Xscape Photonics and Tower Semiconductor Unveil the Industry’s First Optically Pumped On-Chip Multi-Wavelength Laser Platform for AI Datacenter Fabrics
Tower Semiconductor (NASDAQ/TASE: TSEM) and Xscape Photonics have announced the successful development of the industry's first on-chip, optically pumped, multi-wavelength laser source. Built on Tower's PH18 Silicon Photonics platform, this breakthrough technology supports CWDM and DWDM wavelength grids for AI datacenter fabrics.
The solution eliminates the need for multiple externally modulated lasers or hybrid III-V integration, enabling a simplified supply chain and reduced costs. According to LightCounting, the optical interconnect market for AI datacenters is projected to reach $10 billion by 2026 and $20 billion by 2030, doubling from 2024 levels.
Xscape's ChromX platform, based on proprietary CombX technology, offers a programmable laser source compatible with existing silicon photonic components, specifically designed for GPU-to-GPU and GPU-to-HBM optical links in AI clusters.
Tower Semiconductor (NASDAQ/TASE: TSEM) e Xscape Photonics hanno annunciato lo sviluppo riuscito della prima sorgente laser multi-lunghezza d'onda su chip alimentata otticamente del settore. Realizzata sulla piattaforma PH18 Silicon Photonics di Tower, questa tecnologia supporta le griglie di lunghezze d'onda CWDM e DWDM pensate per le reti ottiche dei data center AI.
La soluzione elimina la necessità di molteplici laser modulati esternamente o dell'integrazione ibrida III-V, semplificando la catena di fornitura e riducendo i costi. Secondo LightCounting, il mercato delle interconnessioni ottiche per data center AI dovrebbe raggiungere 10 miliardi di dollari entro il 2026 e 20 miliardi entro il 2030, raddoppiando rispetto ai livelli del 2024.
La piattaforma ChromX di Xscape, basata sulla tecnologia proprietaria CombX, fornisce una sorgente laser programmabile compatibile con i componenti fotonici su silicio esistenti, progettata specificamente per collegamenti ottici GPU-to-GPU e GPU-to-HBM nei cluster AI.
Tower Semiconductor (NASDAQ/TASE: TSEM) y Xscape Photonics han anunciado el desarrollo exitoso de la primera fuente láser multiconta de longitudes de onda en chip alimentada ópticamente de la industria. Construida sobre la plataforma PH18 Silicon Photonics de Tower, esta innovación admite las rejillas de longitudes de onda CWDM y DWDM para las redes de centros de datos de IA.
La solución suprime la necesidad de múltiples láseres modulados externamente o de la integración híbrida III-V, lo que simplifica la cadena de suministro y reduce costes. Según LightCounting, el mercado de interconexiones ópticas para centros de datos de IA se proyecta en 10.000 millones de dólares para 2026 y 20.000 millones para 2030, duplicando los niveles de 2024.
La plataforma ChromX de Xscape, basada en la tecnología propietaria CombX, ofrece una fuente láser programable compatible con los componentes fotónicos sobre silicio existentes, diseñada específicamente para enlaces ópticos GPU-a-GPU y GPU-a-HBM en clústeres de IA.
Tower Semiconductor (NASDAQ/TASE: TSEM)와 Xscape Photonics가 업계 최초의 광펌핑 방식 온칩 다중 파장 레이저 소스 개발에 성공했다고 발표했습니다. 이 기술은 Tower의 PH18 실리콘 포토닉스 플랫폼 위에 구축되어 AI 데이터센터 패브릭을 위한 CWDM 및 DWDM 파장 그리드를 지원합니다.
이 솔루션은 다수의 외부 변조 레이저나 III-V 하이브리드 통합이 필요 없어 공급망을 단순화하고 비용을 절감합니다. LightCounting에 따르면 AI 데이터센터용 광 인터커넥트 시장은 2026년까지 100억 달러, 2030년까지 200억 달러에 이를 것으로 전망되며 2024년 수준에서 두 배로 성장합니다.
