TSMC (NYSE: TSM) okays US$18,921M advanced chip capacity outlay

Rhea-AI Filing Summary

Taiwan Semiconductor Manufacturing Company Limited filed a monthly report covering insider share changes, asset transactions, major capital spending approvals and financing actions for February 2026.

Three vice presidents modestly increased their shareholdings between January 31, 2026 and February 28, 2026, while there were no new share pledges, unsecured bonds, or share cancellations. TSMC and its subsidiaries acquired fixed-income investments of NT$3.5 billion and disposed of machinery equipment of NT$1.2 billion.

The board approved large capital appropriations, including US$18,921 million for machinery equipment for advanced technology capacity, US$4,670 million for advanced packaging, mature and/or specialty technology capacity, and US$21,372 million for real estate and capitalized leased assets.

Insights

Semiconductor equity analyst

TSMC approved very large 2026 capex for advanced capacity expansion.

TSMC details sizable capital spending, with board-approved appropriations of US$18,921 million for advanced technology tools, US$4,670 million for advanced packaging and mature or specialty capacity, and US$21,372 million for real estate and capitalized leased assets.

These figures signal continued investment in leading-edge and packaging capacity, supported by significant facility and leasing commitments. The report also notes routine asset movements, including fixed-income investments of NT$3.5 billion and machinery equipment dispositions of NT$1.2 billion, and only small insider share increases.

There were no new unsecured bond issues and no share cancellations for February 2026, so funding and share count appear unchanged in this excerpt. Subsequent company filings may further describe how and when these appropriations convert into actual cash outlays and productive capacity.

1934 Act Registration No. 1-14700

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

_____________________________

FORM 6-K

_____________________________

REPORT OF FOREIGN PRIVATE ISSUER

PURSUANT TO RULE 13a-16 OR 15d-16 UNDER

THE SECURITIES EXCHANGE ACT OF 1934

For the month of March 2026

(Commission File Number: 001-14700)

_____________________________

Taiwan Semiconductor Manufacturing Company Limited

(Translation of Registrant’s Name Into English)

_____________________________

No. 8, Li-Hsin Road 6

Hsinchu Science Park

Hsinchu 300-096, Taiwan
Republic of China

(Address of Principal Executive Offices)

_____________________________

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F  x            Form 40-F  o

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):o

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):o

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

Taiwan Semiconductor Manufacturing Company Limited

Date:   March 25, 2026

By

/s/ Wendell Huang

Wendell Huang

Senior Vice President and Chief Financial Officer

Taiwan Semiconductor Manufacturing Company Limited

("TSMC"; NYSE: TSM)

This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors; 5) the unsecured bonds issued by TSMC and its subsidiaries and 6) the cancellation of TSMC common shares for the month of February 2026.

1.The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:

Title			Name			Number of shares held as of						Changes
						1/31/2026			2/28/2026
Vice President			Jonathan Lee			485,797			486,022			225
Vice President			B.Z. Tien			3,051			5,051			2,000
Vice President			Lipen Yuan			3,180			3,600			420

Note: Shareholdings include shares held by the related parties.

2.The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: None.

3.The acquisition and disposition of assets by TSMC and its subsidiaries:

(1) Fixed-income investment: NT$3.5 billion of acquisition.

(2) Machinery equipment: NT$1.2 billion of disposition.

4.The capital appropriations approved by TSMC board of directors:

(1) Machinery equipment for advanced technology capacity: US$18,921 million.

(2) Machinery equipment for advanced packaging, mature and/or specialty technology capacity: US$4,670 million.

(3) Real estate and capitalized leased assets: US$21,372 million.

5.The unsecured bonds issued by TSMC and its subsidiaries: None.

6.The cancellation of TSMC common shares: None.

FAQ

What insider shareholding changes did TSM (Taiwan Semiconductor) report for February 2026?

TSMC reported small shareholding increases for three vice presidents between January 31 and February 28, 2026. Jonathan Lee, B.Z. Tien, and Lipen Yuan each added modest amounts, and the figures include shares held by related parties according to the disclosure.

What capital expenditures did TSM (Taiwan Semiconductor) board approve in this 6-K?

TSMC’s board approved major capital appropriations: US$18,921 million for advanced technology machinery, US$4,670 million for advanced packaging and mature or specialty capacity, and US$21,372 million for real estate and capitalized leased assets, reflecting substantial planned investment across fabs and facilities.

What asset acquisitions and disposals did TSM report for February 2026?

TSMC and its subsidiaries acquired fixed-income investments totaling NT$3.5 billion and disposed of machinery equipment worth NT$1.2 billion. These transactions show portfolio management of financial assets and adjustments to production equipment during the month of February 2026.

Did TSM (Taiwan Semiconductor) issue any unsecured bonds in this period?

No unsecured bonds were issued by TSMC or its subsidiaries for February 2026. The report explicitly states that there were no unsecured bond issuances during the month, indicating no additional borrowing through this type of instrument in the period covered.

Were any TSM common shares cancelled in February 2026?

TSMC reported no cancellation of common shares for February 2026. The disclosure states that there were no share cancellations during the month, meaning the company’s outstanding common share count was unaffected by buyback retirements in this period.

What does the 6-K say about pledged TSM shares by directors and executives?

The filing states there were no changes in pledged TSMC common shares by directors, executive officers, or shareholders owning more than 10% during February 2026. This suggests existing pledge levels, if any, remained stable over the month according to the disclosure.