MACOM Announces Two New 448G per Lane Drivers for 3.2T Data Center Connectivity

Rhea-AI Summary

MACOM (NASDAQ:MTSI) announced two new 448G per lane PAM4 drivers—MAOM-025408 Mach-Zehnder Driver and MAOM-022404 EML Driver—available March 17, 2026 to accelerate 1.6T and 3.2T optical transceiver development.

Both drivers deliver >120 GHz RF bandwidth, support silicon photonics, EML and TFLN modulators, are offered as wire-bondable or bumped die for flip-chip and 3D assemblies, and require no external bias components to simplify integration and reduce BOM.

Positive

• Supports >400G per lane transmission for 1.6T and 3.2T transceivers
• RF bandwidth of over 120 GHz for both MAOM-025408 and MAOM-022404
• No external bias components, reducing integration complexity and BOM
• Available as wire-bondable or bumped die enabling flip-chip and 3D assemblies
• Multi-platform support: silicon photonics, EML and TFLN modulators

Negative

• None.

Key Figures

Driver data rate: 448G per lane Transceiver capacity: 1.6T and 3.2T Lane speed: 400G per lane +3 more

6 metrics

Driver data rate 448G per lane New PAM4 modulator drivers for optical transceivers

Transceiver capacity 1.6T and 3.2T Targeted next-generation optical transceiver capacities

Lane speed 400G per lane Supported PAM4 transmission per optical lane

RF bandwidth Over 120 GHz MAOM-025408 Mach-Zehnder Driver RF bandwidth

Transmission targets 300G and 400G PAM4 transmission targets for silicon photonics modulators

Conference dates March 17–19, 2026 OFC 2026 exhibition for new drivers in Los Angeles

Market Reality Check

Price: $224.92 Vol: Volume 1,039,551 is sligh...

normal vol

$224.92 Last Close

Volume Volume 1,039,551 is slightly below the 20-day average of 1,165,865, suggesting no unusual trading activity before this announcement. normal

Technical Price at 224.92 is trading above the 200-day MA of 163.21 and about 13.15% below the 52-week high.

Peers on Argus

MTSI gained 3.27% while peers were mixed: TSEM up 3.6%, LSCC up 1.34%, RMBS down...

MTSI gained 3.27% while peers were mixed: TSEM up 3.6%, LSCC up 1.34%, RMBS down 3.49%, CRUS down 0.94%, QRVO flat. This points to a stock-specific move rather than a broad sector rotation.

Common Catalyst Both MACOM and peer TSEM issued AI-related connectivity/power announcements, but only one peer has notable AI news, limiting evidence of a sector-wide AI-driven move.

Historical Context

5 past events · Latest: Mar 16 (Positive)

Pattern 5 events

Date	Event	Sentiment	Move	Catalyst
Mar 16	Product launch	Positive	+4.5%	Introduced MACD-41804 copper cable driver for 1.6T scale-up connectivity.
Mar 12	Product launch	Positive	-3.0%	Announced industry’s first PCIe 7.0 linear equalizers for 128 GT/s copper reach.
Mar 11	Conference showcase	Neutral	+0.9%	Detailed OFC 2026 showcase of optical, photonics and copper interconnect solutions.
Feb 23	Industry consortium	Positive	+0.8%	Joined 13-company ACC-MSA to define active copper cable standards for AI/HPC.
Feb 05	Earnings	Positive	+5.9%	Reported strong Q1 2026 revenue growth and provided higher Q2 guidance ranges.

Pattern Detected

Product and connectivity news has generally seen positive or modestly positive 24h price reactions, with one notable divergence.

Recent Company History

Over the last few months, MACOM has repeatedly highlighted high-speed connectivity innovations, including copper interconnect drivers, PCIe 7.0 linear equalizers, and showcasing solutions at OFC 2026. A February consortium announcement underscored its role in defining active copper cable standards, while fiscal Q1 2026-02-05 earnings showed strong revenue and EPS growth with constructive guidance. Today’s 448G-per-lane optical driver launch fits this ongoing narrative of expanding high-performance data center connectivity offerings.

Market Pulse Summary

This announcement adds new 448G-per-lane PAM4 drivers to MACOM’s portfolio, targeting 1.6T and 3.2T ...

Analysis

This announcement adds new 448G-per-lane PAM4 drivers to MACOM’s portfolio, targeting 1.6T and 3.2T optical transceivers for AI and high-performance data centers. It follows a steady stream of connectivity product news and solid fiscal Q1 2026 results. Investors may watch for design wins, ecosystem adoption across silicon photonics and EML platforms, and how these offerings complement prior PCIe and copper interconnect launches showcased around OFC 2026.

