SCHMID Announces Successful Delivery and Installation of its InfinityLine C+ System to a Leading Japanese Advanced Packaging Customer

Rhea-AI Summary

SCHMID (NASDAQ:SHMD) announced the successful delivery and installation of its first InfinityLine C+ system to a leading Japanese advanced packaging and high-end substrate customer on Dec. 2, 2025. The InfinityLine C+ is a modular, vertical, touch-free wet-process cluster designed for single-panel processing, FOUP/OHT automation, and 2 µm line-space capability.

The system emphasizes uniform etching/developing, selective Cu/Ti flash etch, DMSO-based wetfilm stripping, and logistics integration; SCHMID says commercialization and volume configurations are now available.

News Market Reaction

+10.11%

10 alerts

+10.11% News Effect

+12.0% Peak Tracked

-8.6% Trough Tracked

+$21M Valuation Impact

$226M Market Cap

0.9x Rel. Volume

On the day this news was published, SHMD gained 10.11%, reflecting a significant positive market reaction. Argus tracked a peak move of +12.0% during that session. Argus tracked a trough of -8.6% from its starting point during tracking. Our momentum scanner triggered 10 alerts that day, indicating notable trading interest and price volatility. This price movement added approximately $21M to the company's valuation, bringing the market cap to $226M at that time.

Data tracked by StockTitan Argus on the day of publication.

Key Figures

Current price: $5.18 52-week range: $1.8601–$6.70 Line-space capability: 2 µm L/S +5 more

8 metrics

Current price $5.18 Pre-news close on 2025-12-02

52-week range $1.8601–$6.70 52-week low and high

Line-space capability 2 µm L/S InfinityLine C+ line-space performance

Substrate size 24.5" × 24.5" InfinityLine L+ supported substrate/PCB size

2024 sales €61M Estimated 2024 sales from Nov 17, 2025 update

2024 EBITDA €-56M Preliminary unadjusted EBITDA 2024

2025 sales guidance €72–77M Expected 2025 sales range

Private placement size $26 million Shares to XJ Harbour HK per 6-K

Market Reality Check

Price: $9.02 Vol: Volume 218,831 is about 2...

normal vol

$9.02 Last Close

Volume Volume 218,831 is about 25% below the 20-day average of 291,481, suggesting muted participation ahead of this news. normal

Technical Price at $5.18 is trading above the 200-day MA of $3.20, after a -1.45% day.

Peers on Argus

SHMD fell 1.45% while close peers were mixed: HURC -1.1%, OPTT +3.43%, XCH -14.7...

SHMD fell 1.45% while close peers were mixed: HURC -1.1%, OPTT +3.43%, XCH -14.79%, TAYD +1.54%, BWEN -1.97%, indicating stock-specific factors rather than a coordinated sector move.

Historical Context

5 past events · Latest: Dec 02 (Positive)

Pattern 5 events

Date	Event	Sentiment	Move	Catalyst
Dec 02	Product installation	Positive	+10.1%	First InfinityLine C+ delivery and installation to a Japanese customer.
Nov 18	Industry award	Positive	-13.2%	Innovation Award for InfinityLine L+ CMP system at productronica 2025.
Nov 17	Outlook update	Neutral	-21.1%	Transition-year update with weak 2024/2025 but improved 2026 outlook targets.
Nov 17	Listing compliance	Negative	-21.1%	Nasdaq determination letter regarding delisting for late 2024 Form 20-F.
Nov 10	Major equipment orders	Positive	+19.8%	Two significant PLP and mSAP equipment orders tied to AI-driven demand.

Pattern Detected

Operational and technology wins (major orders, product installations) have sometimes led to strong gains, while awards or mixed outlook updates have coincided with sharp selloffs. Regulatory and listing setbacks have aligned with significant downside moves.

Recent Company History

Over the last month, SCHMID reported several material developments. On Nov 10, 2025, it secured major PLP and mSAP equipment orders, with the stock rising 19.76%. On Nov 17, 2025, it disclosed weak 2024/2025 transition years and a Nasdaq delisting notice, both followed by a -21.13% move. On Nov 18, 2025, an Innovation Award for InfinityLine L+ coincided with a -13.16% reaction. Today’s InfinityLine C+ installation news previously saw a 10.11% gain, underscoring the market’s focus on commercialization progress amid financial and listing challenges.

