MACOM Enables High Density Copper Interconnects for Next Generation Scale-Up Connectivity

MACOM (NASDAQ:MTSI) announced availability of the MACD-41804 Cable Driver with Equalizer, a low-power, high-density copper connectivity solution for scale-up applications.

Rhea-AI Summary

MACOM (NASDAQ:MTSI) announced availability of the MACD-41804 Cable Driver with Equalizer, a low-power, high-density copper connectivity solution for scale-up applications.

The device integrates input equalization, broad dynamic range, optional gain adaptation and mission-mode diagnostics, supports 1.6T OSFP form factors, and is available in bumped die flip-chip packaging. MACOM will demonstrate it at OFC 2026 in Los Angeles, March 17–19, 2026.

Argus Mar 16 session

+3.27% close to close Open Argus

Details

News Market Reaction – MTSI

On Mar 16, the day this news came out, MTSI closed 3.27% above the previous close.

Data tracked by StockTitan Argus for the Mar 16 session.

Market Context

This announcement introduces MACOM’s MACD-41804 cable driver with equalizer, aimed at low-power, hig...

Analysis

This announcement introduces MACOM’s MACD-41804 cable driver with equalizer, aimed at low-power, high-density copper links for next-generation scale-up architectures, including 1.6T OSFP form factors. It follows recent PCIe 7.0 product and standards activity and will be showcased at OFC 2026 from March 17–19, 2026. Investors may watch for customer adoption, design wins, and how the broader connectivity portfolio supports long-term revenue and margin trends.

Key Figures

Target form factor: 1.6T OSFP Exhibit booth: Booth 1227 Conference dates: March 17–19, 2026

Target form factor

1.6T OSFP

Form factor targeted by the MACD-41804 cable driver

Exhibit booth

Booth 1227

Location of MACOM’s OFC 2026 demonstration

Conference dates

March 17–19, 2026

OFC 2026 event where the solution will be demonstrated

Historical Context

5 past events · Latest: Mar 12

5 events

1. Mar 12

   Connectivity product launch

   24h Move

   -3.0%

   Introduced PCIe 7.0 linear equalizers extending passive copper cable reach at 128 GT/s.

2. Mar 11

   Conference showcase

   24h Move

   +0.9%

   Announced OFC 2026 demos across photonics, copper interconnects and 1.6T ecosystems.

3. Feb 23

   Industry consortium

   24h Move

   +0.8%

   Joined 13-company ACC-MSA to define active copper cable standards for AI interconnects.

4. Feb 05

   Q1 2026 earnings

   24h Move

   +5.9%

   Reported revenue growth with strong GAAP and adjusted EPS plus higher Q2 guidance.

5. Jan 26

   Leadership promotions

   24h Move

   -0.2%

   Promoted two senior leaders to support strategic initiatives and advanced GaN technology.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

retimed architectures, gain adaptation, mission mode diagnostics, flip-chip packaging

4 terms

retimed architectures technical

"presents a compelling alternative to retimed architectures, offering significant advantages"

Retimed architectures are designs—often for electronic chips or systems—where the placement and timing of internal checkpoints (like small memory or control points) are rearranged to improve speed, power use, or reliability without changing overall function. For investors, retiming signals engineering work to make products faster, more efficient, or cheaper to produce, which can reduce development risk, lower costs, or speed time-to-market much like optimizing traffic lights to smooth rush-hour flow.

gain adaptation technical

"integrates input equalization, broad dynamic range, optional gain adaptation and mission"

Gain adaptation is a device feature—common in hearing aids and other audio or sensory medical equipment—that automatically changes amplification levels over time or in different environments so sounds remain comfortable and clear. Think of it like a camera that adjusts brightness as lighting changes; for investors, it matters because reliable gain adaptation improves user satisfaction, reduces returns and complaints, and can influence regulatory approval, competitive positioning, and long-term product adoption.

mission mode diagnostics technical

"broad dynamic range, optional gain adaptation and mission mode diagnostics."

