Ceva Retains Top Spot in Wireless Connectivity IP in Latest IPnest Report

Rhea-AI Summary

Ceva (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, has maintained its dominant position in Wireless Connectivity IP according to IPnest's 2025 Design IP Report. The company achieved a 68% market share in 2024, more than 10 times larger than its closest competitor.

The company's Ceva-Waves™ family offers comprehensive wireless connectivity solutions including Bluetooth, Wi-Fi, UWB, 802.15.4, and cellular IoT. Notable developments include the Ceva-Waves-Links platform for multi-standard configurations and the Dragonfly platform for LTE-M and NB-IoT connectivity. Ceva recently expanded its portfolio with Bluetooth 7 RF IP on TSMC 12nm, demonstrating its commitment to complete wireless solutions.

Positive

• Dominant 68% market share in wireless connectivity IP, 10x larger than closest competitor
• Comprehensive portfolio covering multiple wireless standards (Bluetooth, Wi-Fi, UWB, 802.15.4, cellular IoT)
• Recent expansion into RF IP with Bluetooth 7 technology on TSMC 12nm
• Strong positioning in growing smart edge device market

Negative

• None.

Insights

Semiconductor IP Analyst

Ceva's 68% wireless connectivity IP market share signals strong competitive positioning and revenue potential in the growing smart edge market.

Ceva's dominant 68% market share in wireless connectivity IP—over 10 times larger than its closest competitor—demonstrates exceptional market leadership in a critical semiconductor segment. This commanding position across Bluetooth, Wi-Fi, UWB, 802.15.4, and cellular IoT IP provides significant competitive advantages in the rapidly expanding smart edge device market.

The company's strategic expansion into a unified IP portfolio that combines wireless connectivity with AI and sensing capabilities is particularly noteworthy. This integration addresses crucial market demands for reduced latency, improved privacy, and enhanced energy efficiency in edge devices. By offering complete solutions from baseband to RF (including their recent Bluetooth 7 RF IP on TSMC 12nm), Ceva is positioning itself as a one-stop shop for semiconductor companies developing next-generation SoCs and MCUs.

The IPnest report validation strengthens Ceva's market credibility and likely enhances its licensing negotiating position. As AIoT applications proliferate across consumer and industrial sectors, Ceva's comprehensive IP portfolio should drive increased licensing opportunities and potentially higher royalty streams. Their market dominance suggests strong execution in both technology development and customer acquisition, providing a solid foundation for continued growth as wireless connectivity becomes increasingly essential in smart edge devices.

68% market share in 2024; Cements Ceva's dominance in Bluetooth, Wi-Fi, UWB, 802.15.4 and cellular IoT IP and integral role of connectivity for smart edge devices as demand grows

ROCKVILLE, Md., July 29, 2025 /PRNewswire/ -- Reinforcing the company's pivotal role in enabling the intelligent, connected world, Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced it has once again been named the #1 vendor in Wireless Connectivity IP by IPnest in its latest 2025 Design IP Report. Ceva grew its wireless connectivity IP market share to 68% in 2024 - more than 10 times larger than its closest peer. This commanding lead reflects Ceva's continued dominance in Bluetooth, Wi-Fi, UWB, 802.15.4 and cellular IoT IP solutions, which are foundational to the next generation of smart edge devices.

The growing convergence of wireless connectivity, on-device AI, and sensor fusion is driving a new wave of smart edge devices, particularly in consumer and industrial SoCs and MCUs. As these devices increasingly require real-time decision-making, local data processing has become essential for reducing latency, preserving privacy, and improving energy efficiency. Ceva's integrated IP portfolio supports this shift by allowing seamless implementation of connectivity, AI NPUs, and sensor technologies - helping customers deliver smarter, more responsive, and secure products.

"Wireless connectivity is foundational to the smart edge, and our continued leadership in this space reflects the trust our customers place in Ceva to deliver high-performance, low-power IP solutions," said Michael Boukaya, Chief Operating Officer at Ceva. "The latest IPnest report reinforces our strategy to build on this leadership by offering a unified IP portfolio that integrates wireless, sensing, and AI capabilities—enabling our customers to accelerate innovation across the evolving AIoT landscape."

"Ceva remains the benchmark in Wireless Interface IP," said Dr. Eric Esteve, Principal Analyst at IPnest. "Their broad portfolio and consistent innovation make them the go-to partner for integrating multi-standard wireless into SoCs."

The Ceva-Waves™ family offers the industry's most comprehensive wireless connectivity IP portfolio, spanning Bluetooth, Wi-Fi, UWB, 802.15.4, and cellular IoT. Optimized for seamless SoC and MCU integration, these IPs support both single and multi-standard configurations through the Ceva-Waves-Links platform. The portfolio also includes the Ceva-Waves Dragonfly platform, a fully integrated solution for LTE-M and NB-IoT connectivity with optional GNSS and eSIM support—ideal for low-power, wide-area applications such as asset tracking, smart metering, and industrial monitoring. Ceva recently expanded its Ceva-Waves platform to include RF IP, introducing its first Bluetooth 7 RF IP on TSMC 12nm, alongside support for IEEE 802.15.4—furthering its commitment to delivering complete, silicon-proven wireless solutions from baseband to RF. For more information, visit https://www.ceva-ip.com/product/ceva-waves-links/.

About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of innovation to the smart edge. Our wireless communications, sensing and Edge AI technologies are at the heart of some of today's most advanced smart edge products. From Bluetooth, Wi-Fi, UWB and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI NPU IPs, sensor fusion processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 19 billion of the world's most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks.

Our headquarters are in Rockville, Maryland with a global customer base supported by operations worldwide. Our employees are among the leading experts in their areas of specialty, consistently solving the most complex design challenges, enabling our customers to bring innovative smart edge products to market.

Ceva: Powering the Smart Edge™

Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.

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SOURCE Ceva, Inc.

FAQ

What is Ceva's current market share in Wireless Connectivity IP for 2024?

According to IPnest's 2025 Design IP Report, Ceva holds a 68% market share in Wireless Connectivity IP for 2024, which is more than 10 times larger than its closest competitor.

What wireless technologies are included in Ceva's IP portfolio?

Ceva's portfolio includes IP for Bluetooth, Wi-Fi, UWB (Ultra-Wideband), 802.15.4, and cellular IoT technologies through their Ceva-Waves™ family of products.

What is Ceva's latest RF IP development on TSMC process?

Ceva recently introduced its first Bluetooth 7 RF IP on TSMC 12nm process, along with support for IEEE 802.15.4.

What is the Ceva-Waves Dragonfly platform used for?

The Ceva-Waves Dragonfly platform is a fully integrated solution for LTE-M and NB-IoT connectivity with optional GNSS and eSIM support, designed for low-power, wide-area applications like asset tracking, smart metering, and industrial monitoring.