Market Pulse Summary

The stock surged +10.1% in the session following this news. A strong positive reaction aligns with p...

Analysis

The stock surged +10.1% in the session following this news. A strong positive reaction aligns with prior responses to commercialization milestones, such as the 10.11% move on the earlier InfinityLine C+ installation news and the 19.76% gain on major PLP orders. However, past selloffs after good news and ongoing listing and financial challenges suggest that enthusiasm could reverse if execution or compliance progress disappoints, so investors have historically reassessed gains quickly.

Key Terms

panel level packaging (plp), high-density interconnect (hdi), foup/oht, dmsO

4 terms

panel level packaging (plp) technical

"marks an important milestone in strengthening SCHMID’s innovation leadership in Panel Level Packaging (PLP)"

Panel level packaging is a method of assembling semiconductor chips by placing and processing many units on a large rectangular panel instead of handling them one-by-one or on round wafers. Like printing many photos on a single poster and trimming them later, it can reduce manufacturing cost, speed up output and improve yield, which affects a maker’s margins, production capacity and reliability—key factors for investors.

high-density interconnect (hdi) technical

"supporting a wide range of critical wet processes for high-density interconnect (HDI) and advanced substrate applications"

High-density interconnect (HDI) is a printed circuit board design technique that packs more electronic connections into a smaller area by using finer wiring, tiny plated-through holes and additional layers—think of a multi-story apartment building instead of single-family houses to fit more people on the same land. For investors, HDI matters because it enables smaller, faster, and more power-efficient devices but can raise manufacturing complexity, cost and supplier risk, all of which affect product competitiveness and company margins.

foup/oht technical

"Full automation including FOUP/OHT integration and SCHMID’s MCF logistic system"

A FOUP (Front Opening Unified Pod) is a sealed container that safely holds silicon wafers during storage and transport inside a semiconductor factory, while an OHT (Overhead Hoist Transport) is an automated crane-like vehicle that moves those FOUPs between machines. Together they are like a protective lunchbox and an automatic courier for fragile parts — critical because they affect production speed, contamination risk and capital costs, so investors watch them as indicators of manufacturing capacity, efficiency and potential bottlenecks.

dmsO technical

"Efficient Wetfilm Stripping based on environmentally friendly DMSO chemistry"

Dimethyl sulfoxide (DMSO) is a simple sulfur-containing chemical used widely as an industrial solvent and, in medicine, as a topical treatment and carrier that can help other substances penetrate skin—think of it as a delivery vehicle for drugs. Investors watch DMSO because its regulatory status, safety profile, and role as an ingredient or delivery tool can affect the development pathway, marketability, and commercial risk of pharmaceutical and medical-product candidates.

AI-generated analysis. Not financial advice.

FREUDENSTADT, Germany, Dec. 02, 2025 (GLOBE NEWSWIRE) -- The SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, today announced the successful delivery and installation of its first InfinityLine C+ system for a leading Japanese customer in the Advanced Packaging and high-end substrate market.

The InfinityLine C+ represents SCHMID’s next-generation vertical spin process technology, designed to deliver best-in-class uniformities, touch-free operation, single-panel processing, and fully automated panel handling.

This achievement marks an important milestone in strengthening SCHMID’s innovation leadership in Panel Level Packaging (PLP) and high-density glass substrate manufacturing, further expanding the company’s footprint in one of the world’s most dynamic electronics markets.

A New Standard in Wet Chemical Processing
The InfinityLine C+ platform is designed as a modular, vertical, touch-free cluster tool supporting a wide range of critical wet processes for high-density interconnect (HDI) and advanced substrate applications.

The InfinityLine C+ cluster provides a flexible, tightly integrated wet process environment that minimizes handling, maximizes yield, and supports rapid recipe transitions for dynamic manufacturing conditions.

Technical Highlights & Customer Benefits

• Single-panel, touch-free vertical processing for maximum yield and minimum particle contamination
• Full automation including FOUP/OHT integration and SCHMID’s MCF logistic system
• Highly uniform etching and developing for advanced line-space requirements (down to 2 µm L/S)
• Optimized wet chemical architecture ensuring tight process windows for Cu and Ti flash etch
• Efficient Wetfilm Stripping based on environmentally friendly DMSO chemistry
• Scalable and modular cluster concept, compatible with SCHMID’s InfinityLine H+, V+, and P+ systems
• Reduced footprint and minimized manual intervention due to full automation and vertical layout
  

Together, these features enable higher uptime, stable output, and lower total cost of ownership for customers manufacturing the next generation of advanced substrates and PLP architectures.

