nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution

Rhea-AI Summary

nVent (NVT) announced a collaboration with AMD to bring rack-level cooling to the AMD Helios platform for AI workloads. nVent will add a rear door heat exchanger, a cooling unit designed for the platform's double-wide rack, alongside its computing, networking and software components.

The DC-powered unit is designed to capture heat left behind by direct-to-chip liquid cooling and return cooled air to the surrounding space. nVent plans to show the unit on an Open Rack Wide rack alongside Helios deployment components at the OCP Global Summit in San Jose, California, October 12–16, 2026.

Key Terms

rear door heat exchanger, direct-to-chip liquid cooling, differential pressure

3 terms

rear door heat exchanger technical

"nVent rear door heat exchanger (RDHx) as part of the fully integrated AMD Helios"

A rear door heat exchanger is a cooling component mounted on or built into the back door of a cabinet, vehicle, or equipment housing that moves heat away from internal electronics or systems into the surrounding air or a coolant. Like a car radiator attached to the back of a box, it improves temperature control and energy use; for investors this matters because it can affect product reliability, operating costs, regulatory compliance, and the competitiveness and warranty expenses of devices that rely on compact cooling.

direct-to-chip liquid cooling technical

"heat that direct-to-chip liquid cooling leaves behind"

A cooling method that pumps liquid directly over the surface of a computer chip (processor or graphics unit) using a fitted plate, removing heat more efficiently than air or indirect systems. Think of it like a water jacket on an engine: keeping the hottest part cooler lets the equipment run faster, longer, and in a smaller space, which can lower energy and space costs and enable higher-performance products—factors that affect operating margins, capital needs, and adoption potential for companies and data centers.

differential pressure technical

"integrated air temperature, humidity sensors and differential pressure fan speed control"

The difference in pressure measured between two points in a system; it quantifies how much higher the pressure is at one location compared with another. Differential pressure is expressed in units such as pascals or pounds per square inch and is used to detect flow, resistance, leaks or blockages (for example across a filter, valve, or membrane); it always describes a relative gap between two specific points rather than an absolute pressure at a single point.

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nVent will add liquid and air cooling solution to AMD rack-scale AI platform to create a fully integrated system for large AI workloads

The companies will unveil a first look of the open-source solution at the OCP Global Summit

LONDON, Oct. 13, 2026 (GLOBE NEWSWIRE) -- nVent (NYSE: NVT) and AMD today announced a collaboration to bring rack-level cooling to the AMD Helios™ Rackscale solution. The joint effort pairs nVent's data center cooling expertise with AMD Helios to help operators deploy AI capacity at scale. This will add nVent rear door heat exchanger (RDHx) as part of the fully integrated AMD Helios AI infrastructure platform that includes AMD Instinct™ graphical processing units (GPUs), EPYC™ central processing units (CPUs), Pensando™ networking technologies, and the AMD ROCm™ open software stack. nVent will unveil a first look at the OCP Global Summit in San Jose, CA, October 12 to 16, 2026.

“This collaboration brings nVent's cooling expertise to one of the leading AI platforms in the industry,” said Eric Osborn, vice president and general manager of Data Solutions, Cooling & Power at nVent. “We are designing for the platforms our customers are building on, and working closely with AMD is how we make sure the fit is right.”

nVent's DC-powered RDHx is an industry-first dual rear door, designed for the double-wide AMD Helios rack. It captures the heat that direct-to-chip liquid cooling leaves behind and returns cooled air to the space, keeping the rack effectively room-neutral. It is fully-integrated with the AMD Helios platform and offers intelligent cooling with no wasted watts, integrated air temperature, humidity sensors and differential pressure fan speed control. Additionally, its DC power matches how next-generation AI racks are powered. The result is a cooling solution that allows customers to start with a single rack and scale larger deployments over time.

“The rack, not any single component within it, has now become the unit of deployment; and compute, networking, software, power and cooling must operate as one system,” said Ravi Pendekanti, corporate vice president, Data Center Solutions Business Group, AMD. “AMD Helios brings those elements together in an open, standards-based architecture designed to help customers scale from a single rack to large AI factories with long-term flexibility. Our collaboration with nVent expands the cooling options available for AMD Helios, helping operators bring high-density AI infrastructure online across a broader range of data center environments.”

At the OCP Global Summit, nVent and AMD will show the RDHx for the first time on an Open Rack Wide (ORW) rack alongside the manifolds, bus bars, and power shelves of a Helios deployment, giving operators a first look at how the companies' work comes together. Visit Booth #A9 at OCP for more information.

About nVent
nVent is a leading global provider of electrical connection and protection solutions. We believe our inventive electrical solutions enable safer systems and ensure a more secure world. We design, manufacture, market, install and service high-performance products and solutions that connect and protect some of the world's most sensitive equipment, buildings and critical processes. We offer a comprehensive range of systems protection and electrical connections solutions across industry-leading brands that are recognized globally for quality, reliability and innovation. Our principal office is in London and our management office in the United States is in Minneapolis. Our robust portfolio of leading electrical product brands dates back more than 100 years and includes nVent CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE. Learn more at www.nvent.com.

nVent, CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE are trademarks owned or licensed by nVent Services GmbH or its affiliates.

CAUTION CONCERNING FORWARD-LOOKING STATEMENTS 
This press release contains statements that we believe to be “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act of 1995. All statements, other than statements of historical fact are forward-looking statements. Without limitation, any statements preceded or followed by or that include the words “targets,” “plans,” “believes,” “expects,” “intends,” “will,” “likely,” “may,” “anticipates,” “estimates,” “projects,” “forecasts,” “should,” “would,” “could,” “positioned,” “strategy,” “future,” “are confident,” or words, phrases or terms of similar substance or the negative thereof, are forward-looking statements. These forward-looking statements are not guarantees of future performance and are subject to risks, uncertainties, assumptions and other factors, some of which are beyond our control, which could cause actual results to differ materially from those expressed or implied by such forward-looking statements. Among these factors are adverse effects on our business operations or financial results, including the overall global economic and business conditions impacting our business; the ability to achieve the benefits of our restructuring plans; the ability to successfully identify, finance, complete and integrate acquisitions, including the Maverick Power acquisition; competition and pricing pressures in the markets we serve, including the impacts of tariffs; volatility in currency exchange rates, interest rates and commodity prices; inability to generate savings from excellence in operations initiatives consisting of lean enterprise, supply management and cash flow practices; inability to mitigate material and other cost inflation; risks related to the availability of, and cost inflation in, supply chain inputs, including labor, raw materials, commodities, packaging and transportation; increased risks associated with operating foreign businesses; risks associated with or arising from military conflicts; the ability to deliver backlog and win future project work; failure of markets to accept new product introductions and enhancements; the impact of changes in laws and regulations, including those that limit U.S. tax benefits; the outcome of litigation and governmental proceedings; and the ability to achieve our long-term strategic operating goals. Additional information concerning these and other factors is contained in our filings with the U.S. Securities and Exchange Commission, including our Annual Report on Form 10-K and our Quarterly Reports on Form 10-Q. All forward-looking statements speak only as of the date of this press release. nVent assumes no obligation, and disclaims any obligation, to update the information contained in this press release. 

Investor Contact
Tony Riter 
Vice President, Investor Relations 
nVent 
763.204.7750 
Tony.Riter@nVent.com

Media Contact
Kevin H. King
Vice President, Global Communications
nVent
763.291.0526
Kevin.King@nVent.com