Welcome to our dedicated page for Ceva news (Ticker: CEVA), a resource for investors and traders seeking the latest updates and insights on Ceva stock.
Ceva, Inc. reports news around its silicon and software intellectual property for the Smart Edge, where its Ceva AI fabric portfolio is used to connect, sense and infer in edge devices. Company updates commonly cover IP licensing agreements, royalty trends, design wins and product launches across 5G, cellular IoT, Bluetooth, Wi-Fi, UWB, satellite communications, Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software.
Recurring developments also include quarterly results, conference participation, customer deployments such as spatial audio software in headsets, and board governance changes. Ceva's business model centers on licensing fees, related revenue and royalties from products that incorporate its intellectual property.
Ceva (NASDAQ: CEVA) announced that BOS Semiconductors has licensed Ceva's SensPro AI DSP for the Eagle-A standalone ADAS SoC on January 6, 2026. Eagle-A pairs a high-end NPU, CPU and GPU with dedicated camera, LiDAR, and radar interfaces to enable real-time sensor fusion and perception.
SensPro is described as optimized for LiDAR and radar pre-processing to reduce latency and improve power efficiency. BOS plans chiplet-based scalability—Eagle-A can work with the Eagle-N AI accelerator in multi-die configurations via UCIe and PCIe—and the Eagle series targets automotive ADAS plus edge AI uses such as robotics and drones.
Ceva (NASDAQ: CEVA) announced on Jan 5, 2026 at CES 2026 a collaboration with Sensory to add Sensory's TrulyHandsfree voice activation to Ceva's NeuPro-Nano NPU ecosystem.
The integration brings on-device, ultra-low power keyword spotting and always-on voice interfaces to NeuPro-Nano, targeting battery-constrained devices such as TWS earbuds, smartwatches, smart remotes, and home appliances, and aims to preserve privacy by avoiding cloud dependency.
The collaboration also adds Sensory models to NeuPro-Studio, enabling faster prototyping and deployment of voice-enabled features for SoC vendors and OEMs.
Ceva (NASDAQ: CEVA) announced on Dec 5, 2025 that its Ceva‑XC21 IoT communication DSP won Best IP/Processor of the Year at EE Awards Asia in Taipei.
The Ceva‑XC21 is described as an ultra‑efficient, AI‑enabled DSP for cost‑sensitive cellular IoT and smart‑home devices, optimized for RedCap/eRedCap, NB‑IoT, LTE‑M, LTE Cat‑M/Cat‑1. It is configurable (single or dual thread; 32–64 MAC units), claims up to 1.8× performance versus prior generation and 48% area reduction, and is available for licensing today.
Ceva (NASDAQ: CEVA) priced an underwritten public offering of 3,000,000 shares of common stock at $19.50 per share, with a 30-day underwriter option to buy up to an additional 450,000 shares. Gross proceeds to Ceva are expected to be approximately $58.5 million assuming no option exercise, before underwriting discounts, commissions and offering expenses. The offering is expected to close on November 20, 2025, subject to customary closing conditions. Ceva stated the proceeds are intended to increase financial flexibility, raise capital, increase public float, and may be used for acquisitions or investments in complementary technologies, working capital, capital expenditures, share repurchases and other general corporate purposes.
Ceva (NASDAQ: CEVA) announced an underwritten public offering of 3,000,000 shares of common stock on November 17, 2025, with a 30-day underwriter option to purchase up to 450,000 additional shares. All shares are to be sold by Ceva and are expected to list on the Nasdaq Global Select Market. The company said proceeds are intended to increase financial flexibility, fund potential acquisitions or investments in complementary technologies or businesses, and for working capital, capital expenditures, repurchases, and other corporate purposes.
The offering will be led by J.P. Morgan with UBS, TD Cowen, Stifel, Needham, Rosenblatt, Roth Capital, and Loop Capital participating; a preliminary prospectus supplement will be filed with the SEC.
Ceva (NASDAQ: CEVA) announced on November 17, 2025 that its NeuPro–Nano low-power Neural Processing Unit received a 2025 IoT Edge Computing Excellence Award from IoT Evolution World.
The award recognizes NeuPro–Nano as a purpose-built, ultra-low-power edge AI inference solution licensed by multiple high-volume consumer and industrial customers, and highlights its role alongside Ceva's sensing processor, embedded software, and connectivity IP (Bluetooth, Wi‑Fi, UWB, 5G and cellular IoT) to enable real-time, low-latency, private edge intelligence.
Ceva (NASDAQ: CEVA) announced on Nov 13, 2025 that IntelPro licensed Ceva wireless connectivity IP to power IntelPro's new IPRO7AI system-on-chip. The IPRO7AI integrates Ceva-Waves Bluetooth Low Energy 5, 802.15.4/Thread/Zigbee and Matter support, a RISC-V security MCU, image processing, and an NPU for on-device AI, targeting smart home, industrial, and consumer IoT devices.
IntelPro positions the IPRO7AI as a Matter-ready turnkey AIoT platform; its roadmap will expand to include Ceva's Wi‑Fi 6 and dual-mode Bluetooth 5 solutions, aiming to accelerate OEM product development and time-to-market.
Ceva (NASDAQ: CEVA) and United Micro announced the HyperMotion 5G RedCap Automotive IoT Platform on Nov 11, 2025, combining United Micro's 5G RedCap SoC with Ceva's PentaG Lite modem IP and DSP technology.
The platform targets automotive telematics control units (T-Box) and C–V2X, emphasizing cost efficiency, security, TSN support, eCall/NG eCall, and hardware-accelerated network offloading to shorten modem development cycles.
Market context cited: Omdia projects RedCap >700 million connections by 2030, and 34 operators were evaluating RedCap as of September 2025 (GSA).
Ceva (NASDAQ: CEVA) reported Q3 2025 revenue of $28.4M, up 11% sequentially and 4% year‑over‑year, with licensing $16.0M and royalties $12.4M. AI processor licensing represented approximately one‑third of licensing revenue in Q2 and Q3 2025, and Ceva signed a portfolio license for its NeuPro NPU family with Microchip plus multiple AI DSP and connectivity deals.
Device shipments reached 579 million units with record wireless IoT shipments. GAAP gross margin was 88%, GAAP operating loss was $2.1M, and GAAP net loss was $2.5M. Non‑GAAP operating income was $3.1M and non‑GAAP diluted EPS was $0.11. Share repurchases totaled 40,295 shares (~$1M) in the quarter and ~$7.2M YTD.
Ceva (NASDAQ: CEVA) announced a long-term partnership with Microchip (NASDAQ: MCHP) on Nov 5, 2025 to embed Ceva's NeuPro family of neural processing units (NPUs) into Microchip products.
The collaboration includes licensing a broad NeuPro portfolio and integrating NeuPro Studio SDK into Microchip's SDK to enable training, import, optimization and deployment of AI models across embedded, edge and data-center use cases.