Executive Statement
“The successful installation of our InfinityLine C+ is a significant milestone and a strong validation of our wet-process strategy,” said Roland Rettenmeier, CSO of SCHMID Group. “The C+ integrates high-precision developing, selective flash etching, and efficient wet-film stripping into a fully automated, touch-free platform purpose-built for next-generation glass and substrate applications. This system will enable our customer in Japan to advance the development of next-generation Panel-Level Packaging technologies.

“What truly sets the InfinityLine C+ apart is its seamless logistics integration, vertical single-panel handling, and its capability to consistently achieve 2 µm line-space performance. These advantages make the C+ a highly competitive solution for manufacturers that demand uncompromising uniformity, flexibility, and yield.

“We are proud to support our customer with a system that not only meets today’s advanced packaging requirements but also provides a scalable foundation for future technology generations.”

Outlook & Availability
With the shipment and successful implementation of the first InfinityLine C+ system, SCHMID is entering the commercialization phase. Further customer demonstrations, integrations, and volume-production configurations are now available.

The InfinityLine C+ strengthens SCHMID’s portfolio of advanced wet-process equipment and complements the InfinityLine P+, H+, and V+ platforms, providing substrate and PLP manufacturers with a complete, modular process ecosystem.

Forward-Looking Statements 
This press release contains statements that constitute "forward-looking statements". All statements other than statements of historical fact included in this press release are forward-looking statements. Forward-looking statements are subject to numerous conditions, many of which are beyond the control of the Company, including those set forth in the "Risk Factors" section of the Company’s registration statement and final prospectus for the offering filed with the SEC. Copies are available on the SEC’s website, www.sec.gov. The Company undertakes no obligation to update these statements for revisions or changes after the date of this release, except as required by law. 

About the SCHMID Group 

The SCHMID Group is a global leader in providing solutions for the high-tech industry in the fields of electronics, photovoltaics, glass, and energy systems. SCHMID N.V. and Gebr. SCHMID GmbH are headquartered in Freudenstadt, Germany. Founded in 1864, the company currently employs over 800 people worldwide and operates technology centers and production facilities at multiple locations, including Germany and China, along with several global sales and service locations. The Group focuses on developing customized equipment and process solutions for a variety of industries, including electronics, renewable energy, and energy storage. Our system and process solutions for the production of substrates, printed circuit boards, and other electronic components ensure cutting-edge technology, high yields at low production costs, maximum efficiency, quality, and sustainability through environmentally friendly manufacturing processes.

For more information about the SCHMID Group, please visit: www.schmid-group.com

Contact
Press@schmid-group.com

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/51ef63b0-fb14-455d-a887-b3184224753a

FAQ

What did SCHMID (SHMD) announce on Dec. 2, 2025 about the InfinityLine C+?

SCHMID announced the successful delivery and installation of its first InfinityLine C+ system to a leading Japanese advanced packaging customer and said commercialization is beginning.

What technical features does the InfinityLine C+ for SHMD offer for PLP and substrates?

The InfinityLine C+ offers vertical, touch-free single-panel processing, FOUP/OHT automation, 2 µm line-space capability, and DMSO-based wetfilm stripping.

How does the InfinityLine C+ affect manufacturing yield and contamination for SHMD customers?

SCHMID states the C+ reduces handling and particle contamination via touch-free single-panel processing, aiming to improve yield and uptime.

Is the InfinityLine C+ commercially available from SCHMID (SHMD)?

Yes; SCHMID says the product has entered the commercialization phase with demonstrations, integrations, and volume-production configurations available.

Which processes does the InfinityLine C+ support for SHMD clients in advanced substrate production?

The platform supports a range of wet processes including high-uniformity developing, selective Cu/Ti flash etch, and efficient wetfilm stripping.

What customer benefits did SCHMID highlight for the InfinityLine C+ (SHMD)?

SCHMID highlighted higher uptime, reduced manual intervention, tighter process windows, scalable modularity, and lower total cost of ownership.