Welcome to our dedicated page for Ceva news (Ticker: CEVA), a resource for investors and traders seeking the latest updates and insights on Ceva stock.
Ceva, Inc. (NASDAQ: CEVA) is a licensor of silicon and software IP whose technologies underpin wireless connectivity, sensing and Edge AI in smart edge devices. The Ceva news stream on Stock Titan highlights company announcements, partnerships, product recognitions and financial disclosures that illustrate how its IP is being adopted across IoT, automotive, consumer and communications markets.
Readers can follow updates on Ceva’s collaborations with semiconductor and solutions providers, such as integrations of its SensPro AI DSP in automotive ADAS and software‑defined vehicle platforms, or the use of its PentaG Lite 5G RedCap modem IP in connected vehicle and automotive IoT solutions. News items also cover licensing wins for its NeuPro NPU portfolio, deployments of its Bluetooth and Wi‑Fi IP in AIoT chipsets, and ecosystem expansions around NeuPro‑Nano for always‑on, voice‑enabled devices.
In addition to technology and customer news, Ceva regularly issues press releases on quarterly financial results, where it discusses trends in licensing and royalty revenue, wireless IoT shipments and AI processor licensing contributions. Investors can also see announcements related to capital markets activity, including underwritten public offerings of common stock made under its shelf registration statement.
This page aggregates these developments in one place, allowing investors, analysts and industry observers to review Ceva’s latest operational milestones and strategic agreements. For ongoing insight into how Ceva’s IP is used to connect, sense and infer at the edge, users can return to this news feed to read the most recent company and market updates.
Ceva (NASDAQ: CEVA) announced general availability of its Ceva-Waves Wi‑Fi 7 1x1 client IP on October 21, 2025, targeting AI‑enabled IoT and Physical AI devices.
The IP is already adopted by leading semiconductor companies and supports IEEE 802.11be features such as Multi‑Link Operation (MLO), enhanced Multi‑Link Single Radio (eMLSR), optional 4K QAM, 160 MHz channels, MRU scheduling, beamforming, WPA3 and WAPI, and flexible RF interfaces. Availability is paired with Ceva’s NeuPro NPU family to enable low‑latency, on‑device inference for wearables, smart home, and industrial IoT.
Ceva (NASDAQ: CEVA) announced it is the first IP provider to achieve Bluetooth 6.0 qualification with Channel Sounding, a capability already adopted by more than 10 customers as of Oct 15, 2025. The release highlights Channel Sounding’s decimeter-level positioning, improved resistance to interference and spoofing, and Isochronous Adaptation Layer and Frame Space Update enhancements for lower latency and higher throughput.
Ceva positions this Bluetooth 6.0 IP alongside its NeuPro NPU IP to enable on-device AI and "Physical AI" use cases across automotive, industrial, IoT, and AR/VR, and cites ABI Research projections for increased Bluetooth device shipments through 2030.
Ceva (NASDAQ: CEVA) will release third quarter 2025 results on November 10, 2025 before the NASDAQ opens.
A management conference call to discuss operating performance will follow at 8:30 a.m. Eastern Time. U.S. dial-in: 1-844-435-0316 (Access Code: Ceva). International dial-in: +1-412-317-6365 (Access Code: Ceva). A live webcast will be available at the provided webinar links; investors should register at least 15 minutes before the call.
A replay will be available by phone (+1-877-344-7529 or +1-412-317-0088, access code 3968730) starting one hour after the call until 9:00 a.m. ET on November 17, 2025, and on Ceva's investor website at www.ceva-ip.com.
Ceva (NASDAQ: CEVA), a leading licensor of silicon and software IP for the Smart Edge, has appointed Yaron Galitzky as Executive Vice President of Artificial Intelligence. Galitzky, a former Microsoft executive with 17 years of experience, will report directly to CEO Amir Panush and lead Ceva's AI strategy and business development.
Galitzky's extensive background includes serving as Vice President of Surface Devices and Accessories at Microsoft, where he contributed to the company's edge AI roadmap and the Surface Copilot+ PC portfolio. His experience also encompasses development of Xbox One, Kinect, and various Surface products. Before Microsoft, he spent over a decade at IBM leading advanced chip design programs.
