Broadcom Announces Third-Generation Co-Packaged Optics (CPO) Technology with 200G/lane Capability
Broadcom (NASDAQ: AVGO) has unveiled its third-generation co-packaged optics (CPO) technology featuring 200G per lane capability, marking a significant advancement in AI networking solutions. This announcement builds on Broadcom's successful CPO journey, which began in 2021 with the first-generation Tomahawk 4-Humboldt chipset and progressed to the second-generation Tomahawk 5-Bailly volume-production solution.
The company has demonstrated ecosystem readiness through key partnerships with Corning, Delta Electronics, Foxconn Interconnect Technology, Micas Networks, and Twinstar Technologies. These collaborations have resulted in significant improvements in OSAT processes, thermal designs, and overall manufacturing yield. The new 200G/lane CPO technology is specifically designed for next-generation high-radix scale-up and scale-out networks, crucial for enabling scale-up domains exceeding 512 nodes.
Broadcom (NASDAQ: AVGO) ha presentato la sua tecnologia di ottica co-impacchettata (CPO) di terza generazione con una capacità di 200G per lane, rappresentando un importante progresso nelle soluzioni di networking per l'IA. Questo annuncio si basa sul successo del percorso CPO di Broadcom, iniziato nel 2021 con il chipset di prima generazione Tomahawk 4-Humboldt e proseguito con la soluzione di produzione di massa di seconda generazione Tomahawk 5-Bailly.
L'azienda ha dimostrato la prontezza dell'ecosistema attraverso collaborazioni chiave con Corning, Delta Electronics, Foxconn Interconnect Technology, Micas Networks e Twinstar Technologies. Queste partnership hanno portato a miglioramenti significativi nei processi OSAT, nei design termici e nel rendimento complessivo della produzione. La nuova tecnologia CPO da 200G per lane è progettata specificamente per le reti di prossima generazione ad alta radice, sia scale-up che scale-out, fondamentali per supportare domini scale-up con oltre 512 nodi.
Broadcom (NASDAQ: AVGO) ha presentado su tecnología de óptica co-empaquetada (CPO) de tercera generación con una capacidad de 200G por carril, marcando un avance significativo en soluciones de redes para IA. Este anuncio se basa en el exitoso recorrido CPO de Broadcom, que comenzó en 2021 con el chipset de primera generación Tomahawk 4-Humboldt y avanzó hasta la solución de producción en volumen de segunda generación Tomahawk 5-Bailly.
La compañía ha demostrado la preparación del ecosistema a través de asociaciones clave con Corning, Delta Electronics, Foxconn Interconnect Technology, Micas Networks y Twinstar Technologies. Estas colaboraciones han resultado en mejoras significativas en los procesos OSAT, diseños térmicos y el rendimiento general de fabricación. La nueva tecnología CPO de 200G por carril está diseñada específicamente para redes de próxima generación de alta radice, tanto scale-up como scale-out, crucial para habilitar dominios scale-up que superen los 512 nodos.
Broadcom (NASDAQ: AVGO)는 레인당 200G 성능을 갖춘 3세대 공동 패키지 광학(CPO) 기술을 공개하며 AI 네트워킹 솔루션에서 중요한 진전을 이루었습니다. 이번 발표는 2021년 1세대 Tomahawk 4-Humboldt 칩셋으로 시작해 2세대 Tomahawk 5-Bailly 대량 생산 솔루션으로 발전한 Broadcom의 성공적인 CPO 여정을 기반으로 합니다.
회사는 Corning, Delta Electronics, Foxconn Interconnect Technology, Micas Networks, Twinstar Technologies와의 주요 파트너십을 통해 생태계 준비성을 입증했습니다. 이러한 협력은 OSAT 공정, 열 설계 및 전반적인 제조 수율에서 큰 개선을 가져왔습니다. 새로운 200G/레인 CPO 기술은 512개 이상의 노드를 지원하는 차세대 고래디스 스케일업 및 스케일아웃 네트워크를 위해 특별히 설계되었습니다.
