Lightwave Logic Announces Availability of Version 1.1 of Its Polymer Photonics PDK, Advancing Process Integration and Foundry Transfer

Rhea-AI Summary

Lightwave Logic (NASDAQ:LWLG) released Version 1.1 of its backend-of-line Process Design Kit (PDK), now ready for transfer to a high-volume production foundry. Key upgrades include enhanced BEOL process integration, wafer-level poling and testing, Generation 4 encapsulation, and internal reliability validation. Foundry transfer work is planned mainly in H2 2026.

Positive

• PDK Version 1.1 is ready for high-volume foundry transfer
• Introduces wafer-level poling and testing for scalable device processing
• Adds Generation 4 encapsulation to improve environmental stability
• Internal reliability testing incorporated into the updated BEOL process

Negative

• Majority of foundry integration work remains scheduled for the second half of 2026
• No quantified manufacturing timelines or customer tape-out dates provided
• No financial or production-volume commitments announced alongside the transfer

News Market Reaction – LWLG

-3.80%

52 alerts

-3.80% Session close to close

+12.5% Peak Tracked

-3.3% Trough Tracked

$2.49B Market Cap

0.9x Rel. Volume

In the May 7 session, LWLG declined 3.80%, reflecting a moderate negative market reaction. Argus tracked a peak move of +12.5% during that session. Argus tracked a trough of -3.3% from its starting point during tracking. Our momentum scanner triggered 52 alerts that day, indicating high trading interest and price volatility.

Data tracked by StockTitan Argus on the day of publication.

Market Context

This announcement advances Lightwave Logic’s roadmap by making PDK 1.1, including enhanced BEOL inte...

Analysis

This announcement advances Lightwave Logic’s roadmap by making PDK 1.1, including enhanced BEOL integration and wafer-level processing, ready for transfer into a high-volume foundry. It builds on earlier partnerships and PDK integrations aimed at commercializing EO polymer modulators. Investors may watch for concrete customer tape-outs, further reliability data, and updates from existing agreements as indicators of how effectively this platform transition supports broader adoption.

Key Figures

ATM capacity: $51,404,500 Shares sold under ATM: 8,079,319 shares Gross proceeds: approximately $35 million +5 more

8 metrics

ATM capacity $51,404,500 Amended sales agreement with Roth Capital Partners

Shares sold under ATM 8,079,319 shares Previously sold under existing sales agreement

Gross proceeds approximately $35 million From prior ATM share sales

Prospectus supplement capacity $49,326,334 Common stock may be offered and sold

Nasdaq last sale price $12.54 As of April 17, 2026 in 424B5 filing

Option exercise price $4.87 per share PFO option exercise on 20,000 shares

Shares sold by PFO 20,000 shares at $10.36 Open-market sale on April 10, 2026

CEO base salary $500,000 Base salary outlined in DEF 14A for 2026

Historical Context

5 past events · Latest: May 05 (Neutral)

Pattern 5 events

Date	Event	Sentiment	24h Move	Catalyst
May 05	Earnings call timing	Neutral	+5.9%	Announcement of Q1 2026 results date and business update webcast with Q&A.
Apr 29	IP strategy update	Positive	+1.7%	Engagement of Michael Best to strengthen IP, licensing, and tech transfer.
Apr 14	Shareholder meeting set	Neutral	+7.3%	Scheduling of fully virtual 2026 annual shareholder meeting and access details.
Mar 16	GF PDK availability	Positive	-4.2%	High-speed modulator platform added to GDSFactory PDK for GlobalFoundries.
Mar 11	Tower dev agreement	Positive	+41.0%	Development pact with Tower to integrate EO polymer modulators into PH18 PDK.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Pattern Detected

Recent technology and collaboration updates often saw positive price reactions, though one major PDK-related integration headline drew a negative move, indicating occasional divergence on similar commercialization news.

Recent Company History

Over the last few months, Lightwave Logic announced several commercialization and corporate milestones, including a development agreement with Tower targeting 110GHz+ modulators and 200G/400G architectures, and PDK availability for GlobalFoundries. Corporate events such as scheduling the annual meeting and an upcoming Q1 2026 call also saw positive reactions. Today’s PDK 1.1 BEOL integration update fits into this ongoing shift from R&D toward foundry-ready, high-volume manufacturing partnerships.

Key Terms

electro-optic (eo) polymers, backend-of-line (beol), process design kit (pdk), silicon photonics, +2 more

6 terms

electro-optic (eo) polymers medical

"a technology platform company leveraging its proprietary electro-optic (EO) polymers"

Electro-optic (EO) polymers are engineered plastics whose ability to bend or change light shifts when an electrical signal is applied, letting them act like tiny light switches or modulators. They matter to investors because these materials can enable faster, more energy-efficient data transmission and smaller optical components used in telecommunications, data centers and sensors; that potential to improve performance and cut costs can drive product demand, licensing revenue, and market growth.

backend-of-line (beol) technical

"Version 1.1 of its backend-of-line (BEOL) Process Design Kit (PDK)"

The backend-of-line (BEOL) is the stage in semiconductor chip manufacturing where the tiny metal wires, insulating layers and connections are built to link transistors and other components—think of it as the wiring and plumbing that makes individual rooms in a house function together. Investors care because BEOL choices affect a chip’s speed, power use, cost and yield, and therefore influence a maker’s competitiveness, manufacturing complexity and profit margins.

process design kit (pdk) technical

"backend-of-line (BEOL) Process Design Kit (PDK) is ready to be transferred"

A process design kit (PDK) is a packaged set of technical files, rules and tested building blocks that lets chip designers create semiconductor circuits that will reliably manufacture at a specific foundry. Think of it as the recipe, measuring tools and templates a factory provides so different cooks can produce the same dish consistently. For investors, a PDK matters because it directly affects a chip project’s cost, time to market, performance and manufacturing risk, all of which influence a semiconductor company’s revenue and margins.

