Broadcom Now Shipping World’s First 102.4 Tbps Switch in Production Volume
Broadcom (NASDAQ: AVGO) announced that its Tomahawk 6 switch family is now shipping in production volume as of March 12, 2026.
Sentiment and the balance of points
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Rhea-AI Summary
Broadcom (NASDAQ: AVGO) announced that its Tomahawk 6 switch family is now shipping in production volume as of March 12, 2026. Tomahawk 6 reportedly doubles throughput versus Tomahawk 5 and supports 100G/200G SerDes with options for 512 200G or 1024 100G SerDes on a single chip.
The product targets scale-out and scale-up AI networks, enabling high-density XPU clusters (up to 128K XPU fabrics with two tiers and single-chip 512-XPU connectivity) and emphasizes lower latency, reduced optics complexity, and improved system power efficiency.
Positive
- Tomahawk 6 doubles throughput versus Tomahawk 5
- Production-volume shipment achieved in under three quarters from sampling
- 512 200G or 1024 100G SerDes option on a single chip
- Enables 128K-XPU two-tier AI fabrics and 512-XPU single-chip connectivity
- Supports 100G/200G SerDes for longer passive copper reach and lower optics
Negative
- None.
Details
News Market Reaction – AVGO
On Mar 13, the first trading day after this news, AVGO closed 4.11% below the previous close.
Data tracked by StockTitan Argus for the Mar 13 session.
Key Figures
- Switch capacity
- 102.4 Tbps
- Tomahawk 6 family switch series headline throughput
- SerDes support
- 100G and 200G
- Tomahawk 6 supports 100G and 200G SerDes
- AI cluster size
- more than one million XPUs
- Designed to meet demand of AI clusters at massive scale
- Scale-out network size
- 128K XPUs
- Tomahawk 6 enables 128K-XPU network with two switch tiers
- Scale-up connectivity
- 512 XPUs
- Single Tomahawk 6 can connect 512 XPUs with single-hop all-to-all
- SerDes count (200G)
- 512 200G SerDes
- Option within Tomahawk family on a single chip
- SerDes count (100G)
- 1024 100G SerDes
- Alternative configuration on a single chip
Historical Context
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Announced 3nm 400G/lane PAM-4 optical DSP for 1.6T–3.2T modules.
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Reported record Q1 FY2026 results, dividend and $10B buyback authorization.
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Launched VMware Telco Cloud Platform 9 targeting sovereign-ready telco infrastructure.
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Began shipping 2nm 3.5D XDSiP compute SoC for AI clusters, initial Fujitsu use.
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Introduced BroadPeak BCM85021 6G digital front-end SoC with power reduction.
24h Move is the share-price change in the day after each event; other market factors may also have contributed.
Key Terms
serdes technical
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Tomahawk 6 Family Switch Series Delivers Unmatched Performance for Scale-Out and Scale-Up AI Networks
PALO ALTO, Calif., March 12, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced that the Tomahawk® 6 family switch series is now shipping in production volume. Unprecedented for a chip of its scale, Tomahawk 6 moved rapidly from initial samples to production deployment.
“Broadcom’s ability to take Tomahawk 6 to production in less than three quarters from initial sampling is a testament to its innovation at scale,” said Asad Khamisy, senior vice president and general manager, Core Switching Group, Broadcom. “Tomahawk 6 doubles the throughput of its predecessor Tomahawk 5, representing a true breakthrough in AI infrastructure design. Our superior execution enables us to be the trusted technology partner for our customers’ demanding networking needs.”
Highly optimized for scale-out and scale-up AI networks used for training and inference, Tomahawk 6 provides advanced load balancing and congestion management for the highest network utilization and lowest job completion time. Tomahawk 6 delivers unmatched flexibility with support for 100G and 200G SerDes. It offers the industry’s most comprehensive set of AI routing features and interconnect options, designed to meet the demand of AI clusters with more than one million XPUs.
“With Tomahawk 6 now shipping, Broadcom is translating its roadmap into real-world deployment,” said Sameh Boujelbene, vice president and Analyst at Dell’ Oro Group. “The platform addresses the industry’s need for large-scale, low-latency fabrics with fewer switch tiers and reduced optical complexity. By supporting both scale-out and scale-up AI architectures at unprecedented density, Tomahawk 6 gives operators a practical path to build faster, more efficient XPU clusters.”
“Through relentless execution, Broadcom has been first to market generation after generation in data center switching,” said Bob Wheeler, Analyst at Large, LightCounting. “For AI scale-out networks, Tomahawk 6 enables a 128K-XPU network using only two switch tiers. Fewer tiers mean lower latency, simpler load balancing and congestion control, and fewer optics. For AI scale-up networks, a single Tomahawk 6 can connect 512 XPUs, providing single-hop all-to-all connectivity.”
The innovations of Tomahawk 6 extend far beyond the chip, delivering full system-level power efficiency and cost savings, enabled by Broadcom’s best-in-class SerDes and optics ecosystem. With industry leading SerDes, it provides the longest reach for passive copper interconnect, enabling high-efficiency, low-latency system design with the highest reliability and lowest total cost of ownership. The Tomahawk family includes a groundbreaking option for 512 200G or 1024 100G SerDes on a single chip, enabling customers to deploy AI clusters with extended copper reach and efficient use of XPUs and optics with native 100G/200G interfaces.
To learn more about the Broadcom Tomahawk 6 family click here. For more information on all Broadcom products please visit www.broadcom.com.
About Broadcom
Broadcom Inc. (NASDAQ: AVGO) is a technology leader that designs, develops, and supplies semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. Broadcom combines long-term R&D investment with superb execution to deliver the best technology, at scale. Broadcom is a Delaware corporation headquartered in Palo Alto, CA. For more information, visit www.broadcom.com.
Broadcom, the pulse logo, Tomahawk, and Connecting Everything are among the trademarks of Broadcom. The term "Broadcom" refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners.
Press Contact:
Jon Piazza
Corporate Communications
press.relations@broadcom.com
Telephone: +1 310 498 5254
FAQ
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