Welcome to our dedicated page for Ceva news (Ticker: CEVA), a resource for investors and traders seeking the latest updates and insights on Ceva stock.
Ceva Inc (NASDAQ: CEVA) delivers cutting-edge semiconductor IP solutions powering smart edge devices across IoT, automotive, and consumer markets. This dedicated news hub provides investors and industry professionals with timely updates on CEVA’s strategic initiatives, financial performance, and technological breakthroughs.
Access centralized updates including earnings announcements, partnership agreements, product launches, and executive insights. Our repository ensures you stay informed about developments in wireless connectivity IP, edge AI processors, and sensor fusion technologies that shape CEVA’s market leadership.
Discover press releases detailing licensing agreements with global semiconductor leaders, analysis of quarterly financial results, and coverage of R&D milestones in ultra-low-power designs. Bookmark this page for streamlined access to CEVA’s evolving role in enabling next-generation smart devices.
Ceva (NASDAQ: CEVA) announced that Oritek Semiconductor has licensed its SensPro™ Vision AI DSP for the Longquan 560 series of Advanced Driver Assistance Systems (ADAS) chipsets. The collaboration aims to enhance ADAS capabilities in Electric Vehicles (EV), particularly in the Chinese market.
The Longquan 560 series will integrate Ceva's SensPro Vision AI DSP to power various intelligent automotive features, including AI-based headlights, camera monitoring systems, zone control units, and integrated central computing units for driving and parking. This integration enables automakers to reduce development costs and accelerate time-to-market while implementing advanced features.
The partnership is strategically positioned within the rapidly growing global EV market, where China leads with over 50% of global EV sales. Projections indicate that battery-powered electric vehicles will represent 30% of global vehicle sales by 2027.
Ceva and Edge Impulse have announced enhanced computer vision capabilities for embedded ML applications through integration with NVIDIA TAO toolkit. The collaboration includes full integration of Edge Impulse Studio and NVIDIA TAO toolkit support with Ceva-NeuPro Studio for both NPN32 and NPN64 NPUs.
The integration enables AI developers to optimize performance for NeuPro-Nano NPUs with minimal coding requirements. Edge Impulse's platform provides cutting-edge AI/ML models, DSP blocks, and direct integration with NVIDIA's TAO toolkit, facilitating faster development cycles. The NeuPro-Nano's architecture supports AI inference, feature extraction, and DSP workloads for audio, voice, and vision applications, while providing accurate cycle count emulation for end-to-end AI applications.
The Ceva-NeuPro-Nano NPUs are currently available for licensing.
Ceva has announced new partnerships to enhance its embedded AI ecosystem for the Ceva-NeuPro-Nano NPU. The company is collaborating with Cyberon and AIZIP to provide pre-optimized neural networks for keyword spotting, face recognition, and speaker identification in smart edge devices.
The expanded partnership with Edge Impulse now includes full integration of Edge Impulse Studio and support for NVIDIA TAO toolkit with Ceva-NeuPro Studio for both NPN32 and NPN64 NPUs. AIZIP's contribution focuses on Face Detection models, while Cyberon brings its DSpotter keyword spotting technology optimized for power-efficient performance.
The Ceva-NeuPro-Nano NPUs are currently available for licensing, along with Cyberon and AIZIP's optimized neural networks. The Edge Impulse Platform integration will be available in the coming months.
Ceva (NASDAQ: CEVA) announced significant market traction for its Ceva-NeuPro-Nano Embedded AI NPUs in the AIoT and MCU markets. The NPN32 and NPN64 NPUs offer power, performance, and cost efficiencies for embedded AI model deployment on SoCs, featuring a Coremark/MHz score of 6.0.
The company has released Ceva-NeuPro Studio, an integrated IDE solution enabling comprehensive AI application development and deployment. Key features include support for open-source AI frameworks, inference code generation, and seamless integration with Edge Impulse Studio. The solution allows customers to evaluate AI models before silicon availability and deploy using NVIDIA TAO Toolkit.
The technology has received industry recognition, winning the Best IP/Processor of the Year 2024 at EE Awards Asia and the 2024 IoT Edge Computing Excellence Award.
Ceva (NASDAQ: CEVA) announced that Bestechnic has integrated Ceva-Waves Wi-Fi 6 and Bluetooth dual-mode IP platforms in their new Bluetooth/Wi-Fi combo products, including the BES2610 and BES2800 families. Bestechnic, having shipped over 1 billion smart audio SoCs with Ceva's Bluetooth technology, is expanding their partnership to address the growing Wi-Fi 6 market, projected to reach 2.7 billion units annually by 2027.
