Tower Semi plans 2026 Santa Clara AI symposium

The program will address AI-driven data center demand and showcase Tower's silicon photonics, SiGe, RF and other process platforms.

Rhea-AI Filing Summary

Tower Semiconductor Ltd. will hold its 2026 Technical Global Symposium on November 17, 2026, in Santa Clara, California. The event will cover technologies and market trends shaping AI infrastructure, high-performance computing, advanced connectivity and intelligent sensing. The program includes a CEO keynote on the company’s growth and strategic roadmap, an executive panel on next-generation data center architectures, and technical sessions led by Tower executives. Those sessions will feature process technologies including silicon photonics, SiGe, RF and RF SOI, power management, sensors and displays. It is Tower’s second Technical Global Symposium in 2026, following its event in Shenzhen, China.

Key Figures

U.S. symposium date: November 17, 2026 Symposiums in 2026: 2 symposiums Operating facility in Israel: 1 facility +3 more

6 metrics

U.S. symposium date November 17, 2026 2026 Technical Global Symposium in Santa Clara, California

Symposiums in 2026 2 symposiums The U.S. event is Tower’s second Technical Global Symposium of the year

Operating facility in Israel 1 facility 200mm facility

Operating facilities in the U.S. 2 facilities 200mm facilities

Facilities in Japan 2 facilities 200mm and 300mm facilities owned through Tower’s 51% holdings in TPSCo

Tower’s holdings in TPSCo 51% Tower owns its two Japan facilities through these holdings

Key Terms

silicon photonics (SiPho), SiGe, RF SOI, process transfer, +1 more

5 terms

silicon photonics (SiPho) technical

"silicon photonics (SiPho), SiGe, RF and RF SOI"

SiGe technical

"SiPho, SiGe, RF and RF SOI"

RF SOI technical

"SiPho, SiGe, RF and RF SOI"

RF SOI is a semiconductor manufacturing technology that places a thin insulating layer under the silicon used to make radio-frequency (wireless) chips. Think of it as building a quieter, more efficient stage for high-speed signals so they don’t interfere with each other; that improves performance, reduces power loss and shrinks component size. Investors watch RF SOI because it can boost product performance and margins in wireless devices and components, affecting makers across the supply chain.

process transfer technical

"process transfer services including development, transfer, and optimization"

multi-fab sourcing technical

"To provide multi-fab sourcing and extended capacity"

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

When is the TSEM 2026 Technical Global Symposium?

Tower Semiconductor’s 2026 Technical Global Symposium is scheduled for November 17, 2026.

Where will the TSEM symposium take place?

The symposium will be held in Santa Clara, California. It is Tower’s second Technical Global Symposium of 2026, following the event in Shenzhen, China.

What topics will the TSEM symposium cover?

The event will explore technologies and market trends shaping AI infrastructure, high-performance computing, advanced connectivity and intelligent sensing. Its panel will examine next-generation data center architectures.

Who are the TSEM symposium panelists?

The listed panelists are Oliver Sun, CTO of Terahop; Hong Liu, VP & Fellow at Google AI22; Julie Sheridan Eng, CTO of Coherent; and Andy Bechtolsheim, Founder and Chief Architect of Arista.

Which technologies will Tower showcase at the TSEM symposium?

Technical sessions led by Tower executives will showcase process technologies including silicon photonics, SiGe, RF and RF SOI, power management, sensors and displays.

AI-generated analysis. How Rhea-AI works. Not financial advice.

Form 6-K: How Foreign Companies Report to the SEC →

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Available on EDGAR 09/23/2026 - 06:03 AM Accepted by SEC EDGAR 09/23/2026 - 06:01 AM Learn about SEC filing dates

UNITED STATES 

SECURITIES AND EXCHANGE COMMISSION 

Washington, D.C. 20549

FORM 6-K

REPORT OF FOREIGN PRIVATE ISSUER PURSUANT TO RULE 13a-16 OR 15d-16

OF THE SECURITIES EXCHANGE ACT OF 1934

For the month of September 2026 No.3

Commission File Number 0-24790

TOWER SEMICONDUCTOR LTD. 

(Translation of registrant's name into English)

Ramat Gavriel Industrial Park 

P.O. Box 619, Migdal Haemek, Israel 2310502

(Address of principal executive offices)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F ☒       Form 40-F ☐

On September 23, 2026, the Registrant to Showcase Technology Innovation

and Industry Leadership at its 2026 Technical Global Symposium in the United

States

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

Date: September 23, 2026   TOWER SEMICONDUCTOR LTD.   By: /s/ Nati Somekh Name: Nati Somekh Title: Corporate Secretary

 

Tower Semiconductor to Showcase Technology Innovation and Industry

Leadership at its 2026 Technical Global Symposium in the United States

MIGDAL HAEMEK, Israel, - Sept 23, 2026 - Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced its 2026 Technical Global Symposium (TGS), to be held on November 17, 2026, in Santa Clara, California, USA. Bringing together customers, partners and industry leaders, the event will explore technologies and market trends driving and shaping the evolution of AI infrastructure, high-performance computing, advanced connectivity, and intelligent sensing. Attendees will have the opportunity to engage directly with Tower’s executive leadership, technology experts, and ecosystem partners.

Following the highly successful 2026 Technical Global Symposium in Shenzhen, China, the U.S. event marks Tower’s second Technical Global Symposium of the year, underscoring the Company’s commitment to deep global customer engagement, industry collaboration and technology leadership across key semiconductor markets.

The event will feature a CEO keynote session highlighting the Company’s growth, strategic roadmap, and pivotal role in today’s semiconductor landscape, as well as an executive industry panel featuring senior leaders from leading technology companies. Featured panelists include Oliver Sun, CTO, Terahop; Hong Liu, VP & Fellow, Google AI22; Julie Sheridan Eng, CTO, Coherent; and Andy Bechtolsheim, Founder and Chief Architect, Arista.

The panel will examine the evolution of next-generation data center architectures and the technologies enabling the rapid expansion of AI-driven infrastructure. Panelists will share perspectives on the opportunities, challenges, and semiconductor innovations required to support future computing and connectivity demands.

Technical sessions led by Company executives will showcase Tower’s advanced and differentiated process technologies, including its market-leading, high-volume silicon photonics (SiPho), SiGe, RF and RF SOI, power management, sensors and displays platforms. Participants will gain insights into the last technology developments, future platform roadmaps and emerging applications shaping key high-growth markets.

For additional information, the agenda, and registration details, please visit the event webpage here.

About Tower Semiconductor

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiPho, SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, and integrated power management (BCD and 700V). Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor currently owns one operating facility in Israel (200mm), two in the U.S. (200mm), and two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo and shares a 300mm facility in Agrate, Italy with STMicroelectronics. For more information, please visit: www.towersemi.com.

Safe Harbor Regarding Forward-Looking Statements

This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. 

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Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com

Tower Semiconductor Investor Relations Contact: Liat Avraham | +972-4-6506154 | liatavra@towersemi.com