Accelsius Provides Two-Phase Direct-to-Chip Cooling to Support NSF ES2 Energy Efficiency Research at Villanova University

Accelsius (INV) will provide cooling equipment to Villanova University to support research through the NSF Center for Energy-Smart Electronic Systems (ES2).

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Accelsius will provide its NeuCool IR150 as shared two-phase cooling infrastructure for the NSF Center for Energy-Smart Electronic Systems, a university-industry research program working to improve U.S. data center energy efficiency by 20–35%

AUSTIN, Texas--(BUSINESS WIRE)-- Accelsius, a leader in two-phase, direct-to-chip liquid cooling for AI and high-performance computing, today announces its participation in the National Science Foundation (NSF) Center for Energy-Smart Electronic Systems (ES2), a federal data center energy efficiency research program.

Accelsius, a member of the NVIDIA Inception program, will support ES2’s system-level testing by providing the NeuCool IR150, the industry’s first fully-integrated IT rack plus CDU, to Villanova University, a founding member of ES2, an NSF Industry-University Cooperative Research Center.

Villanova is one of three university sites participating in ES2, alongside The University of Texas at Arlington, where Accelsius continues its support in a COOLERCHIPS project led by Dr. Dereje Agonafer. The Villanova ES2 Laboratory for Advanced Thermal and Fluid Systems (LATFS) is performing extensive research in two-phase data center cooling systems, including research for the OMNICOOL Project, the NVIDIA-led project under ARPA-E’s COOLERCHIPS program, as well as research with ES2 industry consortium members. With support from fellow industry partners including Google, Microsoft and Meta, ES2’s stated objective is to improve the energy efficiency of U.S. data centers by 20–35% — by its own estimate, the equivalent of removing one to two power plants every three years.

“The largest challenges in data center energy efficiency are not going to be solved by any one group— they require sustained collaboration between research communities and the manufacturers building AI infrastructure at scale,” said Dr. Richard Bonner, Chief Technology Officer of Accelsius. “Our participation in ES2 continues a tradition at Accelsius of prioritizing and publishing research that brings facility energy consumption down.”

“We’re excited that Accelsius is joining the ES2 Center, which has become a leading research site for efficient cooling, WUE optimization, and waste heat reuse,” said Dr. Alfonso Ortega, James R. Birle Professor of Energy Technology and ES2 Site Director at Villanova University. “This donation of Accelsius technology will provide our researchers with a rack-level understanding of two-phase direct-to-chip as a scalable, sustainable option to address rising thermal demands.”

The NeuCool IR150 is expected to be installed at Villanova University in early October 2026. Visitors will be able to visit the onsite lab to see the IR150 in action. For information on touring the LATFS laboratory at Villanova, please contact: Professor Al Ortega, alfonso.ortega@villanova.edu

About Accelsius

Founded by Innventure, Inc. (NASDAQ:INV), Accelsius empowers high performance compute and AI data centers to achieve their business, financial and sustainability goals through advanced cooling solutions. The proprietary NeuCool® platform provides best-in-class thermal efficiencies through a safe, two-phase, direct-to-chip liquid cooling system that scales from single racks to entire data centers. For more information, visit accelsius.com or follow us on LinkedIn.

View source version on businesswire.com: https://www.businesswire.com/news/home/20261027934911/en/

media@accelsius.com

Source: Accelsius

Key Terms

two-phase cooling technical

A cooling method that removes heat by causing a working fluid to change phase, typically from liquid to vapor, and then returning it to liquid so the cycle can repeat. Heat is absorbed when the liquid evaporates at the hot surface, giving much higher heat-transfer per unit mass than simply warming a liquid; the vapor is then condensed back to liquid in a cooler region and recirculated in a closed or controlled-open system. Two-phase cooling requires control of pressure, flow and condensation to avoid problems such as dry-out or flooding and is commonly used where compact, efficient heat removal is needed (for example in electronics, data centers, and some industrial or laboratory equipment).

direct-to-chip liquid cooling technical

A cooling method that pumps liquid directly over the surface of a computer chip (processor or graphics unit) using a fitted plate, removing heat more efficiently than air or indirect systems. Think of it like a water jacket on an engine: keeping the hottest part cooler lets the equipment run faster, longer, and in a smaller space, which can lower energy and space costs and enable higher-performance products—factors that affect operating margins, capital needs, and adoption potential for companies and data centers.