silicon photonics technical

"streamline integration into silicon photonics platforms and accelerate adoption"

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

wafer-level poling technical

"Wafer-Level Poling and Testing Capability: Introduction of wafer-level poling and testing"

Wafer-level poling is a manufacturing step that uses electric fields (and sometimes heat) across an entire semiconductor wafer to align the tiny internal directions of piezoelectric or ferroelectric materials before the wafer is cut into individual chips. For investors, this matters because consistent poling improves device performance and reliability, raises yield, and lowers per-unit cost—similar to setting all tiny compasses the same way on a single plate so every finished product behaves predictably.

photonic integrated circuits technical

"design, simulate, and fabricate photonic integrated circuits incorporating the Company's"

Photonic integrated circuits are chips that use tiny optical components to generate, route and detect light instead of moving electrical signals, performing functions similar to electronic computer chips but with photons. They matter to investors because they can enable much faster data transfer and lower power use in telecommunications, data centers and sensing, creating new markets and potential cost advantages — but they also require specialized manufacturing and carry technology and supply risks.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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ENGLEWOOD, CO / ACCESS Newswire / May 7, 2026 / Lightwave Logic, Inc. (NASDAQ:LWLG) (the "Company"), a technology platform company leveraging its proprietary electro-optic (EO) polymers to enable next-generation photonic devices, today announced that Version 1.1 of its backend-of-line (BEOL) Process Design Kit (PDK) is ready to be transferred to a high volume production environment.

The updated PDK 1.1 builds upon the Company's previously announced PDK platform and incorporates key advancements in its BEOL process driven by ongoing internal development and reliability testing. These enhancements are designed to further streamline integration into silicon photonics platforms and accelerate adoption within high-volume manufacturing environments.

Key features of the PDK 1.1 include:

• Enhanced BEOL Process Integration: The updated process reflects continued refinement of Lightwave Logic's BEOL integration, supporting improved manufacturability and device consistency for compatibility with a high-volume production environment.

• Wafer-Level Poling and Testing Capability: Introduction of wafer-level poling and testing enables more scalable, efficient device processing and characterization, aligning with foundry production methodologies.

• Generation 4 Encapsulation: Incorporation of the Company's latest encapsulation technology enhances environmental stability and long-term reliability, a critical requirement for commercial deployment.

• Validation Through Internal Reliability Testing: The updated process has been utilized in ongoing internal reliability programs, demonstrating continued progress toward meeting industry standards.

• Foundry Transfer in Progress: Lightwave Logic has initiated the transfer of its PDK to a high-volume semiconductor foundry with the majority of the integration work expected in the second half of 2026.

"Our Version 1.1 PDK reflects the steady execution of our roadmap from materials innovation to manufacturable photonic devices," said Yves LeMaitre, CEO of Lightwave Logic. "With wafer-level processing, advanced encapsulation, and continued BEOL process refinement, we are aligning our platform with the requirements of high-volume foundry environments and enabling our partners to design and deploy next-generation optical solutions more efficiently."

The PDK serves as a foundational element of Lightwave Logic's commercialization strategy, enabling customers and partners to design, simulate, and fabricate photonic integrated circuits incorporating the Company's high-performance EO polymer modulators. The ongoing transfer of the PDK to a high-volume foundry is expected to further expand accessibility and support future customer tape outs.

Lightwave Logic continues to collaborate with ecosystem partners, including foundries and design platform providers, to integrate its technology into industry-standard workflows and accelerate the adoption of low-power, high-speed optical interconnect solutions.

About Lightwave Logic, Inc.

Lightwave Logic, Inc. (NASDAQ:LWLG) is a technology platform company pioneering the development of proprietary electro-optic polymers that enable ultra-high-speed data transmission with low power consumption and compact form factors. These materials power next-generation photonic devices for telecommunications, data centers, and emerging AI infrastructure. Visit www.lightwavelogic.com for more information.

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of applicable securities laws, including statements regarding development activities, anticipated performance targets, customer participation, and potential applications. Actual results may differ materially due to risks and uncertainties, including technical challenges, manufacturing considerations, market adoption, and customer demand.

Contacts:

Ryan Coleman or Nick Teves
Alpha IR Group for Lightwave Logic
lwlg@alpha-ir.com
312-445-2870

SOURCE: Lightwave Logic

View the original press release on ACCESS Newswire

FAQ

What is included in Lightwave Logic's PDK Version 1.1 (LWLG)?

Version 1.1 includes enhanced BEOL process integration, wafer-level poling and testing, and Generation 4 encapsulation. According to the company, these updates aim to improve manufacturability, device consistency, and environmental stability for foundry workflows.

When will Lightwave Logic (LWLG) complete the foundry transfer of PDK 1.1?

The company expects the majority of integration work in the second half of 2026. According to the company, the transfer is in progress and targeted to align the PDK with high-volume semiconductor foundry processes.

How does wafer-level poling and testing in LWLG PDK 1.1 affect manufacturing?

Wafer-level poling and testing enable more scalable, efficient device processing and characterization. According to the company, this aligns the PDK with foundry production methodologies and supports higher-volume manufacturing workflows.

Does PDK 1.1 include reliability validation for Lightwave Logic (LWLG) devices?

Yes. The updated BEOL process has been used in internal reliability testing programs. According to the company, these tests demonstrate progress toward meeting industry reliability standards for commercial deployment.

What does Generation 4 encapsulation in LWLG PDK 1.1 mean for product durability?

Generation 4 encapsulation is intended to enhance environmental stability and long-term reliability. According to the company, the encapsulation upgrade addresses a critical requirement for commercial deployment in optical interconnect applications.