MACOM Announces Two New 448G per Lane Drivers for 3.2T Data Center Connectivity
MACOM (NASDAQ:MTSI) announced two new 448G per lane PAM4 drivers—MAOM-025408 Mach-Zehnder Driver and MAOM-022404 EML Driver—available March 17, 2026 to accelerate 1.6T and 3.2T optical transceiver development.
Sentiment and the balance of points
Rhea-AI Sentiment reads the wording of the document, how positive or negative its language is on a 1 to 5 scale. The balance of points shown with the takes weighs what the document actually discloses, so the two can disagree, for example when a trial that missed its main goal is described in upbeat language.
Rhea-AI Summary
MACOM (NASDAQ:MTSI) announced two new 448G per lane PAM4 drivers—MAOM-025408 Mach-Zehnder Driver and MAOM-022404 EML Driver—available March 17, 2026 to accelerate 1.6T and 3.2T optical transceiver development.
Both drivers deliver >120 GHz RF bandwidth, support silicon photonics, EML and TFLN modulators, are offered as wire-bondable or bumped die for flip-chip and 3D assemblies, and require no external bias components to simplify integration and reduce BOM.
Positive
- Supports >400G per lane transmission for 1.6T and 3.2T transceivers
- RF bandwidth of over 120 GHz for both MAOM-025408 and MAOM-022404
- No external bias components, reducing integration complexity and BOM
- Available as wire-bondable or bumped die enabling flip-chip and 3D assemblies
- Multi-platform support: silicon photonics, EML and TFLN modulators
Negative
- None.
Details
News Market Reaction – MTSI
On Mar 17, the day this news came out, MTSI closed 1.61% below the previous close.
Data tracked by StockTitan Argus for the Mar 17 session.
Key Figures
- Driver data rate
- 448G per lane
- New PAM4 modulator drivers for optical transceivers
- Transceiver capacity
- 1.6T and 3.2T
- Targeted next-generation optical transceiver capacities
- Lane speed
- 400G per lane
- Supported PAM4 transmission per optical lane
- RF bandwidth
- Over 120 GHz
- MAOM-025408 Mach-Zehnder Driver RF bandwidth
- Transmission targets
- 300G and 400G
- PAM4 transmission targets for silicon photonics modulators
- Conference dates
- March 17–19, 2026
- OFC 2026 exhibition for new drivers in Los Angeles
Historical Context
-
Introduced MACD-41804 copper cable driver for 1.6T scale-up connectivity.
-
Announced industry’s first PCIe 7.0 linear equalizers for 128 GT/s copper reach.
-
Detailed OFC 2026 showcase of optical, photonics and copper interconnect solutions.
-
Joined 13-company ACC-MSA to define active copper cable standards for AI/HPC.
-
Reported strong Q1 2026 revenue growth and provided higher Q2 guidance ranges.
24h Move is the share-price change in the day after each event; other market factors may also have contributed.
Key Terms
pam4 technical
mach-zehnder driver technical
flip-chip packaging technical
AI-generated analysis. How Rhea-AI works. Not financial advice.
LOWELL, Mass., March 17, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced the availability of its new 448G PAM4 modulator drivers, designed to accelerate time-to-market for next generation 1.6T and 3.2T optical transceivers. Exceeding 400G per lane transmission enables the development of dense, high performance optical transceivers with industry-leading energy efficiency to support high capacity data networking solutions in artificial intelligence (AI), machine learning (ML) and high performance computing (HPC) data center architectures.
MACOM’s new MAOM-025408 Mach-Zehnder Driver and MAOM-022404 EML Driver are among the first in the industry to support 400G per lane transmission. These drivers use a proven high volume silicon process technology and support multiple optical platforms including silicon photonics, EML (Electro-absorption Modulated Laser) and TFLN (Thin-Film Lithium Niobate) modulators, enabling customers to scale next generation connectivity systems with confidence and reduced integration risk.
“We are excited to push the limits with our new 400G per lane driver products,” said Stephen G. Daly, President and Chief Executive Officer, MACOM. “These products can support a wide range of advanced interconnect applications and form factors.”
The MAOM-025408 Mach-Zehnder Driver can deliver over 120 GHz of RF bandwidth, high gain, output voltage and excellent linearity. It is well-suited for silicon photonics modulators targeting 300G and 400G PAM4 transmission.
The MAOM-022404 EML Driver can deliver over 120 GHz of RF bandwidth, well beyond the minimum required for 400G PAM4 transmission, along with high gain and low power consumption. It is ideal for differential EML and TFLN modulators.
Both the MAOM-025408 and MAOM-022404 are available as wire-bondable die or bumped die used in compact flip-chip packaging, supporting high volume manufacturing with options for side-by-side and 3D assemblies. No external components are required for biasing the drivers, which leads to simpler integration and bill of materials savings for module vendors. The drivers are on display in MACOM’s Booth 1227 at OFC 2026 from March 17 to 19, 2026 in Los Angeles, CA. More information can be found at www.macom.com.
About MACOM
MACOM designs and manufactures semiconductor products for telecommunications, industrial and defense and data center applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.
Company Contact:
MACOM Technology Solutions Inc.
Stephen Ferranti
Senior Vice President, Corporate Development and Investor Relations
P: 978-656-2977
E: stephen.ferranti@macom.com
FAQ
AI-generated questions and answers. How Rhea-AI works. Not financial advice.