Axcelis Tech Ord Stock Price, News & Analysis

Axcelis (NASDAQ: ACLS) will participate in two investor conferences this fall and winter 2025: the Wells Fargo 9th Annual TMT Summit on November 18, 2025 at Terranea Resort in Rancho Palos Verdes, CA, and the 14th Annual NYC Summit on December 16, 2025 at Mastro's Steakhouse in New York, NY.

The appearances present opportunities for investor updates and meetings with company management during the specified dates and venues.

Axcelis (Nasdaq: ACLS) reported third-quarter 2025 results with revenue of $213.6 million, GAAP gross margin of 41.6% and GAAP diluted EPS of $0.83. Non-GAAP diluted EPS was $1.21 and Adjusted EBITDA was $43.2 million. Management highlighted record CS&I revenue, strong operating leverage, and over $590 million in cash and investments on the balance sheet.

The company provided fourth-quarter 2025 guidance of approximately $215 million revenue, GAAP EPS of about $0.76, and non-GAAP EPS of about $1.12. Management reiterated the proposed merger with Veeco Instruments as a strategic milestone intended to create a larger semiconductor equipment company.

Axcelis (Nasdaq: ACLS) will release third quarter 2025 financial results before market open on Tuesday, November 4, 2025. The company will host a conference call the same day at 8:30 a.m. ET to discuss the results.

The call will be available via webcast on the Investors page at www.axcelis.com or by registering at the provided registration link. Webcast replays will be available for 30 days after the call.

Axcelis Technologies (NASDAQ:ACLS) and Veeco Instruments have announced a transformative all-stock merger creating a semiconductor equipment company with an estimated $4.4 billion enterprise value. Under the agreement, Veeco shareholders will receive 0.3575 Axcelis shares for each Veeco share, resulting in Axcelis shareholders owning 58% and Veeco shareholders 42% of the combined entity.

The merged company will be headquartered in Beverly, Massachusetts, with Dr. Russell Low as CEO. On a pro-forma basis for FY2024, the combined company generated $1.7 billion in revenue, 44% non-GAAP gross margin, and $387 million in adjusted EBITDA. The merger is expected to achieve $35 million in annual cost synergies within 24 months and be accretive to non-GAAP earnings per share within the first year post-closing.

Axcelis Technologies (NASDAQ: ACLS) announced its participation in the International Conference on Silicon Carbide and Related Materials (ICSCRM 2025), scheduled for September 14-19, 2025, in Busan, South Korea. The company will showcase its new Purion Power Series+™ and GSD Ovation ES platforms for next-generation power devices.

Three technical presentations will be delivered at the conference, focusing on superjunction industrialization, high-energy channeling implantation processes, and thermal oxidation effects. CEO Dr. Russell Low emphasized the importance of ICSCRM as a key technology forum in the power semiconductor market and highlighted Axcelis's technical expertise in silicon carbide applications.

Axcelis Technologies (NASDAQ: ACLS) has launched its new Purion Power Series+™ ion implant platform, designed for next-generation power devices and superjunction architectures. The platform includes multiple product extensions: Purion H200+ SiC for high current medium energy, Purion M+ SiC for medium current, and Purion XE+ SiC and Purion EXE+ SiC for high energy applications.

The innovative platform offers flexibility to handle multiple wafer sizes (150mm and 200mm), various substrate types (SiC, Si, GaN, GaAs), and different implant temperatures while delivering industry-leading throughput and capital efficiency. This launch reinforces Axcelis' position as the innovation and market leader in ion implantation solutions for power devices.

Axcelis Technologies (NASDAQ: ACLS) has launched its new GSD Ovation™ ES high current ion implanter, specifically designed for engineered substrates. The system represents an evolution of the GSD Ovation Series platform and delivers enhanced capabilities for high current Hydrogen & Helium implant applications, including wafer splitting.

The new system offers superior flexibility and capital efficiency, featuring production-proven wafer handling capability for multiple substrate types including SiC, LiTaO3, and LiNbO3. Notable features include superior beam power, advanced wafer cooling capability, and compatibility with various substrate thicknesses and weights. The system is currently available with factory demo capabilities.

Axcelis Technologies (NASDAQ:ACLS), a leading ion implantation solutions provider for the semiconductor industry, participated in the KORUS Business Roundtable on August 25, 2025, in Washington D.C. The event featured U.S. Secretary of Commerce Howard W. Lutnick and South Korean President Lee Jae Myung, focusing on advancing collaboration, investment, and innovation between the two countries.

Axcelis President and CEO Russell Low emphasized the company's commitment to strengthening international partnerships and their role in delivering high-quality products efficiently. The company aims to build upon its existing relationships with Korean customers and partners amid increased semiconductor industry investments.

Axcelis Technologies (NASDAQ: ACLS), a leading provider of ion implantation solutions for the semiconductor industry, has announced its participation in three upcoming investor conferences in September 2025.

The company will attend the Benchmark Tech, Media & Telecom Conference on September 4th at the New York Athletic Club, the Citi Global TMT Conference on September 5th at the New York Hilton Midtown, and the B. Riley Securities Consumer & TMT Conference on September 10th at the Sofitel, New York.