Xscape의 ChromX 플랫폼은 독자적인 CombX 기술을 기반으로 하며, 기존 실리콘 포토닉스 부품과 호환되는 프로그래머블 레이저 소스를 제공합니다. 특히 AI 클러스터 내 GPU-간 및 GPU-to-HBM 광링크용으로 설계되었습니다.
Tower Semiconductor (NASDAQ/TASE: TSEM) et Xscape Photonics ont annoncé le développement réussi de la première source laser multi‑longueurs d'onde sur puce, pompée optiquement, de l'industrie. Construite sur la plateforme PH18 Silicon Photonics de Tower, cette avancée prend en charge les grilles de longueurs d'onde CWDM et DWDM pour les architectures de centres de données IA.
La solution supprime le besoin de multiples lasers modulés en externe ou d'une intégration hybride III‑V, simplifiant la chaîne d'approvisionnement et réduisant les coûts. Selon LightCounting, le marché des interconnexions optiques pour centres de données IA devrait atteindre 10 milliards de dollars d'ici 2026 et 20 milliards d'ici 2030, soit le double des niveaux de 2024.
La plateforme ChromX de Xscape, basée sur la technologie propriétaire CombX, fournit une source laser programmable compatible avec les composants photoniques sur silicium existants, spécialement conçue pour les liaisons optiques GPU‑à‑GPU et GPU‑à‑HBM dans les clusters IA.
Tower Semiconductor (NASDAQ/TASE: TSEM) und Xscape Photonics haben die erfolgreiche Entwicklung der ersten optisch gepumpten On‑Chip-Mehrwellenlängen-Laserquelle der Branche bekanntgegeben. Auf Towers PH18 Silicon Photonics Plattform aufgebaut, unterstützt diese Innovation CWDM- und DWDM-Wellenlängenraster für AI-Datacenter-Fabrics.
Die Lösung macht mehrere extern modulierte Laser oder eine hybride III‑V‑Integration überflüssig, vereinfacht die Lieferkette und senkt die Kosten. Laut LightCounting wird der Markt für optische Interconnects in AI-Datacentern bis 2026 10 Milliarden US‑Dollar und bis 2030 20 Milliarden US‑Dollar erreichen und sich damit gegenüber 2024 verdoppeln.
Xscapes ChromX‑Plattform, basierend auf der proprietären CombX‑Technologie, bietet eine programmierbare Laserquelle, die mit bestehenden silicon photonics Komponenten kompatibel ist und speziell für optische GPU‑zu‑GPU‑ und GPU‑zu‑HBM‑Verbindungen in AI‑Clustern entwickelt wurde.
- None.
- Technology still in prototype phase with validation kit just becoming available
- Requires external CW laser for optical pumping
Insights
Tower and Xscape's new on-chip multi-wavelength laser technology could disrupt AI datacenter connectivity with simpler, more cost-effective optical solutions.
The collaboration between Tower Semiconductor and Xscape Photonics marks a significant technological breakthrough in optical interconnect technology. Their on-chip, optically-pumped, multi-wavelength laser source addresses critical challenges in AI datacenter connectivity by enabling higher bandwidth density and improved power efficiency.
The technical innovation here is remarkable. Traditional solutions require either multiple externally modulated lasers or complex hybrid III-V integration. In contrast, this platform uses a single continuous wave external laser to optically pump a monolithically integrated laser array on Tower's PH18 Silicon Photonics platform. This dramatically simplifies the architecture while supporting both CWDM and DWDM wavelength grids - essential for high-density optical connections.
What makes this particularly valuable is its integration with Tower's established high-volume manufacturing process. The PH18 platform compatibility means existing Tower customers can adopt this technology without major redesigns, maintaining compatibility with their current photonic components like modulators and detectors. This significantly lowers adoption barriers.