The new combo devices feature Bluetooth 5.4 dual-mode capability and Wi-Fi 6 subsystem, optimized for ultra-low power consumption with 2.4GHz Wi-Fi RX current as low as 14mA. These solutions target smart wearables, smart home, and smart audio applications, particularly focusing on devices requiring high-throughput wireless connectivity and lossless audio streaming capabilities.
Ceva and MediaTek have announced a partnership to integrate Ceva-RealSpace Elevate multi-channel spatial audio with head tracking into MediaTek's Dimensity 9400 flagship 5G smartphone chip. The solution will enhance mobile entertainment experiences through Bluetooth LE Audio.
The collaboration aims to deliver immersive three-dimensional sound environments that replicate natural hearing. The technology will be compatible with True Wireless Stereo (TWS) earbuds and headphones, offering features like stereo content spatialization and precise head tracking. The solution leverages Dimensity 9400's Bluetooth LE Audio capabilities for low latency streaming and improved battery life.
Ceva-RealSpace Elevate, available for licensing to smartphone OEMs, will be demonstrated at CES 2025. The solution supports various audio formats and includes a high-quality microphone array for spatial audio recording.
Ceva has unveiled the Ceva-Waves Links200, a groundbreaking multi-protocol wireless connectivity platform IP that supports next-generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4 technologies. The platform features a new Ceva-developed radio designed for TSMC's 12nm process, delivering data rates up to 7.5 Mbps - more than double traditional Bluetooth speeds.
The Links200 combines Bluetooth HDT with IEEE 802.15.4 support for Zigbee, Thread, and Matter protocols, enabling concurrent multi-link communication. The solution targets hearables, wearables, and wireless consumer electronics, supporting lossless, multi-channel, low-latency audio streaming for devices like TWS earbuds, headsets, and car audio systems.
Key features include full Bluetooth dual mode support, comprehensive integration of RF, modem, controller, and software stacks, advanced audio support, and compatibility with Ceva's sensing and inference IPs.
Ceva-NeuPro-Nano has won the Best IP/Processor of the Year award at the EE Awards Asia event in Taipei. The Neural Processing Units (NPUs) are designed to deliver optimal balance of ultra-low power and performance for embedded AI workloads in consumer, industrial, and AIoT products.
The technology features a fully programmable architecture that efficiently executes Neural Networks, supports advanced machine learning data types, and includes Ceva-NetSqueeze AI compression technology that enables up to 80% memory footprint reduction. The NPUs come with Ceva-NeuPro Studio, a unified AI stack supporting open AI frameworks including LiteRT for Microcontrollers and microTVM.
This solution addresses key challenges in embedded AI implementation, making artificial intelligence more accessible and practical for various applications including voice, vision, predictive maintenance, and health sensing in IoT devices.
Ceva, Inc. (NASDAQ: CEVA), a leading licensor of silicon and software IP for Smart Edge devices, announced its participation in several upcoming investor events and conferences:
- 13th Annual ROTH Technology Conference on November 20, 2024, at the Hard Rock Hotel, New York.
- Barclays 22nd Annual Global Technology Conference on December 11, 2024, at The Palace Hotel, San Francisco.
- Northland Growth Conference 2024 2.0 on December 12, 2024, virtually.
- CES 2025 from January 7-10, 2025, in Las Vegas, Nevada.
- 27th Annual Needham Growth Conference on January 14-15, 2025, at Lotte New York Palace Hotel, NY.
For meetings, contact respective representatives. Ceva's CES 2025 meeting suite is by invitation only, and the Needham conference presentation will be webcast live with details on Ceva's investor relations website.
Ceva reported strong Q3 2024 financial results with total revenue of $27.2 million, up 13% year-over-year. The quarter saw record device shipments of 522 million units, including over 400 million combined Bluetooth, Wi-Fi, and cellular IoT shipments. Licensing revenue increased 12% to $15.6 million, while royalty revenue grew 15% to $11.6 million. The company secured 10 IP licensing agreements and raised its full-year 2024 guidance to 7-9% growth. Non-GAAP net income increased 137% to $3.4 million, with EPS of $0.14. The board authorized an additional 700,000 shares for repurchase.
FAQ
What is the current stock price of Ceva (CEVA)?
What is the market cap of Ceva (CEVA)?
