Cadence Design System Inc Stock Price, News & Analysis

Cadence Design Systems will participate in a virtual fireside chat at the Wells Fargo TMT Summit on December 1, 2021, featuring Anirudh Devgan and John Wall. The event starts at 11:20 a.m. EST and will be streamed live on Cadence's investor relations page. Additionally, the presentation will be available for replay until 5:00 p.m. PST on December 17, 2021. This participation underscores Cadence's leadership in electronic design, stemming from over 30 years of expertise and innovative solutions across various markets.

Cadence Design Systems (Nasdaq: CDNS) will participate in a virtual fireside chat at the 45th Nasdaq Investor Conference on November 30, 2021, at 12:30 p.m. EST. Anirudh Devgan, president, and John Wall, CFO, will represent the company. The event will be accessible via webcast and archived for replay until December 17, 2021, at 5:00 p.m. PST. Cadence, a leader in electronic design with over 30 years of experience, focuses on Intelligent System Design and serves various innovative sectors.

Cadence Design Systems announces the qualification of its Integrity 3D-IC platform by Samsung Foundry, enabling advanced 2D-to-3D partitioning for improved power, performance, and area (PPA) in chip design. This solution automates the creation of memory-on-logic configurations for hyperscale computing, mobile, automotive, and AI applications. The platform enhances 3D stacking by reducing memory latency and wirelength, thus boosting CPU performance and facilitating comprehensive system analysis.

Cadence Design Systems (NASDAQ: CDNS) announced that Samsung Foundry has successfully utilized its Liberate Trio Characterization Suite to enhance the efficiency of 3nm production libraries. This advanced characterization suite expedited Samsung's time to market by improving productivity and reducing turnaround time compared to earlier nodes. Key features include a unified production-proven flow, machine learning capabilities, and cloud optimization, enabling scalable and reliable operations. The collaboration supports Cadence's Intelligent System Design strategy, enhancing design enablement across various applications.

Cadence Design Systems (CDNS) announced that Samsung Foundry has adopted the Cadence Tempus Timing Signoff Solution featuring a new SPICE-accurate aging analysis capability. This advancement aims to enhance the reliability of designs for automotive, aerospace, and consumer applications while improving power, performance, and area (PPA). The Tempus solution allows Samsung to validate designs with over 10 years of reliability, achieving up to 4.2% improved frequency and 10% better timing slack. This collaboration marks a significant step towards high-reliability device manufacturing.

Cadence Design Systems (Nasdaq: CDNS) will participate in a virtual fireside chat at the Berenberg US CEO Conference on November 9, 2021. The discussion, featuring Anirudh Devgan and John Wall, will be available live at 1:00 p.m. EST and archived on the Cadence website for replay until December 17, 2021. Cadence, a leader in electronic design, focuses on Intelligent System Design™, providing innovative solutions across various industries. For more details, visit cadence.com/cadence/investor_relations.

Cadence Design Systems announced the launch of the Tensilica HiFi 1 DSP, designed to optimize audio processing in small battery-operated devices like earbuds and smartwatches. This DSP boasts ultra-low energy consumption, enhancing battery life while enabling features like always-listening voice commands. Compared to its predecessor, the HiFi 3 DSP, this model offers 11-16% smaller footprint and up to 73% greater energy efficiency. The new DSP is available now and supports Cadence’s Intelligent System Design strategy, catering to the emerging demand in wearables and hearables.

Cadence Design Systems (CDNS) has collaborated with TSMC to enhance 3D-IC multi-chiplet design innovations. The Integrity 3D-IC platform, the first unified system for 3D-IC planning and analysis, now supports TSMC's 3DFabric technologies, improving engineering productivity and design turnaround time. Additionally, the Tempus Timing Signoff Solution and the Voltus IC Power Integrity Solution are optimized for robustness in design. This partnership aims to enable competitive advancements in hyperscale computing, mobile, and automotive applications.