TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD SEC Filings

TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Pei-Hung Chen reported an indirect purchase of 49 Common Shares (2330.TW) at $71.82 per share on May 8, 2026 through the company’s Employee Stock Purchase Plan. Following this, indirect holdings include 1,213 shares via an ESPP trust, 83,143 shares held by a spouse, and 7,036 shares via an LTI trust, alongside 433,414 shares held directly.

Taiwan Semiconductor Manufacturing Co. EVP and Co-COO Chin Yung-Pei indirectly increased his stake through the company’s Employee Stock Purchase Plan. On May 8, 2026, an ESPP trust bought 75 common shares (2330.TW) at $71.82 per share on his behalf under predetermined plan terms.

After this ESPP purchase, indirect holdings include 8,223 shares via the ESPP trust, 4,190,107 shares held by his spouse, and 63,345 shares in a Long-Term Incentive bonus plan trust, alongside 5,171,935 shares held directly. The transaction is very small relative to his overall position and appears routine and compensation-related.

Taiwan Semiconductor Manufacturing Co. Ltd. Controller Chih-Ho Chen reported a small net share increase through an employee program. On May 8, 2026, an ESPP trust associated with Chen bought 34 Common Shares (2330.TW) at $71.82 per share, under predetermined Employee Stock Purchase Plan terms.

After this purchase, the ESPP trust held 74 common shares for Chen. The filing also shows 8,000 common shares held indirectly via Homewarm Advisory Co., Ltd., 363 shares held indirectly by Chen’s spouse, and 5,367 shares held directly.

Taiwan Semiconductor Manufacturing Company Limited (TSMC) filed a Form 6-K highlighting a new strategic step with Sony Semiconductor Solutions. The two companies signed a non-binding memorandum of understanding to form a joint venture for developing and manufacturing next-generation image sensors.

Under the proposal, Sony would be the majority and controlling shareholder of the JV, which would set up development and production lines in Sony’s new fab in Koshi City, Kumamoto Prefecture. The partnership intends to combine Sony’s image sensor design capabilities with TSMC’s process technology and manufacturing strengths, targeting improved sensor performance and emerging physical AI uses in areas such as automotive and robotics.

Potential JV investments and additional capital spending by Sony in its Nagasaki plant are being discussed, with phased implementation based on market demand and expected support from the Japanese government. The JV’s creation remains subject to a definitive legally binding agreement and customary closing conditions.

Taiwan Semiconductor Manufacturing Company Limited reported strong April 2026 revenue momentum. On a consolidated basis, net revenue for April 2026 was approximately NT$410.73 billion, down 1.1% from March 2026 but up 17.5% from April 2025, showing solid year-on-year growth despite a slight month-on-month dip.

Net revenue for January through April 2026 totaled NT$1,544.83 billion, a 29.9% increase versus the same period in 2025, indicating robust demand early in the year. The company also disclosed intercompany lending limits and balances, guarantees for key subsidiaries, and foreign-exchange derivative positions with both realized losses and unrealized gains.

Taiwan Semiconductor Manufacturing Co. VP Bor-Zen Tien reported open-market purchases of 20 American Depositary Shares (ADS) of TSM on April 28, 2026, at prices of 390.0000 and 386.0000 per ADS.

Following these trades, Tien directly holds 80 ADS, plus 9,051 Common Shares (2330.TW) directly and additional Common Shares held indirectly by an immediate family member and under an Employee Stock Purchase Plan (ESPP) Trust. Each ADS represents five Common Shares.

TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Bor-Zen Tien reported updated holdings and an early redemption of a derivative note. The filing shows indirect ownership of 53 Common Shares by an immediate family member and 101 Common Shares held through an Employee Stock Purchase Plan trust, plus direct holdings of 9,051 Common Shares and 70 American Depositary Shares.

The Equity Linked Notes, with a principal amount of US$20,000 and referencing a basket that includes the company’s American Depositary Shares, were redeemed early for cash on April 24, 2026, before their June 3, 2026 exercisable/expiration date. No open-market share purchases or sales are reported.

Taiwan Semiconductor Manufacturing Company Limited reports routine corporate updates for March 2026, including changes in insider shareholdings and a new unsecured bond issuance. Senior leaders such as Chairman & CEO C.C. Wei increased their TSMC shareholdings; his position rose from 7,917,270 to 8,152,610 shares, an increase of 235,340 shares. Several executive vice presidents and vice presidents also recorded modest share increases.

TSMC issued unsecured corporate bonds under Issuance 115-1 totaling NT$17.2 billion, split into a NT$12.6 billion tranche due March 2031 with a 1.72% coupon and a NT$4.6 billion tranche due March 2036 with a 1.78% coupon. The bonds use bullet repayment with interest payable annually. The company did not cancel any common shares during the month.

Taiwan Semiconductor Manufacturing Company Limited submitted a Form 6-K describing a Board decision to revise the agenda for its 2026 Annual Shareholders’ Meeting. Report items will cover 2025 business results, the Audit and Risk Committee’s review, earnings distribution, directors’ compensation, employees’ profit sharing bonuses, and issuance of unsecured corporate bonds.

Proposed resolutions now include accepting the 2025 Business Report and Financial Statements and newly added items to revise the Articles of Incorporation and to revise the Procedures for Acquisition or Disposal of Assets.