Laser Photonics Expands UV Laser Technology for Medical and Electronics

ORLANDO, Fla.--(BUSINESS WIRE)-- Laser Photonics Corporation (NASDAQ: LASE) (“LPC”), a leading global developer of industrial laser systems for cleaning and other material processing applications, and its subsidiary, Control Micro Systems, Inc. (CMS Laser), today announced an accelerated research and development initiative for their UV laser cutting and marking systems for microelectronics and medical device manufacturers.

Today, ultraviolet (UV) lasers are used in fabrication that requires the highest level of precision. This includes the manufacturing of electronic components, medical devices, pharmaceutical packaging, semiconductors, LED wafers, credit cards, and other segments where low heat impact and high resolution are key requirements.

“Collaborating closely with CMS Laser, Laser Photonics is advancing the research and development of high-precision material processing with UV lasers for the microelectronics and medical industries,” said John Armstrong, Executive Vice President of LPC. “These high-value laser solutions expand our broad range of capabilities and applications, delivering even greater value to our clients and shareholders.”

One of CMS Laser’s innovative UV laser-powered cutting systems is the PCB Depaneling system. This technology guarantees a non-charring separation process for small-size printed circuit boards, carried out with extremely tight tolerances. This purpose-built system also integrates the company’s smart Through the Optics Vision (TTOV) for high-speed locating of board fiducial markings, ensuring accurate alignment.

In addition to UV lasers, CMS Laser designs custom laser systems integrating fiber, CO₂, and ultra-short laser sources. Visitors can bring samples to CMS Laser’s applications development lab for in-house material testing and analysis. A laser specialist will help determine the ideal solution that will meet each client’s unique manufacturing and research needs.

Leveraging CMS Laser’s specialized expertise, LPC is channeling resources into R&D in the UV laser cutting and marking technology development. This move aims to enhance shareholder value and build resilience in evolving markets. For more information, visit the LPC website at www.laserphotonics.com.

About Laser Photonics Corporation

Laser Photonics is a vertically integrated manufacturer and R&D Center of Excellence for industrial laser technologies and systems. Laser Photonics seeks to disrupt the $46 billion, centuries-old sand and abrasives blasting markets, focusing on surface cleaning, rust removal, corrosion control, de-painting and other laser-based industrial applications. Laser Photonics’ new generation of leading-edge laser blasting technologies and equipment also addresses the numerous health, safety, environmental and regulatory issues associated with old methods. As a result, Laser Photonics quickly gained a reputation as an industry leader in industrial laser systems with a brand that stands for quality, technology and product innovation. Currently, world-renowned and Fortune 1000 manufacturers in the aviation, automotive, defense, energy, maritime, nuclear and space industries are using Laser Photonics’ “unique-to-industry” systems. For more information, visit https://www.laserphotonics.com.

About CMS Laser

Control Micro Systems (CMS Laser), is a 40-year U.S. pioneer in software controls development for laser machines. Today, the company produces turnkey laser material processing systems for marking, cutting, drilling, welding, cleaning and more. Its cutting-edge laser systems are expertly engineered for high-precision applications in a wide range of industries and tailored to each client’s unique manufacturing needs. CMS Laser specializes in developing laser systems for a wide range of industries. It also counts several top 20 global life sciences companies among their customers. For more information, visit Control Micro Systems, Inc., a Laser Photonics company.

Cautionary Note Concerning Forward-Looking Statements

This press release contains “forward-looking statements” (within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended), including statements regarding the Company’s plans, prospects, potential results and use of proceeds. These statements are based on current expectations as of the date of this press release and involve a number of risks and uncertainties, which may cause results and uses of proceeds to differ materially from those indicated by these forward-looking statements. These risks include, without limitation, those described under the caption “Risk Factors” in the Registration Statement. Any reader of this press release is cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date of this press release. The Company undertakes no obligation to revise or update any forward-looking statements to reflect events or circumstances after the date of this press release except as required by applicable laws or regulations.