Celestica Accelerates AI-Scale Networking: DS6000-Series 1.6TbE Switches Now Available to Order
Rhea-AI Summary
Celestica (NYSE: CLS) announced the DS6000-series 1.6TbE switches are now available to order, offering up to 102.4 Tbps non-blocking switching capacity and 64 ports of 1.6TbE (OSFP224). Two form factors support air and hybrid cooling for 19-inch and 21-inch OCP ORv3 racks. The platforms use Broadcom Tomahawk 6 silicon and support SONiC and open standards (UEC, OCP ESUN) for high-density AI training and machine-learning fabrics. Celestica will showcase the DS6001 at the OCP Regional Summit in Barcelona, April 29-30.
Positive
- Now available to order: DS6000-series 1.6TbE switches
- 102.4 Tbps non-blocking switching capacity powered by Tomahawk 6
- 64 ports of 1.6TbE (OSFP224) high-bandwidth density per chassis
- Supports SONiC and open standards (UEC, OCP ESUN) for flexible networking
- Two cooling form factors: air-cooled 3RU and hybrid-cooled 2OU for OCP ORv3
Negative
- None.
Key Figures
Market Reality Check
Peers on Argus
CLS fell 14.37% while key peers like JBL (+0.25%), FLEX (+0.42%), GLW (+1.30%), FN (-2.18%) and TEL (-0.80%) saw relatively modest, mixed moves, pointing to a stock-specific reaction rather than a broad sector shift.
Previous AI Reports
| Date | Event | Sentiment | Move | Catalyst |
|---|---|---|---|---|
| Mar 16 | AI platform collaboration | Positive | +4.3% | Helios rack-scale AI platform collaboration with AMD using Celestica networking. |
| Nov 17 | AI storage launch | Positive | -0.5% | Launch of SD6300 ultra-dense JBOD storage targeting enterprise and AI workloads. |
| Oct 10 | AI switch family launch | Positive | -6.2% | Introduction of DS6000 and DS6001 1.6TbE data center switches using TH6 silicon. |
| Sep 08 | AI-robot production tie-up | Positive | +0.7% | Circus SE begins CA‑1 AI-robot deliveries with Celestica manufacturing support. |
| Jun 23 | AI-edge switch launch | Positive | +0.8% | Launch of ES1500 campus switch designed for performance and reliability at AI-edge. |
AI-related announcements have usually led to modest price changes, with a mix of aligned positive reactions and occasional sell-the-news pullbacks on product launches.
Recent AI-tagged news shows Celestica steadily expanding its role in AI infrastructure. On Jun 23, 2025, it introduced the ES1500 AI-edge campus switch, followed by participation in Circus SE’s AI-robot production on Sep 8, 2025. It then launched the DS6000/DS6001 1.6TbE switches on Oct 10, 2025, and the SD6300 high‑density storage system on Nov 17, 2025. On Mar 16, 2026, Celestica announced the Helios rack-scale AI platform with AMD. Today’s DS6000-series order availability continues that AI hardware build‑out.
Historical Comparison
Across recent AI-related announcements, average 24h stock reaction was about -0.16%, suggesting prior AI news generally produced modest price moves.
AI-tagged news traces a build-out from AI-edge and campus switching to dense AI storage, 1.6TbE data center switches, and a rack-scale Helios platform with AMD; today’s DS6000-series orderability marks the commercialization stage of that earlier 1.6TbE switch introduction.
Market Pulse Summary
This announcement marks the DS6000-series 1.6TbE switches’ transition from development to orderable product, adding up to 102.4 Tbps of switching capacity and 64 1.6TbE ports to support large AI clusters. It extends Celestica’s AI hardware roadmap that already includes AI-edge, storage, and rack-scale platforms. Investors may focus on adoption trends, orders tied to major AI deployments, and how this 1.6TbE platform complements the company’s broader AI data-center portfolio.
Key Terms
open compute project technical
AI-generated analysis. Not financial advice.
