Aehr Test Systems to Present at William Blair 46th Annual Growth Stock Conference on June 2

Aehr Test Systems (NASDAQ:AEHR) announced that President and CEO Gayn Erickson and CFO Chris Siu will present at the William Blair 46th Annual Growth Stock Conference in Chicago on June 2 at 4:40 p.m. CT.

Rhea-AI Summary

Aehr Test Systems (NASDAQ:AEHR) announced that President and CEO Gayn Erickson and CFO Chris Siu will present at the William Blair 46th Annual Growth Stock Conference in Chicago on June 2 at 4:40 p.m. CT.

Investors can access a live or replay audio webcast via Aehr’s investor relations website and may also schedule meetings with management through William Blair or Aehr’s investor relations firm.

Argus May 29 session

-7.66% close to close Open Argus

Details

News Market Reaction – AEHR

In the May 29 session, AEHR declined 7.66%, reflecting a notable negative market reaction.

Data tracked by StockTitan Argus on the day of publication.

Market Context

The stock moved -7.7% in the session following this news. A negative reaction despite a routine conf...

Analysis

The stock moved -7.7% in the session following this news. A negative reaction despite a routine conference announcement fits a pattern where not all news flow has supported gains, as seen after the prior earnings-date release with a -7.4% move. With the stock trading well above its 200-day MA and close to its 52-week high, expectations may already be elevated. Past history shows that absent fresh fundamentals like bookings or major orders, event-only headlines have not always supported sustained strength.

Key Figures

Conference edition: 46th Annual Conference date: June 2 Presentation time CT: 4:40pm CT +1 more

Conference edition

46th Annual

William Blair Growth Stock Conference

Conference date

June 2

Presentation date in Chicago

Presentation time CT

4:40pm CT

Scheduled conference presentation slot

Presentation time PT

2:40pm PT

Equivalent Pacific Time for presentation

Historical Context

5 past events · Latest: May 21

5 events

1. May 21

   Investor conference

   24h Move

   +10.9%

   Participation in Craig-Hallum institutional investor conference meetings.

2. Apr 16

   AI order win

   24h Move

   +10.4%

   Record $41M production order and >$92M second-half bookings from AI customer.

3. Apr 07

   AI bookings update

   24h Move

   +25.7%

   Reported $37.2M Q3 bookings and strong AI and data center demand.

4. Mar 31

   New customer win

   24h Move

   +23.1%

   Initial order from major new silicon photonics customer for FOX-XP systems.

5. Mar 30

   Earnings date set

   24h Move

   -7.4%

   Announcement of Q3 fiscal 2026 results release and conference call timing.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

burn-in, silicon photonics, gallium nitride, optical input/output (I/O), +2 more

6 terms

burn-in technical

"provider of test and burn-in solutions for semiconductor devices used in artificial"

Burn-in is a manufacturing test where new devices or components are operated under stress for a set period to surface early failures before products ship. Investors care because effective burn-in reduces returns, warranty costs and reputation risk, and signals production quality; like driving a new car on a rough road to reveal hidden defects before selling it to customers.

silicon photonics technical

"including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers"

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

gallium nitride technical

"silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers"

Gallium nitride is a durable semiconductor material used to make electronic components that switch faster, handle higher voltages, and waste less energy than older silicon parts. Think of it as a lighter, more efficient motor in an appliance: it lets devices shrink, run cooler and save power, which can lower manufacturing costs, enable new products and boost sales or margins for companies that adopt it—key factors investors watch.

optical input/output (I/O) technical

"gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O)."

Optical input/output (I/O) is the use of light—typically through fiber or tiny lasers—to send and receive digital data between chips, devices or systems instead of using electrical wires. For investors it matters because optical I/O can dramatically increase data speed and capacity while lowering power use and heat, similar to upgrading narrow local roads to high‑speed highways that carry much more traffic with less congestion, which can boost performance and reduce operating costs in data centers and networks.

wafer-level technical

"We are seeing strong traction with AI processors in both wafer-level and package-level formats."

Wafer-level describes manufacturing steps performed on a whole round silicon slice (the wafer) before it is cut into individual chips, similar to frosting and testing a cookie sheet before breaking it into single cookies. Doing work at the wafer level can lower per-chip cost, shrink final package size, speed production and improve quality, so it matters to investors because it can boost margins, supply efficiency and the competitiveness of semiconductor products.

package-level technical

"We are seeing strong traction with AI processors in both wafer-level and package-level formats."

Package-level describes attributes, tracking, or regulatory status tied to each finished product package—the individual unit shipped or sold to customers—such as labeling, serial numbers, barcodes, contents, and compliance records. Investors pay attention because problems or changes at the package-level (recalls, labeling errors, unit pricing, or reimbursement rules) directly affect sales, costs and legal risk; it’s like inspecting and certifying every item on a store shelf to ensure it can be sold and billed correctly.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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FREMONT, CA / ACCESS Newswire / May 28, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that that President and CEO Gayn Erickson and CFO Chris Siu will be presenting at the William Blair 46^th Annual Growth Stock Conference in Chicago on Tuesday, June 2 at 4:40pm CT (2:40pm PT)and will be meeting with institutional investors throughout the day.

You may register to access a live or replay audio webcast of the presentation via a link posted to the investor relations section of Aehr's website at www.aehr.com or by clicking here.

"We look forward to discussing with investors and shareholders Aehr's expanding role in enabling the next generation of semiconductor devices across a wide range of markets," said Mr. Erickson. "Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems."

For additional information, or to schedule a meeting with Aehr management, please contact your William Blair representative, or Aehr's investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.

# # #

Contacts:

Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com

PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

SOURCE: Aehr Test Systems

View the original press release on ACCESS Newswire

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

When will Aehr Test Systems (NASDAQ:AEHR) present at the William Blair 46th Annual Growth Stock Conference?

Aehr Test Systems is scheduled to present on June 2 at 4:40 p.m. CT. According to Aehr Test Systems, the event takes place in Chicago, with management also meeting institutional investors throughout the day.

How can investors access the Aehr Test Systems (AEHR) William Blair conference webcast?

Investors can access a live or replay audio webcast through a link on Aehr’s investor relations website. According to Aehr Test Systems, registration is required to listen to the presentation online.

Who will present for Aehr Test Systems (AEHR) at the William Blair 46th Annual Growth Stock Conference?

Aehr’s President and CEO Gayn Erickson and CFO Chris Siu will present at the conference. According to Aehr Test Systems, they will discuss the company’s role in testing semiconductor devices across AI, automotive, data center, and industrial markets.

What topics will Aehr Test Systems (AEHR) cover during the William Blair growth conference presentation?

The presentation will focus on Aehr’s test and burn-in solutions for advanced semiconductor devices. According to Aehr Test Systems, they plan to highlight applications in AI processors, silicon carbide for electric vehicles, gallium nitride power conversion, and silicon photonics for data centers and 5G.

Why is Aehr Test Systems’ (AEHR) appearance at the William Blair conference important for investors?

The appearance gives investors direct insight into Aehr’s technology and growth drivers. According to Aehr Test Systems, management will discuss traction in wafer-level and package-level test and burn-in, and the company’s expanding role in next-generation semiconductor markets.

How can investors schedule a meeting with Aehr Test Systems management during the William Blair conference?

Investors can arrange meetings through their William Blair representative or Aehr’s investor relations firm. According to Aehr Test Systems, PondelWilkinson can be contacted via the email address jbyers@pondel.com for additional information or scheduling.