Taiwan Semiconductor Manufacturing Company Ltd. filings document the reporting framework of a foreign private issuer and ADR whose U.S. disclosures include Form 6-K current reports and annual Form 20-F materials. The filings cover consolidated revenue reports, quarterly earnings presentations, accounting differences between Taiwan-IFRSs and IASB-issued IFRSs, and operating results for the company's semiconductor foundry business.
TSMC's regulatory disclosures also address shareholder meeting agendas, business reports and financial statements, Audit and Risk Committee review materials, earnings distribution, directors' compensation, employee profit-sharing bonuses, amendments to corporate procedures, unsecured bond issuance, asset acquisitions and dispositions, capital appropriations, share cancellations, and changes in shareholdings or pledges by directors, executive officers and large shareholders.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) executive Kevin Xiaoqiang Zhang, SVP and Deputy Co-COO, reported an indirect purchase of 61 Common Shares (2330.TW)$76.20 per shareESPP Trust for his benefit. After this transaction he indirectly holds 7,347 Common Shares via the ESPP trust, in addition to 349,976 Common Shares held directly, 2,500 American Depositary Shares (TSM) held directly, and 20,190 Common Shares held indirectly through a trust under the Long-Term Incentive (LTI) Bonus Plan, over which he has obtained investment control. No Rule 10b5-1 trading plan is reported.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Vice President Yuan Lipen acquired additional Common Shares on September 7, 2026. An administrator of the company’s Employee Stock Purchase Plan bought 41 shares on Yuan’s behalf at $76.20 per share, translated from New Taiwan dollars under a stated FX rate, and these are held indirectly in an ESPP trust, bringing that ESPP-related position to 1,301 shares. On the same date, Yuan is also reported to hold 7,000 shares directly and 2,000 shares indirectly through a spouse. No Rule 10b5-1 trading plan is reported.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that executive vice president and co–chief operating officer Yuh-Jier Mii indirectly purchased 71 Common Shares on September 7, 2026 at $76.20 per share, through the administrator of the company’s Employee Stock Purchase Plan, increasing indirect ESPP holdings to 8,170 Common Shares. Separate holdings disclosed include a substantial direct position in Common Shares, additional shares held via a Long-Term Incentive bonus plan trust, direct holdings of American Depositary Shares, and Equity Linked Notes referencing up to 703 ADSs that may settle in shares or cash at maturity. No Rule 10b5-1 trading plan is reported.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that senior vice president Shien-Yang Wu acquired 57 Common Shares on September 7, 2026 through the issuer's Employee Stock Purchase Plan, at $76.20 per share, with purchases made by the ESPP administrator under predetermined terms. The filing also lists Wu's resulting holdings in Common Shares and American Depositary Shares, including shares held directly, through incentive-plan trusts, and by a spouse; no Rule 10b5-1 trading plan is reported.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Chairman and CEO Che-Chia Wei had 149 common shares purchased on September 7, 2026 through the administrator of the company’s Employee Stock Purchase Plan, at $76.20 per share, held indirectly via an ESPP trust pursuant to predetermined plan terms. Following this transaction, reported indirect ESPP-related holdings were 18,136 shares, in addition to 7,656,724 shares held directly, 285,245 shares held through a Long-Term Incentive bonus plan trust, and 700,261 shares held indirectly by his spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Vice President Bor-Zen Tien indirectly purchased additional equity on September 7, 2026. An administrator for the company’s Employee Stock Purchase Plan bought 43 Common Shares (2330.TW) for an ESPP trust and 5 Common Shares for an immediate family member, both at $76.20 per share, with the U.S. price translated from an average purchase price of NT$2,404.3453 at a rate of NT$31.552 to US$1. These purchases were made pursuant to terms predetermined by the issuer and no Rule 10b5-1 trading plan is reported.
Following these transactions, Tien is reported as holding 313 Common Shares indirectly via the ESPP trust and 85 Common Shares indirectly through an immediate family member, along with direct holdings of 14,051 Common Shares and 132 American Depositary Shares, plus 5,000 Common Shares held indirectly through a spouse. Each American Depositary Share represents five Common Shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Senior Vice President Wang Ying-Lang acquired 54 Common Shares on September 7, 2026 at $76.20 per share, purchased by the administrator of the Employee Stock Purchase Plan on his behalf and held indirectly through an ESPP trust. Following this transaction, he is reported to hold Common Shares both directly and indirectly through an ESPP trust, an LTI bonus plan trust, and his spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that vice president Lu Chin-Sheng acquired common shares through the company’s Employee Stock Purchase Plan. On September 7, 2026, the ESPP administrator purchased 38 common shares on his behalf at $76.20 per share (translated from New Taiwan dollars), which are held indirectly in an ESPP trust, bringing that ESPP-related position to 151 shares. He is also reported as holding 50,967 common shares directly and 3,000 common shares indirectly through his spouse. No Rule 10b5-1 trading plan is reported for these transactions.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that VP and CIO Chris Horng-Dar Lin indirectly purchased 47 Common Shares (2330.TW) on September 7, 2026 at $76.20 per share, through the administrator of the company’s Employee Stock Purchase Plan (ESPP) acting via an ESPP trust. The purchase was made under predetermined ESPP terms, and no Rule 10b5-1 trading plan is reported. After this ESPP transaction, indirect ESPP trust holdings rose to 5,978 Common Shares, alongside separate direct and indirect positions in Common Shares and American Depositary Shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that VP Shyue-Shyh Lin had 44 common shares purchased on September 7, 2026 through the administrator of the company’s Employee Stock Purchase Plan (ESPP) at a price of $76.20 per share, held indirectly via an ESPP trust. Following this ESPP purchase, the ESPP trust held 340 shares for his benefit, in addition to 30,269 shares held directly and 5,000 shares held indirectly by his spouse. No Rule 10b5-1 trading plan is reported for these transactions.