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TSMC approves $16B for advanced technology equipment

The approved allocations cover advanced technology, advanced packaging and mature or specialty technology, as well as real estate and capitalized leased assets.

(Neutral)
(Neutral)
Form Type
6-K

Rhea-AI Filing Summary

Taiwan Semiconductor Manufacturing Company Limited (TSMC) reported board-approved capital appropriations in three categories: US$16,035 million for machinery equipment for advanced technology capacity; US$4,791 million for machinery equipment for advanced packaging, mature and/or specialty technology capacity; and US$8,616 million for real estate and capitalized leased assets.

The report lists August 2026 shareholding changes for Vice Presidents B.Z. Tien and Lipen Yuan. Tien held 19,051 shares as of August 31, 2026, a listed increase of 1,000 from July 31, 2026; Yuan held 9,000 shares as of August 31, 2026, a listed increase of 2,350. Shareholdings include shares held by related parties. TSMC reported no changes in pledged shares, asset acquisitions or dispositions, unsecured bond issuances, or common-share cancellations.

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Capital appropriation — advanced technology machinery equipment US$16,035 million Approved by TSMC’s board of directors
Capital appropriation — advanced packaging, mature and/or specialty technology machinery equipment US$4,791 million Approved by TSMC’s board of directors
Capital appropriation — real estate and capitalized leased assets US$8,616 million Approved by TSMC’s board of directors
B.Z. Tien shareholding change 1,000 shares Vice President; listed change from July 31 to August 31, 2026
B.Z. Tien shares held 19,051 shares As of August 31, 2026; includes shares held by related parties
Lipen Yuan shareholding change 2,350 shares Vice President; listed change from July 31 to August 31, 2026
Lipen Yuan shares held 9,000 shares As of August 31, 2026; includes shares held by related parties
capital appropriations financial
"capital appropriations approved by TSMC board of directors"
capitalized leased assets financial
"Real estate and capitalized leased assets"
unsecured bonds financial
"The unsecured bonds issued by TSMC and its subsidiaries"
Unsecured bonds are loans a company issues that are not backed by specific assets or collateral; investors rely on the issuer’s promise to pay rather than a claim on property if the company fails. They matter to investors because they carry higher risk than secured debt—so issuers usually pay higher interest—but also sit behind secured creditors in repayment order, which affects potential recovery if the issuer defaults.

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

How much did TSM approve for capital appropriations?

TSMC’s board approved US$16,035 million for machinery equipment for advanced technology capacity, US$4,791 million for machinery equipment for advanced packaging, mature and/or specialty technology capacity, and US$8,616 million for real estate and capitalized leased assets.

What shareholding changes did TSM report for August 2026?

Vice President B.Z. Tien’s reported shareholding increased by 1,000 shares to 19,051 as of August 31, 2026, and Vice President Lipen Yuan’s increased by 2,350 shares to 9,000. The shareholding figures include shares held by related parties.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Learn about SEC filing dates

1934 Act Registration No. 1-14700
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
_____________________________
FORM 6-K
_____________________________
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
For the month of September 2026
(Commission File Number: 001-14700)
_____________________________
Taiwan Semiconductor Manufacturing Company Limited
(Translation of Registrant’s Name Into English)
_____________________________
No. 8, Li-Hsin Road 6
Hsinchu Science Park
Hsinchu 300-096, Taiwan
Republic of China
(Address of Principal Executive Offices)
_____________________________
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F  x            Form 40-F  o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):o



SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.


Taiwan Semiconductor Manufacturing Company Limited
Date:   September 24, 2026By/s/ Wendell Huang
Wendell Huang
Senior Vice President and Chief Financial Officer
   




Taiwan Semiconductor Manufacturing Company Limited
("TSMC"; NYSE: TSM)
This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors; 5) the unsecured bonds issued by TSMC and its subsidiaries and 6) the cancellation of TSMC common shares for the month of August 2026.
1.The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
TitleNameNumber of shares held as ofChanges
7/31/20268/31/2026
Vice PresidentB.Z. Tien18,05119,0511,000 
Vice PresidentLipen Yuan6,6509,0002,350 

Note: Shareholdings include shares held by the related parties.
2.The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
None.
3.The acquisition and disposition of assets by TSMC and its subsidiaries:
None.
4.The capital appropriations approved by TSMC board of directors:
(1) Machinery equipment for advanced technology capacity: US$16,035 million.
(2) Machinery equipment for advanced packaging, mature and/or specialty technology capacity: US$4,791 million.
(3) Real estate and capitalized leased assets: US$8,616 million.
5.The unsecured bonds issued by TSMC and its subsidiaries:
None.
6.The cancellation of TSMC common shares:
None.

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