Axcelis Announces Participation in SEMICON Japan 2024
Axcelis Technologies (Nasdaq: ACLS) will showcase its Purion™ and GSD Ovation™ Series of ion implanters at SEMICON Japan 2024, taking place December 11-13 at Tokyo Big Sight.
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Rhea-AI Summary
Axcelis Technologies (Nasdaq: ACLS) will showcase its Purion™ and GSD Ovation™ Series of ion implanters at SEMICON Japan 2024, taking place December 11-13 at Tokyo Big Sight. The company will present its comprehensive product lineup, including the Purion Power Series™ for silicon and silicon carbide wafer processing, Purion H™ Series for high current operations, and other specialized implanter solutions. The event will feature a technical presentation on SiC Power Device Manufacturing Ion Implant Technology and a networking reception. Axcelis aims to expand its market share in Japan by providing advanced ion implant technology to local chipmakers.
Positive
- Expanding market presence in Japan with growing installed base
- Comprehensive product portfolio covering multiple semiconductor applications
- Technical capabilities to handle multiple wafer sizes (150mm, 200mm, 300mm)
Negative
- None.
Details
News Market Reaction – ACLS
The recorded move for ACLS in the trading session of this news was -1.38%.
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Semiconductor manufacturers are invited to visit the Axcelis exhibit to learn first-hand about innovative ion implant solutions that deliver significant technology and manufacturing advantages.
- Purion Power Series™ - Featuring Axcelis' innovative solution for thin silicon, TAIKO and silicon carbide (SiC) wafer processing across the full power device applications space, and wafer handling capable for 150mm, 200mm and 300mm wafers.
- Purion H™ Series - Offering unmatched purity and precision while achieving industry leading productivity across the full high current operating space.
- Purion H200™ - Axcelis' state of the art single wafer high current medium energy implanter designed to address the unique implant needs for devices designed for the Internet of Things (IoT) and power applications.
- Purion XE™ Series - The industry leading high energy implant platform with the widest energy range, including the Purion XEmax model featuring patented Boost Technology™ for the most advanced image sensor applications up to 15MeV.
- Purion M™ Series - The lowest power consumption medium current implanter offering the broadest range of mid-current doses available, and unparalleled flexibility to meet today's evolving implant requirements.
- GSD Ovation™ - Providing the most cost-effective way to extend high current and high energy batch platform capability by supporting emerging applications in wafer splitting (Si and SiC) and alternate substrates (lithium tantalate and ceramic).
During the show, Axcelis will also host the following events on Thursday, Dec. 12th:
- SiC Power Device Manufacturing Ion Implant Technology
Exhibitor's TechSPOT Hall 5, 15:30 - 15:50 p.m.
The power device market is at a critical inflection point as chipmakers transition from 150mm to 200mm SiC wafers. Ion implant equipment needs to offer the flexibility to handle multiple wafer sizes, various substrate types and operate at various implant temperatures. Please join us to learn about Axcelis' Silicon & Silicon Carbide (SiC) power semiconductor product line, SiC implant Al ion sources and productivity options and Si IGBT wafer handling and proton (H+) implant solutions. - Axcelis Happy Hour Celebration
Hall 4 Booth #4261, 16:00 – 17:00 p.m.
Join us for beverages and appetizers and meet the Axcelis team!
President and CEO of Axcelis Technologies Russell Low, said, "We're excited to be a part of this important market and the opportunity to provide the most advanced ion implant technology to
Charles Pieczulewski, Axcelis Country Manager,
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in
AXCELIS CONTACTS:
Charles Pieczulewski (Country Manager,
Global:
Maureen Hart (Editorial/Media) +1.978.787.4266
David Ryzhik (Investor Relations) +1.978.787.2352
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SOURCE Axcelis Technologies, Inc.
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