Taiwan Semiconductor Manufacturing Company Ltd. filings document the reporting framework of a foreign private issuer and ADR whose U.S. disclosures include Form 6-K current reports and annual Form 20-F materials. The filings cover consolidated revenue reports, quarterly earnings presentations, accounting differences between Taiwan-IFRSs and IASB-issued IFRSs, and operating results for the company's semiconductor foundry business.
TSMC's regulatory disclosures also address shareholder meeting agendas, business reports and financial statements, Audit and Risk Committee review materials, earnings distribution, directors' compensation, employee profit-sharing bonuses, amendments to corporate procedures, unsecured bond issuance, asset acquisitions and dispositions, capital appropriations, share cancellations, and changes in shareholdings or pledges by directors, executive officers and large shareholders.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Senior Vice President Wu Shien-Yang acquired 12,881 Common Shares on September 1, 2026 through vesting under the company’s Employee Restricted Stock Awards Rules. Following this vesting, Wu directly holds 643,109 Common Shares and has additional indirect interests through an ESPP trust, an LTI bonus plan trust, and spouse holdings in both Common Shares and American Depositary Shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that officer Kevin Xiaoqiang Zhang, SVP and Deputy Co-COO, acquired 20,313 Common Shares on September 1, 2026 through vesting under the issuer's Employee Restricted Stock Awards Rules. Following this vesting, he holds 349,976 Common Shares directly, plus additional indirect holdings through employee plans and trusts.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Chairman and CEO Che-Chia Wei acquired 204,375 Common Shares on September 1, 2026 through vesting of awards under the company’s Employee Restricted Stock Awards Rules, with no purchase price paid. Following this vesting, he directly holds 7,656,724 Common Shares and indirectly holds additional shares through an Employee Stock Purchase Plan trust, a Long-Term Incentive bonus plan trust, and by his spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that EVP and Co-COO Mii Yuh-Jier acquired 32,204 Common Shares (2330.TW) on September 1, 2026 through vesting under the issuer's Employee Restricted Stock Awards Rules at no cost. After this award, the reporting person holds 1,286,261 Common Shares directly, plus additional interests through an ESPP trust, an LTI bonus plan trust, American Depositary Shares, and Equity Linked Notes referencing TSM ADSs.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Senior Vice President Wang Ying-Lang acquired 12,881 Common Shares on September 1, 2026 through the vesting of restricted stock awards at no cash price. Following this grant, Wang holds 375,273 Common Shares directly, plus additional indirect holdings through an ESPP trust, an LTI bonus plan trust, and a spouse’s account.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that VP Lu Lee-Chung acquired 8,175 Common Shares of the company on September 1, 2026 as a vested award under the issuer's Employee Restricted Stock Awards Rules. Following this vesting, Lu directly holds 284,891 Common Shares and also has indirect beneficial ownership of 6,434 shares through an Employee Stock Purchase Plan trust, 7,036 shares through a Long-Term Incentive bonus plan trust, and 15,000 shares held by a spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that officer Chris Horng-Dar Lin, VP and CIO, acquired 8,175 Common Shares on September 1, 2026, as vested shares under the issuer's Employee Restricted Stock Awards Rules. These were granted at no stated price, increasing his directly held Common Shares to 136,359.
He also directly holds 2,800 American Depositary Shares, and has indirect interests in 5,931 Common Shares through an Employee Stock Purchase Plan trust, 7,036 Common Shares through a Long-Term Incentive Bonus Plan trust, and his spouse holds 15,000 Common Shares and 3,560 ADSs. A family trust holds an additional 8,460 ADSs. Each ADS represents five Common Shares, and the filing indicates these transactions were not made pursuant to a Rule 10b5-1 trading plan.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Senior Vice President Chun-Hsien Lee acquired 12,881 common shares of the company on September 1, 2026 through vesting of employee restricted stock awards at no cash cost. Following this vesting, Lee directly holds 518,913 common shares, with additional indirect holdings through an employee stock purchase plan trust, a long-term incentive plan trust, and shares held by a spouse. The transactions were not reported as made under a pre-arranged Rule 10b5-1 trading plan.
For TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM), VP Kuo-Chin Hsu acquired 8,175 Common Shares on September 1, 2026 through vesting under the issuer's Employee Restricted Stock Awards Rules at no cash price. Following this award, Hsu holds 187,099 Common Shares directly, plus additional direct and indirect positions in Common Shares and American Depositary Shares, including holdings via an ESPP trust, an LTI bonus plan trust, and by spouse.
For TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM), SVP and CFO Huang Jen-Chau reported an acquisition of 20,313 Common Shares (2330.TW) on September 1, 2026 as a vesting of restricted stock awards under the company’s Employee Restricted Stock Awards Rules, at a stated price of $0.00 per share. Following this vesting, Huang directly holds 1,831,856 common shares, and also has indirect holdings of 3,553 shares through an ESPP trust and 20,190 shares through an LTI bonus plan trust over which he has investment control.