Ceva (NASDAQ: CEVA) reported Q2 2025 financial results with total revenue of $25.7 million, showing a 6% sequential increase but down from $28.4 million in Q2 2024. The quarter was marked by 4 new NPU licensing deals and 2 strategic automotive IP agreements. The company achieved 488 million Ceva-powered device shipments and surpassed the 20 billion lifetime shipment milestone.
Key financials include licensing revenue of $15.0 million and royalty revenue of $10.7 million. GAAP operating loss was $4.5 million with a net loss of $3.7 million ($0.15 per share). Non-GAAP figures show operating income of $0.8 million and net income of $1.8 million ($0.07 per share). The company repurchased 300,000 shares for approximately $6.2 million during the quarter.
Ceva (NASDAQ:CEVA) and ALi Corporation have announced a strategic licensing partnership to integrate Ceva's NeuPro-Nano and NeuPro-M Neural Processing Units (NPUs) into ALi's next-generation Video Display Sub-System (VDSS) platform.
The collaboration combines ALi's multimedia SoC expertise with Ceva's AI technology to enable high-performance audio, video, vision, sensing and AI processing in smart edge devices. The NeuPro-Nano NPU targets ultra-low power applications with native transformer model support, while the NeuPro-M NPU delivers scalable performance from 4 to 200 TOPS/core.
This partnership aims to enhance ALi's ASIC design services and accelerate AI SoC development for ODMs, OEMs, and semiconductor partners through Ceva's NeuPro-Studio AI SDK.
Ceva (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, has achieved a significant milestone of over 20 billion Ceva-powered devices shipped globally. This achievement demonstrates the company's extensive influence in the technology sector, particularly in enabling intelligent edge computing solutions across consumer, automotive, industrial, mobile, PC, and IoT markets.
The company's technology serves as a foundational element in various devices, from smartphones and laptops to wearables and automotive platforms, providing essential infrastructure for on-device AI, multi-modal sensing, and wireless connectivity. Major industry players including LG Electronics, Nokia, NXP Semiconductors, and several others have praised Ceva's contributions to their product development and success.
Ceva (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, has maintained its dominant position in Wireless Connectivity IP according to IPnest's 2025 Design IP Report. The company achieved a 68% market share in 2024, more than 10 times larger than its closest competitor.
The company's Ceva-Waves™ family offers comprehensive wireless connectivity solutions including Bluetooth, Wi-Fi, UWB, 802.15.4, and cellular IoT. Notable developments include the Ceva-Waves-Links platform for multi-standard configurations and the Dragonfly platform for LTE-M and NB-IoT connectivity. Ceva recently expanded its portfolio with Bluetooth 7 RF IP on TSMC 12nm, demonstrating its commitment to complete wireless solutions.
Ceva (NASDAQ: CEVA), a leading licensor of silicon and software IP for Smart Edge devices, has scheduled its second quarter 2025 earnings release for August 11, 2025, before NASDAQ market opening. The company will host a conference call at 8:30 a.m. Eastern Time to discuss quarterly performance.
The earnings call will be accessible via phone for both U.S. (1-844-435-0316) and international participants (+1-412-317-6365), as well as through a live webcast. A replay will be available until August 18, 2025, through multiple channels including the company's website.
Ceva (NASDAQ: CEVA) and Nothing, a London-based consumer technology company, have announced a strategic collaboration to integrate Ceva's RealSpace® Spatial Audio Software into Nothing's upcoming audio product lineup. The partnership will enhance Nothing's audio devices, including the newly announced Nothing Headphone (1), with immersive spatial audio capabilities.
The collaboration leverages Ceva's spatial audio technology and Bluetooth IP-powered wireless audio SoCs to deliver premium audio experiences across Nothing and CMF brand products. The RealSpace® technology offers cinematic 3D sound with dynamic head tracking, while maintaining low power consumption and efficient compute capabilities.