Welcome to our dedicated page for Taiwan Semi news (Ticker: TSM), a resource for investors and traders seeking the latest updates and insights on Taiwan Semi stock.
Taiwan Semiconductor Manufacturing Company Limited (TSMC) (NYSE: TSM) generates frequent news coverage as a major participant in the semiconductor and related device manufacturing industry. As a dedicated semiconductor foundry headquartered in Hsinchu, Taiwan, TSMC regularly issues announcements about its technology roadmap, manufacturing capabilities, ecosystem collaborations, and regulatory filings, all of which can affect how investors and industry observers view TSM stock.
News about TSMC often highlights developments in advanced process technologies and packaging. Examples include the unveiling of new logic nodes such as the A14 process, described by the company as a next cutting-edge logic technology designed to deliver faster computing and greater power efficiency compared with earlier nodes, and updates on 3D IC and 3DFabric offerings like CoWoS and System-on-Wafer. These stories typically connect TSMC’s technology to applications in artificial intelligence, high performance computing, smartphones, automotive electronics, and Internet of Things devices.
Another recurring theme in TSMC news is its role in the global semiconductor ecosystem. Press releases cover collaborations with chip designers, memory suppliers, substrate manufacturers, and outsourced assembly and test providers. For example, TSMC has announced joint work with MediaTek on 3nm system-on-chip development and a memorandum of understanding with Amkor Technology to provide advanced packaging and test services in Arizona to support customers using TSMC’s wafer fabrication facilities in Phoenix.
Regulatory and financial updates also appear in TSMC’s news flow. The company reports the filing of its annual reports on Form 20-F, periodic revenue updates, and other matters via press releases and Form 6-K submissions. In addition, third-party publications may feature TSMC as a stock for further study, reflecting interest in its financial fundamentals. Investors and analysts who follow TSM news can use this page to monitor technology milestones, ecosystem partnerships, and official company disclosures that may shape the long-term outlook for TSMC’s foundry business.
BetterInvesting Magazine named Taiwan Semiconductor Manufacturing Co. (NYSE: TSM) its "Stock to Study" for the Jan/Feb 2026 issue, recommending further investor study of TSM's fundamentals including sales, earnings, pre-tax profit, and return on equity presented on a single Stock Selection Guide page.
The Jan/Feb 2026 issue will also include a fundamental review of The Campbell's Company (NYSE: CPB), identified by the independent Editorial Advisory and Securities Review Committee as worthy of further study from an undervalued perspective. Committee members and chair are listed, and the magazine clarified the content is educational, not a purchase recommendation; investors are advised to run their own Stock Selection Guide analysis.
TSMC (NYSE:TSM) announced the unexpected resignation of Vanessa Lee, Vice President of Materials Management, effective July 13, 2025. Lee, who joined TSMC in 2022 and became the youngest VP in company history, is departing for personal reasons after taking a one-month extended leave.
Lee's notable background includes procurement roles at Apple, Alphabet, and Qualcomm. During her tenure at TSMC, she established crucial supplier forecasting systems and helped the company navigate supply chain disruptions during the COVID-19 pandemic. Cliff Hou, Senior Vice President and Co-Chief Operating Officer, will assume materials management responsibilities following her departure.
TSMC (NYSE: TSM) has unveiled its next-generation A14 process technology at its North America Technology Symposium. The A14, scheduled for production in 2028, represents a significant advancement from the N2 process, offering up to 15% speed improvement at the same power, 30% power reduction at the same speed, and over 20% increase in logic density.
The company also announced several technological advances, including the evolution of TSMC NanoFlex™ to NanoFlex™ Pro and plans for 9.5 reticle size CoWoS production in 2027, enabling integration of 12 HBM stacks. The revolutionary System-on-Wafer (SoW-X) technology, promising 40X computing power compared to current CoWoS solutions, is scheduled for 2027 production.
Additional innovations include N4C RF technology for smartphones entering risk production in Q1 2026, N3A process for automotive applications, and N4e development for IoT applications.
TSMC (NYSE: TSM), the semiconductor manufacturing giant, has announced the filing of its 2024 annual report on Form 20-F with the U.S. Securities and Exchange Commission. The report has been made publicly accessible through TSMC's investor relations website. Interested parties can obtain hard copies of the report at no cost by submitting an email request to the company.
Amkor Technology (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) have signed a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor's planned facility in Peoria, Arizona, supporting TSMC's customers using its advanced wafer fabrication facilities in Phoenix.
The collaboration aims to accelerate product cycle times and address customer needs for geographic flexibility in manufacturing. The companies will jointly define specific packaging technologies, including TSMC's Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®). This partnership supports the development of a comprehensive semiconductor manufacturing ecosystem in the United States and enables seamless technology alignment for customers across a global manufacturing network.
TXOne Networks, a leader in Cyber-Physical Systems (CPS) security, has formed a strategic partnership with Applied Materials (AMAT), a renowned materials engineering solution provider in the semiconductor industry. This collaboration aims to enhance operational technology (OT) cybersecurity within the semiconductor supply chain. TXOne Networks' partnership with AMAT, which includes an investment from AMAT, is set to strengthen industry standards and innovation. Notable achievements include securing operations for over 3,600 organizations globally and contributing to key industry standards such as SEMI E187. Both companies see significant growth potential from this collaboration.
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