Acm Research Stock Price, News & Analysis

ACM Research (NASDAQ: ACMR) has announced its schedule for releasing third quarter 2024 financial results. The company will disclose its preliminary revenue range on October 30, 2024, before the U.S. market opens, coinciding with the reporting obligations of its subsidiary, ACM Research (Shanghai), to the Shanghai Stock Exchange. Full financial results will be released on November 7, 2024, also before the U.S. market opens.

A conference call to discuss the results is scheduled for 8:00 a.m. U.S. Eastern Time (9:00 p.m. China Time) on November 7. Participants can join via telephone by pre-registering through an online link, which will provide dial-in information and a PIN for access. Alternatively, a live webcast will be available on the Investors section of ACM's website.

ACM Research, Inc. (NASDAQ: ACMR) announced that its subsidiary ACM Research (Shanghai) posted backlog figures on the Shanghai Stock Exchange website. As of September 30, 2024, ACM Shanghai's total backlog was RMB 6,764.6 million (USD $964.8 million), compared to RMB 6,795.8 million on September 27, 2023, representing a slight year-over-year decrease of 0.46%.

The backlog includes orders for shipped tools not yet recognized as revenue under Chinese GAAP and orders for future shipments. ACM Shanghai will release its full financial results for the nine months ended September 30, 2024, on October 30, 2024, while ACM will report preliminary results on the same day. Full Q3 2024 financial results and a conference call are scheduled for early November 2024.

ACM Research (NASDAQ: ACMR) has received orders for four wafer-level packaging tools from U.S.-based entities. Two tools were ordered by a U.S. customer and two by a U.S. R&D center. These tools support advanced packaging processes like coating, developing, wet etching, and scrubbing. Delivery is scheduled for the first half of 2025. The customer's orders are for first tools subject to technical qualification, potentially leading to follow-on production orders. The R&D center's orders aim to advance wafer-level packaging research and showcase ACM's capabilities to prospective customers. Dr. David Wang, ACM's CEO, views these orders as demonstrating the company's broad range of advanced tools and growing traction with U.S.-based customers.

ACM Research (NASDAQ: ACMR) has launched the Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This innovative system is designed for double-sided bevel etching and cleaning in copper-related processes, enhancing efficiency and reliability. The tool can handle panel sizes from 510 mm x 515 mm to 600 mm x 600 mm, with thicknesses of 0.5 mm to 3 mm and warpages up to 10 mm.

Key features include advanced panel handling, efficient copper removal using diluted sulfuric acid and peroxide, and high throughput of 40 panels per hour. The Ultra C bev-p offers bevel control accuracy of ±0.2 mm and an exclusive control range of 0-20 mm. With a mean time between failures of 500 hours and 95% uptime, it ensures exceptional reliability and consistent performance for high-volume production.

ACM Research (NASDAQ: ACMR) reported strong Q2 2024 results, with record revenue of $202.5 million, up 40% year-over-year. The company achieved a gross margin of 47.8% and diluted EPS of $0.35. ACM introduced new products, including a Panel Electrochemical Plating tool for fan-out panel-level packaging. The company raised its 2024 revenue outlook to $695-$735 million and increased its long-term revenue target to $3 billion. ACM also announced plans to purchase a R&D facility with a clean room in Oregon to expand its U.S. footprint.

ACM Research (NASDAQ: ACMR) has launched the Ultra ECP ap-p tool for fan-out panel-level packaging (FOPLP). This innovative system employs horizontal plating for exceptional uniformity across panels, supporting sizes up to 600mm x 600mm. The tool is designed for advanced packaging with sub-micron features, particularly suitable for GPUs and high-density high bandwidth memory (HBM).

Key features include:

• Compatibility with organic and glass substrates
• Capabilities for Cu via filling, Cu pillar, Ni, SnAg plating, and solder bumping
• Proprietary technology for consistent plating across panels
• Advanced automation for efficiency and quality control

ACM believes FOPLP offers substantial growth prospects in meeting demands for low latency, high bandwidth, and cost-efficiency in semiconductor chips.

ACM Research, Inc. (NASDAQ: ACMR) has appointed Howard Chen as General Counsel and Vice President of Corporate Strategy, effective July 1, 2024. Chen, a leading high-tech legal practitioner with over 25 years of experience, brings valuable legal knowledge and industry insight to ACM. Previously, he served as Co-Chair of the China Practice at Greenberg Traurig and has represented numerous global technology companies with significant operations in Asia.

ACM's CEO, Dr. David Wang, expressed confidence that Chen's leadership will enhance the company's legal strategies and IP portfolio, supporting its mission to become a key supplier in the global semiconductor industry. Chen's career began with an engineering role at AMD, and he has since made significant contributions to technology firms globally. His accolades include being named one of the 'Best Lawyers in America' and 'IP Stars'.

ACM Research (NASDAQ: ACMR) has introduced the Ultra C vac-p flux cleaning tool for fan-out panel-level packaging (FOPLP), marking its entry into this growing market. The tool uses vacuum technology and IPA drying to efficiently remove flux residues from chiplet structures, addressing critical cleaning challenges in advanced packaging processes.

ACM has already received and shipped a purchase order from a major Chinese semiconductor manufacturer. The FOPLP market is expected to grow from 2% in 2022 to 8% in 2028, driven by potential cost savings and increased efficiency. The Ultra C vac-p tool's innovative approach ensures thorough cleaning of small bump pitches and large chip sizes, overcoming limitations of traditional methods.

ACM Research (NASDAQ:ACMR) has announced the release date for its second quarter 2024 financial results. The company will unveil its earnings before the U.S. market opens on Wednesday, August 7, 2024. Following the release, ACM will host a conference call at 8:00 a.m. U.S. Eastern Time (8:00 p.m. China Time) to discuss the results.

Participants can join the call via telephone by pre-registering through an online link, which will provide dial-in information and a PIN for access. Alternatively, interested parties can join the webcast directly through ACM's investor relations website. Both live and archived versions of the webcast will be available on the company's website at www.acmrcsh.com.