Banco Santander‑Chile (BSAC) places Ch$23B Series BJ bonds at 5.69%
Filing Impact
Filing Sentiment
Form Type
6-K
Rhea-AI Filing Summary
Banco Santander‑Chile reports that on April 23, 2026 it placed dematerialized bearer bonds in the local Chilean market under a previously registered credit line. The placement involved Series BJ bonds (ticker BSTDBJ0425) totaling Ch$23,000,000,000, with an average placement rate of 5.69%.
These bonds mature on October 1, 2029 and were issued using the line of credit registered in the CMF Securities Registry under number 20240007 on April 30, 2025. The disclosure is made as a Material Fact to keep investors informed about the Bank’s funding activities.
Positive
- None.
Negative
- None.
Key Figures
Bond amount: Ch$23,000,000,000
Average placement rate: 5.69%
Bond maturity date: October 1, 2029
+2 more
5 metrics
Bond amount
Ch$23,000,000,000
Series BJ bonds placed in local market
Average placement rate
5.69%
Yield on Series BJ bond placement
Bond maturity date
October 1, 2029
Maturity of Series BJ bonds (BSTDBJ0425)
Securities Registry number
20240007
CMF registration for the line of credit on April 30, 2025
Placement date
April 23, 2026
Date Banco Santander-Chile placed Series BJ bonds
Key Terms
Material Fact, dematerialized bearer bonds, line of credit, Securities Registry, +1 more
5 terms
Material Fact regulatory
"hereby report as a Material Fact regarding Banco Santander-Chile"
dematerialized bearer bonds financial
"the Bank placed dematerialized bearer bonds in the local market"
line of credit financial
"using the line of credit registered with the CMF Securities Registry"
A line of credit is a flexible borrowing arrangement that lets a company draw money up to a preset limit, repay it, and borrow again as needed—similar to a business credit card or an emergency tap on a savings account. It matters to investors because it shows how a firm manages short-term cash needs and growth funding without taking a single large loan; access, cost, and attached conditions can affect liquidity, interest expenses and financial risk.
Securities Registry regulatory
"registered with the CMF Securities Registry under number 20240007"
Financial Markets Commission regulatory
"President Financial Markets Commission Present"
FAQ
What did Banco Santander-Chile (BSAC) announce in this 6-K filing?
Banco Santander-Chile announced a Material Fact describing the placement of dematerialized bearer bonds in the local Chilean market. The Series BJ bonds totaled Ch$23,000,000,000, carried an average placement rate of 5.69%, and are part of a previously registered credit line.
What are the key terms of Banco Santander-Chile (BSAC) Series BJ bonds?
The Series BJ bonds, ticker BSTDBJ0425, were placed for a total of Ch$23,000,000,000. They have an average placement rate of 5.69% and mature on October 1, 2029, providing medium-term funding in the local Chilean bond market.
When do Banco Santander-Chile (BSAC) Series BJ bonds mature?
The Series BJ bonds issued by Banco Santander-Chile mature on October 1, 2029. This gives the bonds a medium-term tenor from the placement date of April 23, 2026, aligning the Bank’s funding with its longer-term financing needs and asset structure.
What was the size of Banco Santander-Chile (BSAC) bond placement?
Banco Santander-Chile placed Series BJ bonds totaling Ch$23,000,000,000 in the local market. This single series issuance adds to the Bank’s funding base and was carried out under a line of credit registered with the Financial Markets Commission’s Securities Registry.
What interest rate was achieved on Banco Santander-Chile (BSAC) Series BJ bonds?
The Series BJ bonds were placed at an average rate of 5.69%. This percentage reflects the yield investors required in the local market for Banco Santander-Chile’s dematerialized bearer bonds maturing in October 2029 under the registered credit line.
Under which registry number was Banco Santander-Chile (BSAC) credit line registered?
The line of credit used for this bond placement was registered in the CMF Securities Registry under number 20240007. That registration date was April 30, 2025, enabling subsequent bond issues like the Series BJ placement disclosed in this Material Fact.