Broadcom (NASDAQ : AVGO) a dévoilé sa technologie d’optique co-emballée (CPO) de troisième génération avec une capacité de 200G par voie, marquant une avancée majeure dans les solutions réseau pour l’IA. Cette annonce s’appuie sur le parcours réussi de Broadcom en CPO, commencé en 2021 avec le chipset de première génération Tomahawk 4-Humboldt et poursuivi avec la solution de production de masse de deuxième génération Tomahawk 5-Bailly.
L’entreprise a démontré la maturité de son écosystème grâce à des partenariats clés avec Corning, Delta Electronics, Foxconn Interconnect Technology, Micas Networks et Twinstar Technologies. Ces collaborations ont permis d’importantes améliorations dans les processus OSAT, les conceptions thermiques et le rendement global de fabrication. La nouvelle technologie CPO 200G par voie est spécifiquement conçue pour les réseaux de prochaine génération à haute radice, en scale-up et scale-out, essentiels pour permettre des domaines scale-up dépassant 512 nœuds.
Broadcom (NASDAQ: AVGO) hat seine dritte Generation der Co-Packaged Optics (CPO) Technologie mit einer 200G pro Lane Fähigkeit vorgestellt, was einen bedeutenden Fortschritt in KI-Netzwerklösungen darstellt. Diese Ankündigung baut auf Broadcoms erfolgreichem CPO-Weg auf, der 2021 mit dem Tomahawk 4-Humboldt Chip der ersten Generation begann und sich zur volumenproduzierten Lösung der zweiten Generation Tomahawk 5-Bailly weiterentwickelte.
Das Unternehmen hat die Bereitschaft des Ökosystems durch wichtige Partnerschaften mit Corning, Delta Electronics, Foxconn Interconnect Technology, Micas Networks und Twinstar Technologies demonstriert. Diese Kooperationen führten zu erheblichen Verbesserungen bei OSAT-Prozessen, thermischen Designs und der gesamten Fertigungsausbeute. Die neue 200G/Lane CPO-Technologie ist speziell für nächste Generationen von High-Radix Scale-Up- und Scale-Out-Netzwerken konzipiert, die entscheidend sind, um Scale-Up-Domänen mit mehr als 512 Knoten zu ermöglichen.
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Insights
Broadcom's 3rd-gen CPO technology represents a significant advancement in AI networking infrastructure, positioning them as industry leaders in high-performance optical interconnects.
Broadcom has unveiled its third-generation co-packaged optics (CPO) technology featuring 200G/lane capability, a significant technological leap in optical interconnects for data centers and AI applications. This announcement builds on their established leadership in the CPO space, which began with their first-generation Tomahawk 4-Humboldt chipset in 2021 and continued with their second-generation Tomahawk 5-Bailly (TH5-Bailly) chipset—the industry's first volume-production CPO solution.
The significance of this advancement cannot be overstated. Traditional data centers face increasing challenges with power consumption and thermal management as AI workloads demand more bandwidth. CPO technology addresses these challenges by directly integrating optical components with switch ASICs, dramatically reducing power requirements while increasing bandwidth density. The jump to 200G/lane represents approximately double the per-lane performance of their previous generation.
What makes this announcement particularly impactful is the ecosystem readiness. Broadcom has secured partnerships with key industry players including Corning (fiber and connector technology), Delta Electronics (production of TH5-Bailly 51.2T CPO Ethernet switch), Foxconn Interconnect Technology (CPO LGA sockets), Micas Networks (network switch systems with 30% power savings), and Twinstar Technologies (high-density CPO fiber cables). These partnerships demonstrate that Broadcom's CPO technology isn't merely theoretical but has achieved production readiness.
