Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions

Key Terms

advanced packaging technical

Advanced packaging describes modern methods for arranging, connecting and enclosing semiconductor chips so they work together more efficiently in a smaller space—think of stacking and wiring tiny electronic building blocks instead of leaving them as separate items on a circuit board. It matters to investors because these techniques can boost product speed, reduce power use, shrink device size and lower manufacturing costs, all of which influence a maker’s competitiveness, profit margins and market share.

high bandwidth memory (hbm) technical

High Bandwidth Memory (HBM) is a type of very fast, compact computer memory made by stacking multiple memory chips close to a processor so data can move much more quickly than with regular memory. For investors, HBM matters because it is a key ingredient in high-performance products like graphics and AI chips — like adding extra fast lanes next to an engine — and its availability, cost and adoption influence makers’ performance, margins and supply-chain competitiveness.

through-silicon vias (tsvs) technical

Through-silicon vias (TSVs) are tiny vertical electrical connections drilled through a silicon chip that let multiple chip layers be stacked and linked directly, like adding elevators between floors of a building to move people and power faster and more efficiently. For investors, TSVs matter because they enable smaller, faster, and lower-power devices and can reduce manufacturing costs or unlock new product capabilities, affecting competitiveness and potential profit margins in semiconductor and electronics companies.

hybrid bonding technical

Hybrid bonding is a chip-assembly method that joins two silicon pieces face-to-face using very small metal and insulating connections, creating many tiny direct electrical links instead of relying on larger external wires. For investors, it matters because it lets device makers build smaller, faster and more energy-efficient processors and memory stacks, potentially improving product performance, reducing manufacturing costs, and creating competitive advantages along the semiconductor supply chain.

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Qnity’s material innovations enable next-generation advanced packaging, showcased through new Innovation Hub

WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity’s breadth of material and technology solutions designed for advanced packaging, enabling the next generation of artificial intelligence (AI), high-performance computing, cloud, networking, and edge computing systems.

A Strategic Growth Engine for the Future

The semiconductor industry is moving beyond the traditional gains of Moore's Law, and innovation is increasingly shifting from "shrink" to "stack" through the design of advanced 3D architectures. Advanced packaging is one of the most important enabling technologies for AI infrastructure and next-generation computing, making it a key focus area for Qnity's long-term growth and innovation strategy.

“As AI reshapes computing, the hardest engineering problems are moving into the connections between chips, layer to layer — where performance, power, density, and reliability are decided," said Chuck Xu, President, Interconnect Solutions at Qnity. "That's where Qnity shines. We bring our semiconductor and interconnect strengths together so customers can master advanced packaging from design through system integration, end-to-end.”

Solutions for the Advanced Packaging Era

As system architectures evolve beyond conventional packaging approaches, advanced packaging has emerged as a critical driver of performance, power, and efficiency. Across the advanced packaging stack—from High Bandwidth Memory (HBM) and interposers to bonding, assembly, and IC substrates—Qnity provides materials and process technologies that help customers achieve the yield, process control, reliability, and performance required for increasingly complex heterogeneous system designs.

Advanced chip manufacturers face growing demands for high-density interconnects, through-silicon vias (TSVs), fine-line redistribution layers (RDLs), advanced metallization, hybrid bonding, and multi-die integration. Qnity's solutions enable precise manufacturing, defect reduction, thermal management, high-density routing, and long-term device reliability. Together, these capabilities help customers overcome manufacturing challenges in advanced packaging.

Learn More

Explore Qnity's Advanced Packaging Innovation Hub to learn how the company's solutions are enabling the future of AI-driven computing.

About Qnity
Qnity is a premier technology solutions provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with ™ or ^® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260622984494/en/

Media Contact
Ashley Boucher
ashley.boucher@qnityelectronics.com

Source: Qnity Electronics, Inc.