Welcome to our dedicated page for Ceva news (Ticker: CEVA), a resource for investors and traders seeking the latest updates and insights on Ceva stock.
Ceva Inc (NASDAQ: CEVA) delivers cutting-edge semiconductor IP solutions powering smart edge devices across IoT, automotive, and consumer markets. This dedicated news hub provides investors and industry professionals with timely updates on CEVA’s strategic initiatives, financial performance, and technological breakthroughs.
Access centralized updates including earnings announcements, partnership agreements, product launches, and executive insights. Our repository ensures you stay informed about developments in wireless connectivity IP, edge AI processors, and sensor fusion technologies that shape CEVA’s market leadership.
Discover press releases detailing licensing agreements with global semiconductor leaders, analysis of quarterly financial results, and coverage of R&D milestones in ultra-low-power designs. Bookmark this page for streamlined access to CEVA’s evolving role in enabling next-generation smart devices.
Ceva, a leading licensor of silicon and software IP for Smart Edge devices, has announced its participation in six major investor conferences between May and June 2025.
The company's management will present at key events including:
- J.P. Morgan Global Technology Conference in Boston (May 14)
- Oppenheimer Israeli Conference in Tel Aviv (May 18)
- Stifel Boston Cross Sector Conference (June 3-4)
- Rosenblatt Technology Summit focused on AI (Virtual, June 10)
- ROTH London Conference (June 24-25)
- Northland Growth Conference (Virtual, June 25)
Investors can request one-on-one meetings through their respective conference representatives. Webcasts of Ceva's presentations will be available on the company's investor relations website where applicable.
Ceva (NASDAQ: CEVA) announced that Nextchip has licensed its NeuPro-M Edge AI Neural Processing Unit (NPU) IP for next-generation advanced driver assistance systems (ADAS) solutions. The partnership aims to enhance automotive safety systems with advanced AI capabilities.
The global ADAS market is projected to reach $122.8 billion by 2030, growing at a 19.4% CAGR from 2023 to 2030. The NeuPro-M NPU features Vision Transformers (ViTs) support for superior ADAS vision systems performance, including object recognition and Free Space detection in complex environments.
The Ceva-NeuPro-M offers scalable processing of 4 to 400 TOPs per core, supporting various data types and formats for neural network optimization. The solution includes built-in DSP capabilities and a comprehensive AI SDK for streamlined implementation.
CEVA (NASDAQ: CEVA), a leading licensor of silicon and software IP for Smart Edge devices, has scheduled its first quarter 2025 earnings release for May 7, 2025, before NASDAQ market opening. The company will host a conference call at 8:30 a.m. Eastern Time to discuss quarterly performance.
The earnings call will be accessible via phone for both U.S. (1-844-435-0316) and international participants (+1-412-317-6365), with 'Ceva' as the access code. A live webcast will also be available, with replay options extending until May 14, 2025.
Rohde & Schwarz and Ceva have unveiled the industry's first test solution supporting the upcoming Bluetooth OTA UTP Test Mode. This breakthrough innovation enables over-the-air controlled device testing without requiring direct wired connections, significantly simplifying the testing process for small and highly integrated Bluetooth devices.
The solution combines Rohde & Schwarz's R&S CMW radio communication tester platform with Ceva-Waves Bluetooth Low Energy controller software. This integration allows for unified Bluetooth testing over-the-air, suitable for development, pre-conformance, and production testing of both Bluetooth Low Energy and Bluetooth Classic Radio measurements.
The solution will be showcased at embedded world 2025 in Nuremberg from March 11 to 13. The technology is compatible with existing Bluetooth releases up to 6.0 Channel Sounding and supports the current Direct Test Mode with conducted control connection.
Ceva (NASDAQ: CEVA) has announced a strategic collaboration with Arm and SynaXG to develop an innovative 5G-Advanced solution for wireless network equipment and satellites. The partnership combines Arm Neoverse N2 CPUs, Ceva-PentaG-RAN platform, and SynaXG's carrier-grade RAN software.
The customized solution delivers remarkable efficiency improvements for baseband processing: 10X better than traditional solutions and 20X more efficient than FPGA-based alternatives. This breakthrough enables the development of more sustainable LEO satellites and terrestrial 5G-Advanced infrastructure that are more compact, lighter, and energy-efficient.
The collaboration aims to provide existing and new wireless infrastructure market players with a low-risk path toward 5G-Advanced and 6G evolution, while significantly reducing environmental impact through improved power efficiency.
Ceva (NASDAQ: CEVA) and Sharp Semiconductor Innovation (SSIC) have announced their collaboration on the development of 'ASUKA', a groundbreaking System-on-Chip (SoC) for Beyond 5G (6G) IoT terminals. The ASUKA SoC, powered by Ceva's PentaG2 5G platform IP, aims to democratize cellular IoT by offering a customizable alternative to traditional 5G SoCs.
The innovative chip features a software-defined radio (SDR) architecture that ensures future-proof flexibility and supports emerging 6G standards. ASUKA includes various expansion interfaces like PCIe (Gen4), JESD204B, and USB 3.0, enabling function customization via PC connections. The SoC will be showcased at MWC25 in Barcelona.
The Ceva-PentaG2 IP platform is specifically designed for lower-throughput applications such as RedCap and optimized cellular IoT applications, featuring minimal power consumption for battery-powered devices. The platform includes advanced DSPs, accelerators, and complete 5G PHY software implementation.
CEVA (NASDAQ: CEVA) has unveiled two new high-performance baseband vector DSPs for advanced 5G and 6G-ready applications. The new processors build upon the successful CEVA-XC20 architecture, which is already in design with two Tier-1 infrastructure OEMs.
The CEVA-XC21 DSP, targeting low-power and cost-sensitive applications, delivers up to 1.8X performance improvements while requiring 48% less area compared to its predecessor. The CEVA-XC23 DSP, designed for high-end applications, achieves 2.4X improvements in performance and 2.3X efficiency gains.
Both DSPs feature AI support, dual threading capabilities, and enhanced 5G ISA for accelerated channel processing. The CEVA-XC21 offers 256b SIMD vector size with single/dual thread options, while the CEVA-XC23 provides 512b SIMD vector size with dual thread design. The new DSPs will be available for general licensing by the end of Q1.
Ceva Inc reported strong Q4 2024 financial results with total revenue of $29.2 million, up 21% year-over-year. Q4 royalty revenue reached $13.5 million, marking the fifth consecutive quarter of growth. The company achieved record shipments of 623 million Ceva-powered units, up 38% year-over-year.
For full-year 2024, total revenue increased 10% to $106.9 million, with royalty revenue up 18% to $46.9 million. Annual Ceva-powered device shipments hit a record 2 billion units. The company secured 43 license agreements, including 12 multiple-technology licenses and 9 first-time customers. GAAP loss per share was $0.37, while non-GAAP diluted earnings per share doubled to $0.36.
Notable Q4 achievements included securing major Wi-Fi architecture and cellular DSP licensing deals with global MCU leaders and U.S. mobile OEMs.
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