Taiwan Semiconductor Manufacturing Company Ltd. filings document the reporting framework of a foreign private issuer and ADR whose U.S. disclosures include Form 6-K current reports and annual Form 20-F materials. The filings cover consolidated revenue reports, quarterly earnings presentations, accounting differences between Taiwan-IFRSs and IASB-issued IFRSs, and operating results for the company's semiconductor foundry business.
TSMC's regulatory disclosures also address shareholder meeting agendas, business reports and financial statements, Audit and Risk Committee review materials, earnings distribution, directors' compensation, employee profit-sharing bonuses, amendments to corporate procedures, unsecured bond issuance, asset acquisitions and dispositions, capital appropriations, share cancellations, and changes in shareholdings or pledges by directors, executive officers and large shareholders.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that VP Syun-Ming Jang acquired 8,175 Common Shares on September 1, 2026 through a vesting of restricted stock awards at no cash price, under the company’s Employee Restricted Stock Awards Rules. Following this vesting, Jang holds 452,054 Common Shares directly and additional indirect interests through an ESPP trust, an LTI trust, and shares held by a spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that VP Jun He acquired 8,175 Common Shares on September 1, 2026 through the vesting of awards under the issuer's Employee Restricted Stock Awards Rules, at a reported price of $0.00 per share. Following this vesting, Jun He directly holds 128,294 Common Shares. In addition, there are indirect holdings of 5,361 Common Shares via an Employee Stock Purchase Plan trust, 7,036 Common Shares via a Long-Term Incentive Bonus Plan trust, and 216 American Depositary Shares held by the spouse, each ADS representing five Common Shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that officer Yung-Chin Hou, SVP and Deputy Co-COO, acquired 20,313 Common Shares on September 1, 2026 as a vested grant under the company’s Employee Restricted Stock Awards Rules, at no cash price. Following this vesting, Hou holds 682,716 Common Shares directly. He also has indirect holdings of 7,460 Common Shares through an Employee Stock Purchase Plan trust, 20,190 Common Shares through a Long-Term Incentive bonus plan trust over which he has investment control, and 60,802 Common Shares held by his spouse. The filing indicates these transactions were not made under a Rule 10b5-1 trading plan.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that officer Tzu-Sou Chuang, a VP, acquired 8,175 Common Shares on September 1, 2026 as a vested restricted stock award at no cost under the Employee Restricted Stock Awards Rules. After this vesting, Chuang directly holds 1,503,340 Common Shares, and also has indirect holdings of 5,806 shares through an Employee Stock Purchase Plan trust and 7,036 shares through a Long-Term Incentive bonus plan trust over which investment control has been obtained.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Executive Vice President and Co‑Chief Operating Officer Chin Yung‑Pei acquired 32,204 common shares on September 1, 2026 through vesting of restricted stock awards at no cost. After this vesting, Chin Yung‑Pei holds 5,204,139 common shares directly, plus additional indirect holdings through an employee stock purchase plan, a long‑term incentive trust, and a spouse. The transactions were not made under a Rule 10b5‑1 trading plan.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Senior Vice President Tzonz-Sheng Chang acquired 12,881 Common Shares on September 1, 2026 through vesting under the company’s Employee Restricted Stock Awards Rules at no cash price. Following this grant, Chang holds 157,519 shares directly, plus indirect holdings of 5,428 shares via an ESPP trust, 10,581 shares via an LTI bonus plan trust over which he has investment control, and 173,000 shares held by his spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that officer Fang Shu-Hua, SVP and GC, acquired 20,313 Common Shares (2330.TW) on September 1, 2026 through the vesting of employee restricted stock awards at no cash price. After this vesting, Fang holds 878,705 Common Shares directly, plus additional indirect holdings through an ESPP trust, an LTI bonus plan trust over which Fang has investment control, a spouse, an immediate family member, and two affiliated companies.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (symbol: TSM) is the issuer of record for a Form 4 filing submitted to the SEC.
Taiwan Semiconductor Manufacturing Co Ltd (TSM) reported that VP and reporting person Chuang Juiping acquired 8,175 Common Shares on September 1, 2026 through vesting of awards under the Employee Restricted Stock Awards Rules, bringing direct holdings to 247,913 Common Shares. The filing also lists additional indirect holdings in Common Shares and American Depositary Shares held through an ESPP trust, an LTI trust, and the reporting person's spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reports a technical adjustment to its previously approved first-quarter 2026 cash dividend. The board had approved a total cash dividend of NT$181,526,590,469, or NT$7.0 per common share, on May 12, 2026, with payment scheduled for October 8, 2026.
Because some shares from 2024 restricted stock awards were reclaimed between the approval date and the dividend record date, the number of common shares outstanding changed slightly. As a result, the cash dividend per share for the first quarter of 2026 is formally adjusted to NT$7. per common share, reflecting only a minuscule difference from the original per-share amount.