MACOM to Showcase Innovative Connectivity Solutions at OFC 2026
MACOM (NASDAQ:MTSI) will exhibit at OFC 2026, March 17–19, 2026 at the Los Angeles Convention Center, Booth 1227.
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Rhea-AI Summary
MACOM (NASDAQ:MTSI) will exhibit at OFC 2026, March 17–19, 2026 at the Los Angeles Convention Center, Booth 1227. The company will demonstrate photonics, optoelectronic and copper interconnect solutions including 3.2T optical transmit, 1.6T ecosystems, PCIe 6.0/7.0 interconnects, 800G LR2 coherent lite modules, CW lasers, onboard equalization, and optical components.
MACOM technical staff will be on-site to discuss system architectures, application requirements and roadmap alignment; meeting scheduling information is available via the company website.
Details
News Market Reaction – MTSI
On Mar 11, the day this news came out, MTSI closed 0.89% above the previous close.
Data tracked by StockTitan Argus for the Mar 11 session.
Key Figures
- Current price
- $220.59
- Pre-news trading level for MTSI
- 52-week high
- $258.98
- Upper end of 52-week trading range
- 52-week low
- $84
- Lower end of 52-week trading range
- 3.2 Terabit solution
- 3.2 Terabit
- Optical transmit solution preview at OFC 2026
- 400G per lane
- 400 Gbps per lane
- PAM transmission over single mode fiber demo
- 1.6 Terabit links
- 1.6 Terabit
- Live ecosystem demo for 1.6T links with 200G lanes
- 800G LR2 module rate
- 800 Gbps
- Module-to-module coherent-lite data transmission demo
- CW laser power levels
- 75 mW and 100 mW
- CW laser technology for 800G and 1.6T modules
Historical Context
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Launch of ACC-MSA consortium with major networking and semiconductor partners.
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Strong Q1 2026 revenue growth and positive Q2 guidance with higher EPS outlook.
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Promotions to senior vice president roles to support strategy and technology.
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Announcement of Q1 2026 earnings release date and conference call details.
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Appointment of experienced semiconductor executive Bryan Ingram to board.
24h Move is the share-price change in the day after each event; other market factors may also have contributed.
Key Terms
pulse amplitude modulation (pam) technical
single mode fiber (smf) technical
active copper cable (acc) technical
linear pluggable optics (lpo) technical
pcie 6.0 technical
pcie 7.0 technical
lidar technical
AI-generated analysis. How Rhea-AI works. Not financial advice.
LOWELL, Mass., March 11, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, will participate in OFC 2026, taking place March 17–19, 2026 at the Los Angeles Convention Center. MACOM will exhibit at Booth 1227, showcasing a broad portfolio of advanced photonics, optoelectronic and copper interconnect solutions supporting AI scale-up and scale-out architectures, cloud infrastructure and access networks.
Demonstrations at Booth 1227 will include:
- 3.2 Terabit Optical Transmit Solutions: Preview MACOM’s capabilities to support next generation 400G per lane Pulse Amplitude Modulation (PAM) transmission over single mode fiber (SMF).
- 1.6 Terabit Solutions: Experience MACOM’s comprehensive 200G per lane ecosystem in a live demo consisting of retimed optics, low power Active Copper Cable (ACC) and Linear Pluggable Optics (LPO) solutions supporting 1.6T links, featuring leading module and cable manufacturers, in a 102.4T switch ecosystem.
- PCIe 6.0 and 7.0 Solutions: Learn how MACOM’s portfolio of copper and optical PCIe solutions can help to support higher data throughput and lower latency in longer reach applications.
- 800G LR2 Module: Showing MACOM’s latest generation, ultra-low power Coherent Lite solutions for campus and scale across applications. This demonstration will feature module to module data transmission using high performance transceivers from leading vendors supporting data rate of 800 Gbps.
- Continuous Wave (CW) Laser for 800 Gigabit and 1.6 Terabit Modules: Learn about MACOM’s latest advancements in 75 mW and 100 mW CW laser technology in an 800G OSFP 2xFR4 demonstration.
- Onboard Equalization: Discover how onboard equalizers can help high-speed signals compensate for lossy PCB to improve signal integrity (SI) for 200G per lane and beyond data rates. OBE can help compensate for signal reflections, dielectric loss, and skin effect loss to extend trace reach and density in data center and HPC applications.
- Optical Components: Explore a wide range of optical components for outside of the data center, including fronthaul, LiDAR for automotive and robotics applications.
MACOM technical staff will be available throughout OFC 2026 to discuss application requirements, system architectures and roadmap alignment. For more information or to schedule a meeting during OFC 2026, visit https://www.macom.com.
OFC 2026 Information:
| Venue: | Los Angeles Convention Center, Los Angeles, California |
| Date/Time: | Tuesday, March 17: 10:00 a.m. to 5:00 p.m. Wednesday, March 18: 10:00 a.m. to 5:00 p.m. Thursday, March 19: 10:00 a.m. to 4:00 p.m. |
About MACOM
MACOM designs and manufactures semiconductor products for telecommunications, industrial and defense and data center applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.
Company Contact:
MACOM Technology Solutions Inc.
Stephen Ferranti
Senior Vice President, Corporate Development and Investor Relations
P: 978-656-2977
E: stephen.ferranti@macom.com
FAQ
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