Applied Materials Accelerates Chip Defect Review with Next-Gen eBeam System

Rhea-AI Summary

Applied Materials has introduced the SEMVision H20, a new defect review system designed to enhance semiconductor manufacturing. The system combines advanced electron beam (eBeam) technology with AI image recognition to analyze nanoscale defects in leading-edge chips.

The system features second-generation cold field emission (CFE) technology, delivering up to 50% increased nanoscale image resolution and 10X faster imaging compared to conventional thermal field emission. The H20 can process results up to 3X faster than current techniques.

Key innovations include sub-nanometer resolution for identifying buried defects and deep learning AI capabilities that automatically distinguish true defects from false alarms. The system is particularly important for complex 3D architecture in 2nm node logic chips and higher-density memory manufacturing. Leading logic and memory chipmakers have already adopted the technology for emerging nodes.

Positive

• New SEMVision H20 system delivers 3X faster defect analysis results
• 50% increase in nanoscale image resolution compared to conventional technology
• 10X faster imaging speed versus traditional thermal field emission
• System already adopted by leading logic and memory chipmakers

Negative

• None.

Insights

Semiconductor Manufacturing Technology Expert

The launch of SEMVision H20 marks a pivotal advancement in semiconductor manufacturing technology that strengthens Applied Materials' competitive moat in the critical process control segment. The system's ability to deliver 3X faster results while maintaining superior accuracy directly addresses one of the most pressing challenges in advanced chip manufacturing - the exponential increase in potential defect sites that require review.

The significance of this innovation extends beyond mere technical improvements. In the semiconductor industry, where yield rates directly impact profitability, the system's enhanced defect detection capabilities represent substantial value for chip manufacturers. The 50% increase in nanoscale image resolution combined with 10X faster imaging speed enables manufacturers to maintain quality control while scaling to more complex chip architectures, particularly important for 2nm node production and advanced memory devices.

From a market perspective, this launch reinforces Applied Materials' leadership in the semiconductor equipment sector. The integration of second-generation CFE technology with AI-driven defect classification creates significant barriers to entry, as competitors would need to develop both advanced electron beam technology and sophisticated AI models to match these capabilities. This technological advantage is particularly valuable as the industry transitions to more complex Gate-All-Around transistors and higher-density memory architectures.

The timing of this release is strategically important, coinciding with the industry's push toward more advanced nodes and 3D chip architectures. By enabling faster and more accurate defect analysis, AMAT is positioning itself to capture increased market share in the high-margin process control segment, while helping customers accelerate their technology roadmaps and improve factory economics through better yield rates and reduced cycle times.

• SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips
• Second-generation “cold field emission” technology provides high-resolution imaging
• AI image recognition speeds up defect detection and classification
  

SANTA CLARA, Calif., Feb. 19, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced a new defect review system to help leading semiconductor manufacturers continue pushing the limits of chip scaling. The company’s SEMVision™ H20 system combines the industry’s most sensitive electron beam (eBeam) technology with advanced AI image recognition to enable better and faster analysis of buried nanoscale defects in the world’s most advanced chips.

eBeam imaging has long been an important tool for examining defects that are too small to be seen with optical techniques. Its ultra-high resolution enables analysis of the tiniest imperfections in a sea of billions of nanoscale circuit patterns. Traditionally, optical techniques are used to scan a wafer for potential defects, and then eBeam is deployed to better characterize these defects. In the emerging “angstrom era” – where the smallest chip features can be just a few atoms thick – it is becoming increasingly difficult to differentiate true defects from false alarms.

At today’s most advanced nodes, optical inspection creates much denser defect maps, which can require as much as a 100X increase in the number of defect candidates delivered to eBeam review. Process control engineers increasingly need defect review systems that can analyze exponentially more samples while maintaining the speed and sensitivity required for high-volume production.

“Our new SEMVision H20 system allows the world’s leading chipmakers to better separate the signal from the noise amidst massive amounts of data provided by inspection tools,” said Keith Wells, Group Vice President of Imaging and Process Control at Applied Materials. “By combining advanced AI algorithms with the superior speed and resolution of our innovative eBeam technology, our system enables rapid identification of the smallest defects buried deep in 3D device structures, delivering faster and more accurate inspection results that can improve factory cycle time and yield.”

Applied’s new eBeam technology is critical for complex 3D architecture inflections required to manufacture logic chips at the 2nm node and beyond – including new Gate-All-Around (GAA) transistors – as well as the formation of higher-density DRAM and 3D NAND memories. Applied’s SEMVision H20 defect review system has been adopted by leading logic and memory chipmakers for emerging technology nodes.

The new SEMVision H20 system leverages two significant innovations to classify defects with remarkable accuracy, while delivering results as much as 3X faster than today’s most advanced techniques.

• Next-generation CFE technology: Applied’s “cold field emission” (CFE) technology is a breakthrough in eBeam imaging that enables sub-nanometer resolution for identifying the smallest buried defects. Operating at room temperature, CFE produces a narrower beam with more electrons, thereby increasing nanoscale image resolution by up to 50 percent and imaging speed by up to 10X compared to conventional thermal field emission (TFE) technology. With SEMVision H20, Applied is introducing the second generation of its CFE technology, delivering even faster throughput while maintaining the industry’s highest sensitivity and resolution. This faster imaging speed provides increased coverage across each wafer, allowing chipmakers to gather the same amount of information in one third of the time.
  
• Deep learning AI image models: SEMVision H20 uses deep learning AI capabilities for automatic extraction of true defects from false “nuisance” defects. Applied’s proprietary deep learning network is continuously trained with data from a chipmaker’s fab and sorts the defects into a distribution including voids, residues, scratches, particles and dozens of other defect types, enabling more accurate and efficient defect characterization.
  

Applied’s SEMVision product family is the most advanced and widely used eBeam review system in the world. The new SEMVision H20 extends this leadership by combining next-generation CFE technology and advanced AI models to deliver faster and more accurate defect analysis, allowing chipmakers to accelerate chip development and make greater use of eBeam technology in high-volume manufacturing.

About Applied Materials
Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible a better future. Learn more at www.appliedmaterials.com.

Applied Materials Contact:
Ricky Gradwohl (editorial/media) 408.235.4676
Liz Morali (financial community) 408.986.7977

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/80511701-73c9-406d-8cb0-aeb0793e4497

FAQ

What are the key features of Applied Materials' new SEMVision H20 system (AMAT)?

The SEMVision H20 features second-generation cold field emission technology, AI-powered defect detection, sub-nanometer resolution, and up to 3X faster processing speeds compared to current techniques.

How much faster is AMAT's new SEMVision H20 imaging compared to conventional technology?

The SEMVision H20's cold field emission technology delivers up to 10X faster imaging speed compared to conventional thermal field emission technology.

What improvement in image resolution does AMAT's SEMVision H20 provide?

The SEMVision H20 increases nanoscale image resolution by up to 50% compared to conventional thermal field emission technology.

Which semiconductor manufacturers have adopted AMAT's SEMVision H20 system?

The SEMVision H20 system has been adopted by leading logic and memory chipmakers for their emerging technology nodes.

What chip manufacturing nodes is AMAT's SEMVision H20 designed for?

The system is designed for 2nm node and beyond logic chips, including Gate-All-Around transistors, as well as higher-density DRAM and 3D NAND memories.