Ceva and Actions Technology Commemorate Landmark Achievement, Surpassing 100 Million Ceva-Powered Wireless Audio and AIoT Processors Shipped
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Actions Technology's milestone of shipping over 100 million wireless audio chipsets, powered by Ceva's IPs, signifies a robust demand in the consumer electronics sector for advanced wireless audio solutions. The adoption by top-tier OEMs indicates a strong market position and customer trust in Actions Technology's product offerings. This achievement not only showcases the company's growth trajectory but also reflects positively on Ceva's reputation as a reliable IP provider.
In the context of market dynamics, this collaboration between Actions Technology and Ceva is particularly noteworthy. It illustrates a successful integration of AI and DSP technologies into consumer products, which is a growing trend. As AIoT becomes increasingly prevalent, companies that are able to provide low-power, high-quality and low-latency solutions will likely see continued growth. This is especially relevant as the demand for smart devices that offer more immersive experiences is on the rise.
Looking ahead, the partnership's emphasis on innovation and AI-driven audio chip technology positions both Actions Technology and Ceva to capitalize on future market trends. The ability to stay ahead in technology development is crucial in the semiconductor industry and this milestone suggests that both companies are well-equipped to meet future demands.
The announcement of surpassing 100 million units in sales is a significant financial touchstone for Actions Technology, which could positively influence investor confidence and potentially impact the company's stock valuation. For Ceva, the widespread adoption of their IPs by a partner achieving such sales volumes could translate into stable royalty income and a strengthened position in the licensing market.
From a financial perspective, the milestone may also suggest an efficient scale of operations and a strong supply chain management by Actions Technology, which are key factors in maintaining profitability in the competitive semiconductor industry. Additionally, the partnership with globally recognized brands can lead to increased bargaining power and potentially higher margins.
It is important to consider the potential risks associated with the semiconductor industry, such as cyclicality and the impact of global chip shortages. However, the success of Actions Technology and Ceva in navigating these challenges thus far may be indicative of their resilience and strategic planning capabilities.
The integration of AI into IoT (AIoT) represents a significant technological advancement in the semiconductor industry. Actions Technology's focus on AIoT SoCs for wireless audio applications is a clear indication of the shift towards intelligent, connected devices. The collaboration with Ceva, leveraging their DSP and AI processing IPs, underlines the importance of specialized technologies in achieving high-performance audio solutions.
Understanding the technical aspects, DSP (Digital Signal Processing) is crucial for audio applications as it enables the efficient processing of audio signals, resulting in higher sound quality and lower latencies. AI enhances these capabilities by allowing for more personalized and adaptive audio experiences. Ceva's IPs likely contribute to reducing power consumption, which is a critical factor for portable and wearable devices.
The reported ultra-low latency in Actions Technology's products is particularly relevant for applications such as gaming and real-time communication, where delays can significantly affect user experience. This technical merit could provide a competitive edge in markets where user experience is paramount.
Companies' long-term collaboration for wireless, audio and voice technologies sees world's leading OEMs adopt Actions Technology's high-quality, low-latency wireless audio SoCs for consumer devices, including speakers, soundbars, earbuds and smartwatches
Actions Technology produces AIoT SoCs which power wireless audio, portable audio-visual, and edge AI processor applications. Inherited over 20 year of IC design experience from Actions Semiconductor (a former NASDAQ listed company), Actions Technology was founded in 2014 and is headquartered in Zhuhai,
Zhenyu Zhou, Chairman & CEO of Actions Technology, stated: "For the past decade, Actions Technology has been at the forefront of wireless audio innovation, thanks to our deep understanding of these technologies and our joint work with Ceva. Surpassing 100 million Ceva-powered wireless audio chipsets shipped is an incredible achievement for our companies. As we enter a new era of AI-driven audio chip innovation, our close collaboration around Ceva's sensing AI and wireless communications IPs ensure that we have best-in-class technologies to augment our internal development and deliver AIoT SoCs that continue to lead the industry."
Amir Panush, CEO of Ceva, added: "We congratulate our partner Actions Technology on their remarkable achievements and stellar market success. Our industry-leading portfolio of technologies that enable devices to connect, sense and infer data is harmonious with the evolving needs of the wireless audio industry and we embrace the opportunity to continue to support Actions Technology for their roadmap needs in wireless communications, audio, voice, AI and beyond."
About Actions Technology Co., Ltd
Actions Technology Co., Ltd is a leading fabless semiconductor company of AIoT SoC in
Founded in 2014, Actions Technology Co., Ltd. was listed on the SSE STAR in 2021. With headquarters in Zhuhai, we have strategically located offices in
For more information, visit www.actions-semi.com.
About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of innovation to the smart edge. Our wireless communications, sensing and Edge AI technologies are at the heart of some of today's most advanced smart edge products. From Bluetooth connectivity, Wi-Fi, UWB and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI NPU IPs, sensor fusion processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 17 billion of the world's most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks.
Our headquarters are in
Ceva: Powering the Smart Edge™
Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.
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SOURCE Ceva, Inc.
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