From a technical perspective, the 200G/lane capability is crucial for next-generation AI networking infrastructure. It enables scale-up domains exceeding 512 nodes while addressing bandwidth, power, and latency challenges associated with increasing foundation model parameters. This technology is particularly valuable for reducing the cost per token in large language models and other AI applications where interconnect performance directly impacts system efficiency.
Broadcom's roadmap indicates continued innovation with a fourth-generation 400G/lane solution in development, reinforcing their commitment to maintaining leadership in this critical technology sector. Their focus on open standards and system-level optimization should help accelerate industry adoption of these advanced optical interconnect solutions.
Key partner milestones with CPO switches demonstrate ecosystem readiness for next-generation AI scale-up and scale-out networks
PALO ALTO, Calif., May 15, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced significant advancements in its co-packaged optics (CPO) technology with the launch of its third-generation 200G per lane (200G/lane) CPO product line. In addition to the 200G/lane breakthrough, Broadcom demonstrated the maturity of its second-generation 100G/lane CPO products and ecosystem, highlighting key improvements in OSAT processes, thermal designs, handling procedures, fiber routing, and overall yield. A growing list of publicly-announced industry partners further underscores Broadcom's CPO platform readiness, enabling AI scale-out and scale-up applications for large AI deployments.
Broadcom’s Legacy in CPO
Broadcom’s leadership in CPO began in 2021 with its first-generation Tomahawk 4-Humboldt chipset, enabling an early learning cycle across the entire CPO supply chain, well ahead of the industry. This pioneering chipset introduced key innovations, including high-density integrated optical engines, edge coupling, and detachable fiber connectors.
Building on that success, the second-generation Tomahawk 5-Bailly (TH5-Bailly) chipset became the industry’s first volume-production CPO solution. As part of the TH5-Bailly production, Broadcom focused on automated testing and scalable manufacturing processes, setting the stage for high-volume production of future generations. The deployment of Broadcom’s 100G/lane CPO product line has enabled the company to gain unmatched expertise in CPO system design, seamlessly integrating optical and electrical components to maximize the performance while delivering the lowest power optical interconnects in the industry.
Today, with the announcement of the third-generation 200G/lane CPO product line, alongside commitment to developing a fourth-generation 400G/lane solution, Broadcom continues to lead the industry in delivering the lowest power and highest bandwidth density optical interconnects.
A Rapidly Developing CPO Ecosystem
Broadcom’s leadership in CPO is driven not only by its cutting-edge switch ASICs and optical engine technology but also by a comprehensive ecosystem of passive optical components, interconnects, and system solutions partners. Through its 100G/lane CPO product line, Broadcom has proven its ability to scale its technology, meeting the growing demands of inference-based AI and supporting the next wave of AI-driven applications.
“Broadcom has spent years perfecting our CPO platform solutions, as evidenced by the maturity of our second generation 100G/lane products and the ecosystem readiness,” said Near Margalit, Ph. D., vice president and general manager of the Optical Systems Division, Broadcom. “With our third-generation 200G/lane CPO solutions, we are once again setting the bar for the next-generation of AI interconnects. Our commitment to delivering the industry-leading performance, power efficiency, and scalability will help our customers meet the demands of today’s rapidly evolving AI infrastructure.”
Key Partner Milestones Towards Mass Deployment
Broadcom’s advancements in CPO technology are supported by the growing number of key publicly announced partnerships across the ecosystem, as several major collaborators announced significant milestones this week:
- Corning Incorporated announced collaboration with Broadcom on advanced fiber and connector technology including shipments of components on the TH5-Bailly platform.
- Delta Electronics announced production for the TH5-Bailly 51.2T CPO Ethernet switch in a compact 3RU form factor, available in both air-cooled and liquid-cooled configurations.
- Foxconn Interconnect Technology revealed the production release of CPO LGA sockets and Pluggable Laser Source (PLS) cages and connectors, critical components for ensuring reliable, high-performance system integration.
