC and in its other filings with the SEC.
Contacts:
In Jesse Huang ChipMOS TECHNOLOGIES INC. +886-6-5052388 ext. 7715 | In the David Pasquale Global IR Partners +1-914-337-8801 |
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SOURCE ChipMOS TECHNOLOGIES INC.