Key Terms

pam4, mach-zehnder driver, flip-chip packaging

3 terms

pam4 technical

"new 448G PAM4 modulator drivers, designed to accelerate time-to-market"

PAM4 is a digital signaling method that sends information by using four distinct voltage or light levels instead of the usual two, letting each transmitted symbol carry two bits of data. Think of it like a radio knob with four clear positions instead of just on/off; it boosts transmission speed without needing extra wires or spectrum but is harder to read reliably, so it matters to investors because it drives demand for higher-performance chips, better cables and optics, and can affect product costs, margins and upgrade cycles in networking and data-center markets.

mach-zehnder driver technical

"MACOM’s new MAOM-025408 Mach-Zehnder Driver and MAOM-022404 EML Driver"

A Mach–Zehnder driver is the electronic circuit that controls a Mach–Zehnder optical modulator, which uses tiny changes in light to encode data for fiber‑optic communications. Think of it as a precise light dimmer that switches patterns on a glass cable so information can travel quickly and reliably. Investors care because this component affects the speed, power use, and cost of high‑speed networks and photonics products, influencing demand and profit margins in related businesses.

flip-chip packaging technical

"bumped die used in compact flip-chip packaging, supporting high volume"

Flip-chip packaging is a way of attaching a tiny silicon chip to its supporting board by placing the chip face-down so its electrical pads make direct contact with the board through tiny metal bumps. This creates shorter electrical paths and better heat flow than older methods, improving speed, power efficiency and size for electronic products. Investors care because it can lower manufacturing costs, boost performance of finished devices and affect supply, margins and competitiveness in semiconductor-linked businesses.

AI-generated analysis. Not financial advice.

LOWELL, Mass., March 17, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced the availability of its new 448G PAM4 modulator drivers, designed to accelerate time-to-market for next generation 1.6T and 3.2T optical transceivers. Exceeding 400G per lane transmission enables the development of dense, high performance optical transceivers with industry-leading energy efficiency to support high capacity data networking solutions in artificial intelligence (AI), machine learning (ML) and high performance computing (HPC) data center architectures.

MACOM’s new MAOM-025408 Mach-Zehnder Driver and MAOM-022404 EML Driver are among the first in the industry to support 400G per lane transmission. These drivers use a proven high volume silicon process technology and support multiple optical platforms including silicon photonics, EML (Electro-absorption Modulated Laser) and TFLN (Thin-Film Lithium Niobate) modulators, enabling customers to scale next generation connectivity systems with confidence and reduced integration risk.

“We are excited to push the limits with our new 400G per lane driver products,” said Stephen G. Daly, President and Chief Executive Officer, MACOM. “These products can support a wide range of advanced interconnect applications and form factors.”

The MAOM-025408 Mach-Zehnder Driver can deliver over 120 GHz of RF bandwidth, high gain, output voltage and excellent linearity. It is well-suited for silicon photonics modulators targeting 300G and 400G PAM4 transmission.

The MAOM-022404 EML Driver can deliver over 120 GHz of RF bandwidth, well beyond the minimum required for 400G PAM4 transmission, along with high gain and low power consumption. It is ideal for differential EML and TFLN modulators.

Both the MAOM-025408 and MAOM-022404 are available as wire-bondable die or bumped die used in compact flip-chip packaging, supporting high volume manufacturing with options for side-by-side and 3D assemblies. No external components are required for biasing the drivers, which leads to simpler integration and bill of materials savings for module vendors. The drivers are on display in MACOM’s Booth 1227 at OFC 2026 from March 17 to 19, 2026 in Los Angeles, CA. More information can be found at www.macom.com.

About MACOM
MACOM designs and manufactures semiconductor products for telecommunications, industrial and defense and data center applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

Company Contact:
MACOM Technology Solutions Inc.
Stephen Ferranti
Senior Vice President, Corporate Development and Investor Relations
P: 978-656-2977
E: stephen.ferranti@macom.com

FAQ

What did MACOM (MTSI) announce on March 17, 2026 about 448G drivers?

MACOM announced two new 448G per lane PAM4 drivers (MAOM-025408 and MAOM-022404) to speed 1.6T and 3.2T transceiver development. According to the company, both drivers offer >120 GHz RF bandwidth and multi-platform modulator support.

How do MACOM's MAOM-025408 and MAOM-022404 drivers improve integration for module vendors (MTSI)?

They require no external bias components, simplifying integration and lowering BOM. According to the company, availability as wire-bondable or bumped die supports compact flip-chip and 3D module assemblies.

Which optical platforms do MACOM's new drivers support and why does that matter for MTSI customers?

The drivers support silicon photonics, EML, and TFLN modulators, enabling flexible platform choices. According to the company, this reduces integration risk for customers building 300G–400G PAM4 transceivers.

What bandwidth and performance do the MAOM-025408 and MAOM-022404 deliver for MTSI products?

Both drivers deliver over 120 GHz of RF bandwidth, high gain and low power characteristics. According to the company, this exceeds minimum needs for 400G PAM4 transmission and supports high-linerate designs.

Are MACOM's new drivers available for high-volume manufacturing and when were they unveiled (MTSI)?

Yes, the drivers are offered as wire-bondable die or bumped die for flip-chip manufacturing. According to the company, they were announced and displayed at OFC on March 17, 2026, supporting high-volume assembly options.

What applications do MACOM (MTSI) target with the new 448G per lane drivers?

The drivers target AI, ML and HPC data center connectivity, enabling dense, energy-efficient 1.6T and 3.2T transceivers. According to the company, the products aim to accelerate time-to-market for next-generation optical interconnects.