Mission mode diagnostics are medical tests developed and rolled out under an urgent, high-priority program—think of a factory switching to produce emergency supplies after a disaster. For investors, the label signals fast-tracked approval, large-scale manufacturing and likely government support or contracts, but also higher operational and regulatory risk as speed can trade off against long-term validation and market sustainability.

flip-chip packaging technical

"available in bumped die used in compact flip-chip packaging, supporting high volume"

Flip-chip packaging is a way of attaching a tiny silicon chip to its supporting board by placing the chip face-down so its electrical pads make direct contact with the board through tiny metal bumps. This creates shorter electrical paths and better heat flow than older methods, improving speed, power efficiency and size for electronic products. Investors care because it can lower manufacturing costs, boost performance of finished devices and affect supply, margins and competitiveness in semiconductor-linked businesses.

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LOWELL, Mass., March 16, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced the availability of its latest copper connectivity solution – the MACD-41804 Cable Driver with Equalizer, designed to enable low power, high density copper interconnects for next generation scale-up applications. MACOM’s line of cable drivers and equalizers presents a compelling alternative to retimed architectures, offering significant advantages, including lower power consumption, reduced latency and lower overall system costs.

The latest addition to the product line, the MACD-41804 Cable Driver with Equalizer, complements MACOM’s existing portfolio of multi-channel equalizer devices and offers next generation performance and flexibility.

“MACOM is focused on delivering differentiated connectivity solutions that enable high performance scale-up architectures,” said Stephen G. Daly, President and Chief Executive Officer, MACOM. “Our new cable driver solution can enable customers to increase data transmission throughput while maintaining the benefits of copper, which include lower power and cost as compared to optics.”  

The MACD-41804 integrates input equalization, broad dynamic range, optional gain adaptation and mission mode diagnostics. The MACD-41804 is tailored for cost and power efficient links across a variety of form factors including 1.6T OSFP. The addition of gain adaptation and associated diagnostics features provides users with enhanced link capabilities as well as monitoring feedback, translating to power and cost-efficient copper connectivity. It is available in bumped die used in compact flip-chip packaging, supporting high volume manufacturing. MACOM will demonstrate this solution at Booth 1227 at OFC 2026 in Los Angeles, CA from March 17 to 19, 2026. For more information, visit www.macom.com.

About MACOM
MACOM designs and manufactures semiconductor products for telecommunications, industrial and defense and data center applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

Company Contact:
MACOM Technology Solutions Inc.
Stephen Ferranti
Senior Vice President, Corporate Development and Investor Relations
P: 978-656-2977
E: stephen.ferranti@macom.com

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What is the MACD-41804 announced by MACOM (MTSI) on March 16, 2026?

The MACD-41804 is a cable driver with equalizer for low-power, high-density copper interconnects. According to MACOM, it integrates input equalization, optional gain adaptation and diagnostics to support cost- and power-efficient scale-up links.

How does the MACD-41804 from MACOM (MTSI) compare to retimed architectures?

MACOM positions the MACD-41804 as a lower-power, lower-latency and lower-cost alternative to retimed architectures. According to MACOM, the device preserves copper benefits while increasing data throughput for scale-up systems.

Which form factors and packaging does MACOM (MTSI) state the MACD-41804 supports?

The MACD-41804 is tailored for various form factors, including 1.6T OSFP, and is available as a bumped die in compact flip-chip packaging. According to MACOM, this supports high-volume manufacturing and compact implementations.

What diagnostic and adaptability features does MACOM (MTSI) say are included in the MACD-41804?

The MACD-41804 includes mission-mode diagnostics and optional gain adaptation for enhanced link capabilities and monitoring feedback. According to MACOM, these features enable improved link management and power-cost efficiency.

When and where will MACOM (MTSI) demonstrate the MACD-41804 product?

MACOM will demonstrate the MACD-41804 at OFC 2026 in Los Angeles from March 17 to March 19, 2026. According to MACOM, the product will be shown at Booth 1227 during the conference.