- Micas Networks announced production of the TH5-Bailly network switch system that delivers more than
30% system level power savings compared to systems with traditional pluggable modules. - Twinstar Technologies celebrated milestone volume shipments of high-density CPO fiber cables, further enabling the scaling of optical interconnects in next-gen data center infrastructures.
These partner milestones demonstrate the continued progress in building a complete, fully integrated CPO ecosystem that enables the next generation of AI networking solutions.
Gen 3 CPO: Unlocking 200G/lane CPO Systems
Broadcom’s 200G/lane CPO technology is designed for next-generation, high-radix scale-up and scale-out networks, which will demand parity with copper interconnect reliability and power efficiency. This capability is crucial for enabling scale-up domains exceeding 512 nodes, while also addressing the bandwidth, power, and latency challenges associated with the increasing size of next-generation foundation model parameters.
Broadcom’s Gen 3 solutions are engineered to address scale-up interconnects, where issues such as link flaps and operational disruptions can significantly affect the industry’s ability to achieve the lowest cost per token. Broadcom’s Gen 3 and 4 roadmap includes close collaboration with ecosystem partners to optimize the integration of CPO solutions, ensuring they meet the demanding requirements of hyperscale data centers and AI workloads. Additionally, Broadcom remains committed to open standards and system-level optimization, which are essential to the continued success and evolution of our CPO technology.
For more information on Broadcom’s CPO technology and latest advancements, please click here: www.broadcom.com/cpo
Supporting Quotes
“Corning has been collaborating with Broadcom for several years to ensure that their CPO connectivity needs can be met with a high degree of performance and reliability as AI-enabled datacenters continue to scale,” said Mike O’Day, Senior Vice President and General Manager, Corning Optical Communications. “We're delivering an optical connectivity solution that enables unprecedented levels of optical speeds and bandwidth concentrations with lower power consumptions and costs. Corning looks forward to continued collaboration with Broadcom on their Bailly deployments as well as innovating towards next generation 200G per lane CPO systems.”
“We are excited to bring this state-of-the-art CPO switch to market, empowering data centers to achieve even greater efficiency and performance,” said Wangson Wang, General Manager of Data Networks Infrastructure BU at Delta. “Our goal is to support the next generation of networking infrastructure with innovative solutions that deliver unparalleled speed, reduced energy consumption, and scalable growth for AI networks.
“We’re deepening our partnership with Broadcom to drive innovation in 200G co-packaged optics,” said Joseph Wang, Chief Technology Officer at Foxconn Interconnect Technology. “Our joint efforts are aimed at delivering AI infrastructure that’s ready for scale—built on high-performance, energy-efficient interconnects designed for tomorrow’s data demands.”
“At Micas Networks, we’re excited to see Broadcom pushing the boundaries of networking technology with their next-generation 200G per lane CPO solutions. Our collaboration with Broadcom has been instrumental in launching the industry's first volume production, 100G per lane, CPO system delivering ultra low-power optical interconnects into AI fabrics,” said Joey Gou, CEO of Micas Networks. “Now, with a 200G per lane version, we’re pushing even further into ultra-fast, power-efficient networking that will enable a range of next-gen applications. We look forward to continuing our partnership with Broadcom to support the evolving demands of the data-driven world.”
About Broadcom
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops, and supplies a broad range of semiconductor, enterprise software and security solutions. Broadcom's category-leading product portfolio serves critical markets including cloud, data center, networking, broadband, wireless, storage, industrial, and enterprise software. Our solutions include service provider and enterprise networking and storage, mobile device and broadband connectivity, mainframe, cybersecurity, and private and hybrid cloud infrastructure. Broadcom is a Delaware corporation headquartered in Palo Alto, CA. For more information, go to www.broadcom.com.
Broadcom, the pulse logo, and Connecting Everything are among the trademarks of Broadcom. The term "Broadcom" refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners.
Press Contact:
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Global Communications
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