Tower Semiconductor (TSEM) highlights silicon photonics and SiGe at OFC 2026

Rhea-AI Filing Summary

Tower Semiconductor reported that it will participate in OFC 2026, the Optical Fiber Communication Conference and Exhibition, taking place March 17–19, 2026 at the Los Angeles Convention Center, booth #2221. Company representatives will discuss its current and future silicon photonics roadmap.

The company will showcase its silicon photonics platform used for optical transceivers in Scale-Out and telecom, as well as emerging applications such as co-packaged optics, DWDM lasers, optical circuit switching, FMCW LiDARs for Physical AI, and quantum computing. Tower will also highlight its Silicon Germanium BiCMOS offerings that, together with its silicon photonics platform, target higher bandwidth, lower latency and lower power needs of next-generation AI infrastructure.

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

FORM 6-K

REPORT OF FOREIGN PRIVATE ISSUER PURSUANT TO RULE 13a-16 OR 15d-16

OF THE SECURITIES EXCHANGE ACT OF 1934

For the month of March 2026 No.2

Commission File Number 0-24790

TOWER SEMICONDUCTOR LTD.

(Translation of registrant's name into English)

Ramat Gavriel Industrial Park

P.O. Box 619, Migdal Haemek, Israel 2310502

(Address of principal executive offices)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F ☒          Form 40-F ☐

On March 4, 2026, the Registrant to Participate at OFC 2026 Highlighting its Silicon Photonics Platform for AI, Telecom and Emerging Applications

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

	TOWER SEMICONDUCTOR LTD.
Date: March 4, 2026	By:	/s/ Nati Somekh
		Name: Nati Somekh
		Title:   Corporate Secretary

          

Tower Semiconductor to Participate at OFC 2026 Highlighting its Silicon Photonics

Platform for AI, Telecom and Emerging Applications

MIGDAL HAEMEK, Israel, March 4, 2026 - Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced its participation in upcoming OFC 2026 (Optical Fiber Communication Conference and Exhibition), taking place March 17–19, 2026 at the Los Angeles Convention Center in Los Angeles, California, booth #2221. During the event days, company representatives will be available to discuss current and future silicon photonics roadmap.

The company will showcase its popular Silicon Photonics platform that has been the top choice for the industry leaders not only for optical transceivers for Scale-Out and Telecom, but also for exciting growing applications such as co-packaged optics (CPO) for Scale-Up architecture, DWDM lasers, optical circuit switching, FMCW LiDARs for Physical AI, and quantum computing. Tower will also highlight its Silicon Germanium BiCMOS (SiGe) offerings that, together with its SiPho platform, serve the rapidly growing need for higher bandwidth, lower latency and lower power requirements of next-generation AI infrastructure.

Several joint demonstrations with company's partners are planned throughout the event; a detailed schedule will be published on Tower's events webpage.

Additional information and OFC 2026:

Dates: March 17–19, 2026

Venue: Los Angeles Convention Center, Los Angeles, California

Booth: #2221

To learn more about Tower’s advanced silicon photonics (SiPho) platform and RF & HPA technology offerings, visit here.

About Tower Semiconductor

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiPho, SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor currently owns one operating facility in Israel (200mm), two in the U.S. (200mm), and two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo and shares a 300mm facility in Agrate, Italy with STMicroelectronics. For more information, please visit: www.towersemi.com.

Safe Harbor Regarding Forward-Looking Statements

This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. 

Tower Semiconductor Company Contact:  Orit Shahar | +972-74-7377440 | oritsha@towersemi.com

Tower Semiconductor Investor Relations Contact:  Liat Avraham | +972-4-6506154 | liatavra@towersemi.com

FAQ

What did Tower Semiconductor (TSEM) announce in its March 2026 Form 6-K?

Tower Semiconductor announced its participation in OFC 2026 in Los Angeles. The company will showcase its silicon photonics platform and SiGe BiCMOS offerings for AI, telecom, and emerging applications and will have representatives available to discuss its current and future silicon photonics roadmap.

When and where will Tower Semiconductor (TSEM) participate in OFC 2026?

Tower Semiconductor will participate in OFC 2026 from March 17–19, 2026. The event takes place at the Los Angeles Convention Center in Los Angeles, California, where Tower will exhibit at booth #2221 and present its silicon photonics and SiGe-based technology solutions.

Which technologies will Tower Semiconductor (TSEM) highlight at OFC 2026?

Tower Semiconductor will highlight its silicon photonics platform and Silicon Germanium BiCMOS offerings. These platforms support optical transceivers, co-packaged optics, DWDM lasers, optical circuit switching, FMCW LiDARs for Physical AI, quantum computing, and aim to meet higher bandwidth, lower latency and lower power demands in AI infrastructure.

What applications does Tower Semiconductor’s silicon photonics platform target?

Tower Semiconductor’s silicon photonics platform targets optical transceivers for Scale-Out and telecom and several emerging uses. These include co-packaged optics for Scale-Up architectures, DWDM lasers, optical circuit switching, FMCW LiDARs for Physical AI, and quantum computing, serving rapidly evolving data and AI infrastructure needs.

How is Tower Semiconductor (TSEM) positioning itself in AI infrastructure markets?

Tower Semiconductor is emphasizing its silicon photonics and SiGe BiCMOS technologies for next-generation AI infrastructure. These platforms are designed to address rapidly growing requirements for higher bandwidth, lower latency and lower power, particularly in applications like optical interconnects, LiDARs for Physical AI, and quantum computing systems.

What markets does Tower Semiconductor (TSEM) serve with its analog foundry platforms?

Tower Semiconductor provides analog semiconductor platforms for consumer, industrial, automotive, mobile, infrastructure, medical, and aerospace and defense markets. It offers customizable technologies such as silicon photonics, SiGe, BiCMOS, RF CMOS, CMOS image sensors, power management, non-imaging sensors, displays, MEMS, and related design enablement services.