ACM Research, Inc. develops, manufactures and sells wafer and panel processing equipment for semiconductor manufacturing and advanced packaging applications. Company news commonly covers financial results, shipment trends, customer orders, and product introductions across cleaning, electroplating, stress-free polishing, vertical furnace, track, PECVD, and wafer- and panel-level packaging tools.
Recurring updates also include ACM’s ACM Planetary Family product organization, advanced packaging platforms, global customer activity, production-capacity initiatives, and disclosures involving ACM Research (Shanghai), Inc., the company’s principal operating subsidiary listed on the Shanghai Stock Exchange STAR Market.
ACM Research (NASDAQ: ACMR) has announced the successful delivery of its first Ultra Lith KrF track system to a leading Chinese logic wafer fab customer in September 2025. The new system expands ACM's lithography product line and features high-throughput performance of over 300 wafers per hour.
The system includes a flexible configuration with 12 spin coaters, 12 developers, and 54 hot plates. It incorporates proprietary backside particle removal unit (BPRV) technology and an integrated wafer-scale outlier inspection (WSOI) unit for real-time process monitoring. The platform builds upon ACM's ArF track platform, which demonstrated successful demo-line process verification in late 2024.
ACM Research (NASDAQ: ACMR) reported strong Q2 2025 financial results with revenue of $215.4 million, up 6.4% year-over-year. The company maintained its FY2025 revenue guidance of $850-950 million. Q2 GAAP net income reached $29.8 million ($0.44 per diluted share), compared to $24.2 million in Q2 2024.
Key highlights include 48.5% gross margin, exceeding the company's target range of 40-45%, and total shipments of $206.4 million, up 1.9% year-over-year. ACM announced major upgrades to its Ultra C wb cleaning tool with patent-pending N₂ bubbling technology and delivered its 1,500th ECP chamber, marking significant technological progress.
The company reported strong cash position with $483.9 million in cash, restricted cash, and time deposits as of June 30, 2025, demonstrating solid financial health despite a slight decrease from $498.4 million in Q1 2025.
ACM Research (NASDAQ: ACMR) has announced significant upgrades to its Ultra C wb wet bench cleaning tool for advanced semiconductor manufacturing. The enhanced system features a patent-pending nitrogen (N2) bubbling technology that improves wet etching uniformity by more than 50% compared to conventional batch processes.
The upgraded tool includes enhanced etching uniformity, improved particle removal performance, and expanded process capabilities compatible with various chemical solutions. The technology is particularly valuable for manufacturing 3D DRAM, 3D logic, and 500+ layer 3D NAND devices. The N2 bubbling technology can also be applied to ACM's Ultra C Tahoe platform for future process requirements.
ACM Research (NASDAQ: ACMR) has scheduled its second quarter 2025 financial results release for August 6, 2025, before the U.S. market opens. The company will host a conference call at 8:00 a.m. Eastern Time (8:00 p.m. China Time) to discuss the quarterly performance.
Participants can join via telephone through pre-registration or access the live webcast through ACM's investor relations website. The pre-registration process aims to minimize delays from operator congestion. An archived version of the webcast will be available on the Investors section of ACM's website.
Alvotech (NASDAQ: ALVO), Kashiv Biosciences, and Advanz Pharma announced that the UK Medicines and Healthcare Products Regulatory Agency (MHRA) has accepted a marketing application for AVT23, a proposed biosimilar to Xolair® (omalizumab). The biosimilar targets treatments for severe persistent allergic asthma and chronic rhinosinusitis with nasal polyps.
Xolair recorded global sales of $4.4 billion in 2024. The development builds on previous partnerships, including a February 2023 commercialization agreement between Alvotech and Advanz Pharma for AVT23, which was expanded in May 2023 to include five additional biosimilar candidates. Additionally, Alvotech and Kashiv established a licensing agreement for AVT23 in October 2023.
ACM Research has released preliminary unaudited financial results for Q1 2025, projecting revenue between $165-170 million, representing 8.4-11.7% year-over-year growth. The semiconductor equipment supplier reported:
- Expected Q1 2025 total shipments of $154-157 million, showing a 36-37% year-over-year decrease due to Q4 2024 customer pull-ins
- Combined Q4 2024 and Q1 2025 shipments expected to grow 8-9% versus prior year periods
- Reaffirmed full-year 2025 revenue outlook of $850-950 million, targeting 9-21% annual growth
ACM Shanghai, the company's main operating subsidiary (81.1% owned), will report separate results in RMB under Chinese accounting standards. The parent company will discuss complete Q1 2025 results during its May 8 earnings call.
ACM Research (NASDAQ: ACMR) has announced its upcoming financial results schedule for Q1 2025. The company will release its preliminary revenue range on April 29, 2025, before U.S. market open, aligning with the reporting requirements of ACM Research (Shanghai) to the Shanghai Stock Exchange.
The complete Q1 2025 financial results will be disclosed on May 8, 2025, before U.S. market open, followed by a conference call at 8:00 a.m. U.S. Eastern Time (8:00 p.m. China Time). Participants can join via telephone through pre-registration or access the webcast through the company's investor relations website.
ACM Research (NASDAQ: ACMR) has won the 2025 3D InCites Award in the Technology Enablement category for its Ultra ECP ap-p tool, a groundbreaking solution for fan-out panel-level packaging (FOPLP). The system is the first commercially-available high-volume copper deposition system for the large panel market.
The tool supports panel sizes of 515 mm x 510 mm and 600 mm x 600 mm, utilizing a horizontal plating approach for superior uniformity and precision. It can be used for various plating processes including pillar, bump and redistribution layer. The award recognizes ACM's contribution to solving critical challenges in heterogeneous integration.
ACM's FOPLP portfolio includes:
- Ultra ECP ap-p for copper deposition
- Ultra C vac-p for flux cleaning
- Ultra C bev-p for bevel etching and cleaning