Welcome to our dedicated page for Taiwan Semi SEC filings (Ticker: TSM), a comprehensive resource for investors and traders seeking official regulatory documents including 10-K annual reports, 10-Q quarterly earnings, 8-K material events, and insider trading forms.
Taiwan Semiconductor Manufacturing Company Ltd. filings document the reporting framework of a foreign private issuer and ADR whose U.S. disclosures include Form 6-K current reports and annual Form 20-F materials. The filings cover consolidated revenue reports, quarterly earnings presentations, accounting differences between Taiwan-IFRSs and IASB-issued IFRSs, and operating results for the company's semiconductor foundry business.
TSMC's regulatory disclosures also address shareholder meeting agendas, business reports and financial statements, Audit and Risk Committee review materials, earnings distribution, directors' compensation, employee profit-sharing bonuses, amendments to corporate procedures, unsecured bond issuance, asset acquisitions and dispositions, capital appropriations, share cancellations, and changes in shareholdings or pledges by directors, executive officers and large shareholders.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Chuang Tzu-Sou reported an indirect open-market purchase of 48 Common Shares (2330.TW) on May 8, 2026 at $71.82 per share. The shares were bought by the administrator of the company’s Employee Stock Purchase Plan on his behalf and are held by an ESPP trust.
Following this transaction, he indirectly holds 5,668 shares via the ESPP trust and 7,036 shares via a Long-Term Incentive bonus plan trust, and directly holds 2,695,165 shares. The filing shows a small net buy activity relative to his overall position.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD vice president Juiping Chuang reported a small open-market purchase linked to the company’s Employee Stock Purchase Plan. An ESPP trust bought 51 Common Shares (2330.TW) at $71.82 per share on May 8, 2026, increasing the indirect ESPP trust holding to 4,096 shares.
Beyond this plan purchase, the filing shows broader ownership positions. Chuang directly holds 239,738 Common Shares and 50 American Depositary Shares, each ADS representing five Common Shares. Additional indirect holdings include 106,000 Common Shares held by a spouse and 7,036 Common Shares held by a long-term incentive bonus plan trust over which Chuang has investment control.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Jun He reported an indirect purchase of Common Shares (2330.TW) on behalf of an Employee Stock Purchase Plan. An ESPP trust bought 49 Common Shares at $71.82 per share under terms predetermined by the issuer.
After this transaction, the ESPP trust held 5,224 Common Shares. Jun He also had indirect holdings of 7,036 Common Shares through a Long-Term Incentive trust and 216 American Depositary Shares in a joint account with a spouse. Directly, he held 120,119 Common Shares, plus direct positions of 852 and 302 American Depositary Shares. Each American Depositary Share represents five Common Shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD senior vice president Tzonz-Sheng Chang reported a small share purchase through an employee plan. On May 8, 2026, a trust under the Employee Stock Purchase Plan bought 56 Common Shares (2330.TW) for him at $71.82 per share in an open‑market transaction pursuant to terms predetermined by the issuer.
After this transaction, he indirectly holds 5,269 shares via the ESPP trust and 10,581 shares via an LTI trust, in addition to 317,638 Common Shares held directly. The filing shows incremental accumulation through compensation-related plans rather than a large discretionary trade.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Min Cao reported a small indirect share purchase. On May 8, 2026, an administrator for the company’s Employee Stock Purchase Plan bought 59 Common Shares (2330.TW) at $71.82 per share in an open-market transaction on behalf of Cao under predetermined plan terms.
After this ESPP transaction, Cao’s reported holdings include 6,554 Common Shares held by an ESPP trust, 10,581 Common Shares held by an LTI trust, 34,470 Common Shares held by a spouse, and 507,879 Common Shares held directly. No derivative securities are listed as outstanding in this filing.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Pei-Hung Chen reported an indirect purchase of 49 Common Shares (2330.TW) at $71.82 per share on May 8, 2026 through the company’s Employee Stock Purchase Plan. Following this, indirect holdings include 1,213 shares via an ESPP trust, 83,143 shares held by a spouse, and 7,036 shares via an LTI trust, alongside 433,414 shares held directly.
Taiwan Semiconductor Manufacturing Co. EVP and Co-COO Chin Yung-Pei indirectly increased his stake through the company’s Employee Stock Purchase Plan. On May 8, 2026, an ESPP trust bought 75 common shares (2330.TW) at $71.82 per share on his behalf under predetermined plan terms.
After this ESPP purchase, indirect holdings include 8,223 shares via the ESPP trust, 4,190,107 shares held by his spouse, and 63,345 shares in a Long-Term Incentive bonus plan trust, alongside 5,171,935 shares held directly. The transaction is very small relative to his overall position and appears routine and compensation-related.
Taiwan Semiconductor Manufacturing Co. Ltd. Controller Chih-Ho Chen reported a small net share increase through an employee program. On May 8, 2026, an ESPP trust associated with Chen bought 34 Common Shares (2330.TW) at $71.82 per share, under predetermined Employee Stock Purchase Plan terms.
After this purchase, the ESPP trust held 74 common shares for Chen. The filing also shows 8,000 common shares held indirectly via Homewarm Advisory Co., Ltd., 363 shares held indirectly by Chen’s spouse, and 5,367 shares held directly.
Taiwan Semiconductor Manufacturing Company Limited (TSMC) filed a Form 6-K highlighting a new strategic step with Sony Semiconductor Solutions. The two companies signed a non-binding memorandum of understanding to form a joint venture for developing and manufacturing next-generation image sensors.
Under the proposal, Sony would be the majority and controlling shareholder of the JV, which would set up development and production lines in Sony’s new fab in Koshi City, Kumamoto Prefecture. The partnership intends to combine Sony’s image sensor design capabilities with TSMC’s process technology and manufacturing strengths, targeting improved sensor performance and emerging physical AI uses in areas such as automotive and robotics.
Potential JV investments and additional capital spending by Sony in its Nagasaki plant are being discussed, with phased implementation based on market demand and expected support from the Japanese government. The JV’s creation remains subject to a definitive legally binding agreement and customary closing conditions.
Taiwan Semiconductor Manufacturing Company Limited reported strong April 2026 revenue momentum. On a consolidated basis, net revenue for April 2026 was approximately NT$410.73 billion, down 1.1% from March 2026 but up 17.5% from April 2025, showing solid year-on-year growth despite a slight month-on-month dip.
Net revenue for January through April 2026 totaled NT$1,544.83 billion, a 29.9% increase versus the same period in 2025, indicating robust demand early in the year. The company also disclosed intercompany lending limits and balances, guarantees for key subsidiaries, and foreign-exchange derivative positions with both realized losses and unrealized gains.