TORONTO, April 29, 2026 (GLOBE NEWSWIRE) -- Celestica Inc. (NYSE: CLS) (TSX: CLS), a global leader in data center infrastructure and advanced technology solutions, today announced its DS6000-series 1.6TbE switches are available for order to initial customers. This milestone signals the platform’s transition from development to ready-to-order status, providing the critical backbone for the next generation of generative AI and machine learning infrastructure.
The DS6000-series is available in two versatile form factors to match specific cooling infrastructures: the air-cooled 3RU DS6000 for standard 19-inch racks, and the hybrid-cooled 2OU DS6001 for 21-inch OCP ORv3 environments. Powered by the Broadcom Tomahawk 6 (TH6) switch silicon, the platforms deliver up to 102.4 Tbps of non-blocking switching capacity. Designed to eliminate bottlenecks in massive AI training clusters, the series features 64 ports of 1.6TbE (OSFP224) connectivity, offering the highest bandwidth density silicon solution available on the market today. The high-density 1.6TbE infrastructure is specifically engineered for the critical AI back-end networks of modern ‘AI factories,’ facilitating seamless scale-up and scale-out networking by leveraging industry standards, including Ultra Ethernet Consortium (UEC) and Open Compute Project (OCP) Ethernet Scale-up Network (ESUN) specifications. To ensure maximum architectural flexibility, the DS6000-series supports both high-speed copper interconnects and advanced 1.6TbE optical interconnects.
"The move to 1.6TbE networking represents a monumental leap in data center evolution, and our engineering teams have worked tirelessly to ensure the DS6000-series is the definitive choice for the AI era," said Gavin Cato, SVP & GM, AI Platform Engineering, Celestica. "By integrating enterprise-class reliability with the flexibility of open networking through SONiC, we have engineered a solution that not only meets current throughput demands but helps future-proof the AI fabric for our global customers."
“As the industry transitions to 102.4T switching to meet the growing bandwidth demands of generative AI, the collaboration between Broadcom and Celestica is more important than ever,” said Hasan Siraj, Vice President of Product Management, Core Switching Group, Broadcom. “By being among the first to ship systems powered by our Tomahawk 6 silicon, Celestica is delivering a high-density 1.6TbE networking fabric essential for scaling next-generation AI clusters. The Celestica DS6000 series demonstrates how our combined expertise can reduce performance bottlenecks and accelerate the deployment of high-performance AI infrastructure.”
"As the industry races toward 100T-plus switching capacity to support the explosion of generative AI, Celestica has established a leading position in high-speed data center switch port shipments," said Sameh Boujelbene, Vice President at Dell’Oro Group. "Their ability to deliver high-density 800G and 1.6TbE solutions based on open standards reflects a deep understanding of the infrastructure demands required to scale the next generation of AI and high-performance computing markets."
"We are pleased to see the Celestica DS6000 series become more available to our customers as the demand for 1.6T bandwidth continues to increase," said Dennis Levenson, Vice President, Vendor Management – GCC (Global Computing & Components) at TD SYNNEX. "As AI and machine learning workloads scale exponentially, our partners need high-density, open-standard solutions that can eliminate complex networking bottlenecks. The arrival of the DS6000 series, backed by Celestica’s engineering leadership and the flexibility of SONiC, provides the high-performance backbone our customers require to drive data center innovation."
The DS6000-series is now available for order. This enables customers to secure high-density 1.6TbE infrastructure essential for scaling their next-generation AI and machine learning clusters.
Celestica will showcase the DS6001 and lead technical discussions on 1.6TbE bandwidth at the upcoming OCP Regional Summit in Barcelona, Spain, from April 29-30. Visit our event landing page to learn more.
About Celestica
Celestica is a technology leader dedicated to driving customer success and market advancements. With deep expertise in design, engineering, manufacturing, supply chain, and platform solutions, Celestica enables critical data center infrastructure for AI, cloud, and hybrid cloud and advances technologies in high-growth markets. With a talented team and a strategic global network, Celestica helps its customers achieve competitive advantages. For more information on Celestica, visit www.celestica.com.
Celestica Contacts:
Celestica Global Communications
(416) 448-2200
media@celestica.com
Celestica Investor Relations
(416) 448-2211
clsir@celestica.com
