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Ceva Inc (NASDAQ: CEVA) delivers cutting-edge semiconductor IP solutions powering smart edge devices across IoT, automotive, and consumer markets. This dedicated news hub provides investors and industry professionals with timely updates on CEVA’s strategic initiatives, financial performance, and technological breakthroughs.
Access centralized updates including earnings announcements, partnership agreements, product launches, and executive insights. Our repository ensures you stay informed about developments in wireless connectivity IP, edge AI processors, and sensor fusion technologies that shape CEVA’s market leadership.
Discover press releases detailing licensing agreements with global semiconductor leaders, analysis of quarterly financial results, and coverage of R&D milestones in ultra-low-power designs. Bookmark this page for streamlined access to CEVA’s evolving role in enabling next-generation smart devices.
Ceva, Inc. (NASDAQ: CEVA) announced that Alif Semiconductor has licensed and deployed Ceva's Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for connected IoT platforms, featuring:
- Integrated Bluetooth Low Energy 5.3 and 802.15.4 wireless subsystem
- Dedicated network co-processor
- Up to 50x boost in machine learning performance and inference efficiency
- Support for Bluetooth LE Audio and Auracast broadcast audio
- Thread, Zigbee, and Matter support for smart home applications
This collaboration aims to meet the growing demand for AI/ML workloads in battery-powered devices, particularly in wireless audio and smart home use cases.
Ceva (NASDAQ: CEVA) has announced that STMicroelectronics has integrated the Ceva-Waves Dragonfly NB-IoT platform into its latest ST87M01 NB-IoT industrial module. This module offers ultra-reliable low-power wide-area network (LPWAN) connectivity and robust GNSS geo-location capability for IoT devices. The Ceva-Waves Dragonfly platform includes the Ceva-BX1 processor, optimized RF transceiver, baseband, and protocol stack, enabling a complete Release 15 Cat-NB2 modem IP solution. This integration aims to reduce time-to-market and lower entry barriers for a variety of IoT applications, including smart meters, smart grids, smart buildings, factory automation, and asset tracking.
The ST87M01 module is expected to capitalize on the projected growth in cellular IoT connections, which the Ericsson Mobility Report forecasts to increase from 3 billion in 2023 to 6.1 billion by 2029, at a CAGR of 12%. Ceva's Vice President, Tal Shalev, highlighted the collaboration's aim to enhance cellular IoT performance and power efficiency. Further details can be found on Ceva's official website.
Ceva, a leading licensor of silicon and software IP for Smart Edge devices, will release its second quarter 2024 financial results on August 7, 2024, before the NASDAQ market opens.
Following the release, Ceva's management will host a conference call at 8:30 a.m. Eastern Time to discuss the quarter's performance.
U.S. participants can join the call by dialing 1-844-435-0316, while international participants can dial +1-412-317-6365, both using the access code 'Ceva'.
A live webcast will be available at https://app.webinar.net/8mGNyBxXMLR, with a replay accessible by dialing +1-877-344-7529 or +1-412-317-0088 (access code: 2162644) until August 14, 2024. The replay will also be available on Ceva's website.
Ceva, a leader in silicon and software IP, has expanded its Ceva-NeuPro family of Edge AI NPUs with the introduction of Ceva-NeuPro-Nano NPUs. These NPUs are designed to execute TinyML workloads efficiently in consumer, industrial, and general-purpose AIoT products, offering low power consumption, optimal performance, and cost-efficiency. The Ceva-NeuPro-Nano NPUs come in two configurations, Ceva-NPN32 and Ceva-NPN64, providing tailored solutions for various AI applications. They boast enhanced capabilities like transformer computation and sparsity acceleration, significantly reducing memory footprints by up to 80% with Ceva-NetSqueeze technology. The launch includes Ceva-NeuPro Studio, an AI SDK supporting open frameworks like TensorFlow Lite for Microcontrollers. The Ceva-NeuPro-Nano NPUs are now available for licensing.
Ceva (NASDAQ: CEVA), the leading licensor of silicon and software IP for Smart Edge devices, announced participation in upcoming investor events. These include:
Oppenheimer 25th Annual Israeli Conference on May 26, 2024, in Tel Aviv;
Cowen 52nd Annual TMT Conference on May 29, 2024, in New York, with a live webcast of Ceva's presentation;
Mizuho Technology Conference 2024 on June 12, 2024, in New York;
Rosenblatt 4th Annual Technology Summit: The Age of AI on June 13, 2024, virtually, featuring a presentation by VP of Marketing, Moshe Sheier, on Edge AI developments;
Northland Growth Conference 2024 on June 25, 2024, virtually.
Ceva, Inc. reported strong financial results for Q1 2024 with royalty revenue of $10.7 million, up 33% YoY, and total revenue of $22.1 million. Licensing revenue was $11.4 million, with 11 license agreements concluded, including deals for next-generation Wi-Fi 7 and Bluetooth 6 IPs. The company introduced new products, expanded partnerships, and announced collaborations to drive growth. GAAP gross margin was 89%, operating loss was $5.0 million, and net loss was $5.4 million. Non-GAAP gross margin was 90%, operating loss was $0.8 million, and net loss was $1.3 million. Ceva remains well-positioned with approximately $159 million in cash and equivalents.