With LightCounting projecting the AI optical interconnect market to reach
The ChromX platform based on proprietary CombX technology positions Xscape Photonics competitively in the AI infrastructure space, while Tower enhances its silicon photonics portfolio with differentiated technology that addresses emerging AI infrastructure needs.
Monolithically integrated, optically pumped, programmable multi-color laser built on Tower’s PH18 platform enables scalable CWDM/DWDM optical fabrics for disaggregated AI clusters
MIGDAL HAEMEK, Israel and SANTA CLARA, Calif. – Aug. 25, 2025 - Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, and Xscape Photonics, a U.S.-based innovator in advanced photonic interconnects funded by industry leaders such as NVIDIA and Cisco, today announced the successful prototyping and validation kit availability of the industry’s first on-chip, optically pumped, multi-wavelength laser source. Built on Tower’s mature, high-volume PH18 Silicon Photonics platform, the solution supports CWDM and DWDM wavelength grids and is tailored for AI datacenter fabrics, where bandwidth density, power efficiency, and scalability are essential.
The optical interconnect market for AI datacenters is expected to grow, driven by the rising demand for high-speed, low-latency connectivity in hyperscale AI deployments. According to LightCounting, sales of optical transceivers and LPO/CPO for AI clusters are expected to reach more than
This breakthrough from Tower Semiconductor and Xscape Photonics enables a path toward high performance, high reliability, lower cost and a simplified supply chain by monolithically embedding programmable multi-color lasers on-chip, pumped optically by a single CW external laser. It also eliminates the need to source for multiple externally modulated lasers or require hybrid III-V integration. Xscape Photonics’ solution simplifies design, reduces latency and component count, and is especially impactful for GPU-to-GPU and GPU-to-HBM optical links in AI clusters. Leveraging Tower’s high-volume modular PH18 platform, the solution offers a seamless upgrade path for existing customers, fully compatible with established photonic components such as modulators and detectors.
“Our close collaboration with Tower has allowed us to bring to market a highly differentiated, manufacturable, and scalable solution,” said Vivek Raghunathan, CEO of Xscape Photonics. “By building on Tower’s proven and qualified high-volume PH18 platform, we’ve eliminated the need for costly hybrid laser integration and delivered the first monolithically integrated, multi-color laser source directly on-chip. This will transform how AI fabrics are architected going forward.”
Xscape Photonics is developing a multi-color laser platform, ChromX, based on its proprietary CombX technology, a programmable laser source device that allows end users—especially those already designing with Tower’s PH18 platform—to easily integrate high-performance laser sources, significantly reducing packaging complexity and component count. The laser source is compatible with existing silicon photonic modulators and detectors, opening a seamless path toward fully integrated optical interconnect for AI data center fabrics.
“We are excited to partner with Xscape Photonics in bringing this first-of-its-kind innovation to life,” said Ed Preisler, Vice President and GM of Tower Semiconductor’s RF Business Unit. “Tower’s multi-sourced and high-volume silicon photonics platform has once again demonstrated its ability to support advanced custom solutions for AI and datacenter customers at scale. This new solution exemplifies how our flexible, modular technology ecosystem enables rapid prototyping and high-volume production adoption for emerging AI and data-driven markets.”
For additional information about the company’s RF platform offering, visit here.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), photonics, and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor owns one operating facility in Israel (200mm), two in the U.S. (200mm), two in Japan (200mm and 300mm) which it owns through its
Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release.
About Xscape Photonics
Xscape Photonics develops custom photonic platform solutions designed for ultra-high bandwidth connections inside data centers to power Agentic AI systems. The company's proprietary ChromX platform targets scaling of AI computing performance in an environmentally sustainable manner and is optimized for power, cost, scale and reliability. The company recently announced the availability of EagleX, its technology evaluation kit. To learn more, follow us on LinkedIn or visit xscapephotonics.com.
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Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com
Tower Semiconductor Investor Relations Contact: Liat Avraham | +972-4-6506154 | liatavra@towersemi.com
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